category: Low Power-High Performance

category: IoT, Security & Automotive

Research Bits: Mar. 10
By Jesse Allen - 10 Mar, 2025 - Comments: 0

Incipient ferroelectricity Researchers from Penn State University and the University of Minnesota propose harnessing incipient ferroelectricity in multifunctional two-dimensional FETs to create neuromorphic computer memory. Materials with incipient ferroelectricity have no stable ferroelectric order at room temperature and need certain conditions to achieve an electrical charge. The FETs were ... » read more

Research Bits: Mar. 4
By Jesse Allen - 04 Mar, 2025 - Comments: 0

Fiber computer Researchers from Massachusetts Institute of Technology (MIT), Rhode Island School of Design, and Brown University developed a programmable elastic fiber computer that could be woven into clothing to monitor health conditions and physical activity. Clothing created using the fiber computer was reported as comfortable and machine washable. The single elastic fiber computer cont... » read more

What Scares Chip Engineers About Generative AI
By Adam Kovac - 26 Feb, 2025 - Comments: 0

Experts At The Table: LLMs and other generative AI programs are a long way away from being able to design entire chips on their own from scratch, but the emergence of the tech has still raised some genuine concerns. Semiconductor Engineering sat down with a panel of experts, which included Rod Metcalfe, product management group director at Cadence; Syrus Ziai, vice-president of engineering at E... » read more

Research Bits: Feb. 25
By Jesse Allen - 25 Feb, 2025 - Comments: 0

Recording synaptic connections Researchers from Harvard University built a silicon chip capable of recording synaptic signals from a large number of neurons and used it to catalogue more than 70,000 synaptic connections from about 2,000 rat neurons. They hope the device is a step in creating a detailed synaptic connection map of the brain. The chip contains an array of 4,096 microhole elect... » read more

Research Bits: Feb. 18
By Jesse Allen - 18 Feb, 2025 - Comments: 0

Predicting band gap with neural networks Researchers from Kyoto University developed a machine learning model to predict the band gap of novel semiconductor materials. Using data from almost 2,000 semiconductor materials, the team tested six different neural networks. They found that the incorporation of conditional generative adversarial networks (CGAN) and message passing neural networks ... » read more

Controlling Leakage Power
By Matthew Hogan - 17 Feb, 2025 - Comments: 0

IC designers face a significant challenge in managing leakage power - a phenomenon that can profoundly impact your device's power, performance, area (PPA), and overall reliability. Leakage can occur in various ways, from parasitic leakage to analog gate leakage or digital gate leakage, and you must address these issues with great care, as even subtle circuit changes can lead to reliability prob... » read more

Vision Language Models Come Rushing In
By Steve Roddy - 17 Feb, 2025 - Comments: 0

Just when you thought the pace of change of AI models couldn’t get any faster, it accelerates yet again. In the popular news media, the introduction of DeepSeek in January 2025 created a moment that captured headlines in every newspaper and website heralding comparisons to the Sputnik moment of 1957. But rapid change is also happening in many quarters that are hidden from view of the Chat-App... » read more

Optimizing Data Center TCO With CXL And Compression
By Raj Uppala - 13 Feb, 2025 - Comments: 0

In the ever-evolving landscape of data centers, Total Cost of Ownership (TCO) remains a critical metric. It encompasses all costs associated with data center infrastructure throughout its lifecycle, including initial purchase, installation, utilization, maintenance, energy consumption, and eventual replacement. By understanding and optimizing TCO, hyperscalers can make informed decisions that e... » read more

Signal Integrity Plays Increasingly Critical Role In Chiplet Design
By Ann Mutschler - 13 Feb, 2025 - Comments: 1

Maintaining the quality and reliability of electrical signals as they travel through interconnects is proving to be much more challenging with chiplets and advanced packaging than in monolithic SoCs and PCBs. Signal integrity is a fundamental requirement for all chips and systems, but it becomes more difficult with chiplets due to reflections, loss, crosstalk, process variation, and various ... » read more

How SPDM Can Drive Digital Transformation
By Maura Callahan - 13 Feb, 2025 - Comments: 0

While simulation has proven to help companies develop better products faster and more efficiently, it also produces copious amounts of data. Simulation process data management (SPDM) solutions further accelerate and improve the approach to product development and serve as the cornerstone for implementing and optimizing the digital thread in modern product development. Ansys subject matter ex... » read more

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