category: Low Power-High Performance

category: Auto, Security & Edge AI

Shift Left Is The Tip Of The Iceberg
By Brian Bailey - 14 Nov, 2024 - Comments: 1

Shift left is evolving from a buzzword into a much broader shift in design methodology and EDA tooling, and while it's still early innings there is widespread agreement that it will be transformative. The semiconductor industry has gone through many changes over the past few decades. Some are obvious, but others happen because of a convergence of multiple factors that require systemic change... » read more

Accelerating Verification Of Computational Storage Designs Using Avery NVMe Verification IP
By Siemens EDA - 14 Nov, 2024 - Comments: 0

Computational storage is an emerging paradigm that integrates processing capabilities directly within storage devices. This paper outlines how this approach addresses the limitations of traditional NVM Express (NVMe) SSDs and the performance characteristics of the newly introduced compute and subsystem local memory (SLM) namespaces. The paper also focuses on the verification framework provided ... » read more

New AI Data Types Emerge
By Bryon Moyer - 14 Nov, 2024 - Comments: 0

AI is all about data, and the representation of the data matters strongly. But after focusing primarily on 8-bit integers and 32‑bit floating-point numbers, the industry is now looking at new formats. There is no single best type for every situation, because the choice depends on the type of AI model, whether accuracy, performance, or power is prioritized, and where the computing happens, ... » read more

Powering Mechanical Simulations: AMD Vs. Intel
By Wim Slagter - 14 Nov, 2024 - Comments: 0

When selecting the right central processing unit (CPU) for optimizing Ansys Mechanical structural finite element analysis (FEA) software performance, there are two major players to consider: Intel and AMD. Both have made significant advancements in recent years, but choosing between them depends on several factors that directly affect simulation speeds, scalability, and overall performance fo... » read more

A Comprehensive Guide to Understanding AI Inference on the CPU
By Arm - 13 Nov, 2024 - Comments: 0

As AI continues to revolutionize industries, new workloads, like generative AI, inspire new use cases, the demand for efficient and scalable AI-based solutions has never been greater. While training often garners attention, inference—the process of applying trained models to new data—is essential for AI workloads, whether they are running in the cloud, or enabling real-world applications at... » read more

How to Accelerate Multiphysics Simulation Software with Turnkey Hardware Systems
By Ansys - 13 Nov, 2024 - Comments: 0

Complicated problems take longer to solve. In engineering, it’s a given that simulation drastically accelerates the development cycle, enabling engineers to digitally test ideas and optimize products exponentially faster than physical testing. However, today’s complex products and systems require simulation of many different physics—the thermal, structural, and electromagnetic forces in a... » read more

Chiplets for Future Automotive Application
By Fraunhofer IIS/EAS - 13 Nov, 2024 - Comments: 0

Abstract Autonomous vehicles and associated ADAS systems are driving vehicle electronics content to unprecedented levels. These systems require significant processing power via a centralized system. Chiplets are one solution to distribute functionality on different technologies and can help to secure the supply chain and reduce rising development costs in advanced IC nodes. This traditionally ... » read more

Innovate Faster with A Multi-Die Solution
By Synopsys - 13 Nov, 2024 - Comments: 0

The semiconductor industry is experiencing a monumental shift in chip design, driven by the dramatic increase in AI compute performance requirements and limitations of Moore’s Law. The industry is adopting multi-die designs, which is the heterogeneous or homogeneous integration of dies (also called chiplets) in a single package. While multi-die design is the solution, it also introduces se... » read more

Research Bits: Nov. 11
By Jesse Allen - 11 Nov, 2024 - Comments: 0

Quantum tunneling transistor Researchers from MIT and University of Udine fabricated a transistor that uses ultrathin layers of gallium antimonide and indium arsenide arranged in vertical nanowire heterostructures with a diameter of 6nm. The quantum tunneling effects of the material enable it to simultaneously achieve low-voltage operation and high performance. “This is a technology with ... » read more

Big Changes Ahead For Analog Design
By Ed Sperling - 06 Nov, 2024 - Comments: 1

Experts at the Table: Semiconductor Engineering sat down to discuss the impact of heterogeneous integration on in-house analog tools, and how that is changing the design process, with Mo Faisal, president and CEO of Movellus; Hany Elhak, executive director of product management at Synopsys; Cedric Pujol, product manager at Keysight; and Pradeep Thiagarajan, principal product manager for custom ... » read more

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