category: Low Power-High Performance

category: IoT, Security & Automotive

Which Data Works Best For Voltage Droop Simulation
By Ann Mutschler - 15 Jan, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about the need for the right type of data, why this has to be done early in the design flow, and how 3D-IC will affect all of this, with Bill Mullen, distinguished engineer at Ansys; Rajat Chaudhry, product management group director at Cadence; Heidi Barnes, senior applications engineer at Keysight; Venkatesh Santhanagopalan, prod... » read more

Chip Industry Silos Are Crimping Advances
By Brian Bailey - 11 Jan, 2024 - Comments: 0

Change is never easy, but it is more difficult when it involves organizational restructuring. The pace of such restructuring has been increasing over the past decade, and often it is more difficult to incorporate than technological advancements. This is due to the siloed nature of the semiconductor industry, both within the industry itself, and its relationship to surrounding industries. Inc... » read more

Is Transformer Fever Fading?
By Steve Roddy - 11 Jan, 2024 - Comments: 0

The hottest, buzziest thing bursts onto the scene and captures the attention of the business press and even the general public. Scads of articles and videos are published about The Hot Thing. And then, in the blink of an eye, the world’s attention shifts to the Next New Thing! Are we talking about the latest pop song that leads the Spotify streaming charts? Perhaps a new fashion trend that... » read more

How Can You Use ChatGPT For Software Testing?
By Jenn Mullen - 11 Jan, 2024 - Comments: 0

All eyes have been on OpenAI and its brainchild ChatGPT in recent months. ChatGPT’s ability to understand and respond to complex instructions and deliver detailed responses to user prompts has led to an explosive rise in its popularity with the public. If you were to search online for “ChatGPT tips,” you can find content to help you use the tool to tailor resumes to job postings, create... » read more

Glitch Power Issues Grow At Advanced Nodes
By Ann Mutschler - 11 Jan, 2024 - Comments: 0

An estimated 20% to 40% of total power is being wasted due to glitch in some of the most advanced and complex chip designs, and at this point there is no single best approach for how and when to address it, and mixed information about how effective those solutions can be. Glitch power is not a new phenomenon. DSP architects and design engineers are well-versed in the power wasted by long, sl... » read more

The Future Of Memory
By Karen Heyman - 11 Jan, 2024 - Comments: 1

Experts at the Table: Semiconductor Engineering sat down to talk about the impact of off-chip memory on power and heat, and what can be done to optimize performance, with Frank Ferro, group director, product management at Cadence; Steven Woo, fellow and distinguished inventor at Rambus; Jongsin Yun, memory technologist at Siemens EDA; Randy White, memory solutions program manager at Keysight; a... » read more

Scaling Server Memory Performance To Meet The Demands Of AI
By Tim Messegee - 11 Jan, 2024 - Comments: 0

AI, whether we’re talking about the number of parameters used in training or the size of large language models (LLMs), continues to grow at a breathtaking rate. For over a decade, we’ve witnessed a 10X per year scaling. It’s a growth rate that puts pressure on every aspect of the computing stack: processing, memory, networking, you name it. The platform vendors are responding to the in... » read more

SoC Telemetry & Performance Analysis Using Statistical Profiling Extension
By Brian Jeff - 11 Jan, 2024 - Comments: 0

The Arm Statistical Profiling Extension (SPE) is an architectural feature designed for enhanced instruction execution profiling within Arm CPUs. This feature has been available since the introduction of the Neoverse N1 CPU platform in 2019, along with performance monitor units (PMUs) generally available in Arm CPUs. An important step in extracting value from capabilities like SPE and PMUs is th... » read more

Multi-Chiplet Marvels: Exploring Chip-Centric Thermal Analysis
By Louis Tsai - 11 Jan, 2024 - Comments: 0

The relationship between power consumption and thermal dynamics for chips is intricate. As power is consumed during the operation of a chip, it results in the generation of heat. This heat may dissipate from the device, metal routing, or the die itself, leading to increased temperatures on the chip. The dissipation process perpetually expends redundant energy, thereby compromising on the overal... » read more

Exploring The Facets Of Stray Light With Simulation
By Tobias Lauinger - 11 Jan, 2024 - Comments: 0

Seems like everywhere you look, there’s someone snapping a memorable group photo or perfect selfie with their phones. As the line between traditional and cellphone cameras continues to blur, manufacturers of these handheld devices are pressed to find the best combination of software and hardware to achieve image quality that was previously unthinkable. Of course, mobile photography has com... » read more

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