category: Low Power-High Performance

category: IoT, Security & Automotive

3D-IC For The Masses
By Brian Bailey - 13 Mar, 2025 - Comments: 1

The concepts of 3D-IC and chiplets have the whole industry excited. It potentially marks the next stage in the evolution of the IP industry, but so far, technical difficulties and cost have curtailed its usage to just a handful of companies. Even within those, they do not appear to be seeing benefits from heterogeneous integration or reuse. Attempts to make this happen are not new. "A decade... » read more

The Importance Of Safety Analysis In Automotive Systems Engineering
By Ka-lip Chu - 13 Mar, 2025 - Comments: 0

Over the years, automotive safety has maintained a top spot in the minds of original equipment manufacturers (OEMs). Self-driving vehicles, advanced driver assistance systems (ADAS), and AI-driven innovations designed to further protect us on the road are rapidly evolving. It’s been an exciting journey but not without some hiccups for automotive manufacturers along the way. For instance, a... » read more

Chiplets Add New Power Issues
By Ann Mutschler - 13 Mar, 2025 - Comments: 0

Delivering and managing power are becoming key challenges in the rollout of chiplets, adding significantly to design complexity and forcing chipmakers to weigh tradeoffs that can have a big impact on the performance, reliability, and the overall cost of semiconductors. Power is a concern for every chip and chiplet design, even if the specifics differ based on the application. Systems vendors... » read more

Physics Simulation With Graph Neural Networks Targeting Mobile
By Máté Stodulka - 13 Mar, 2025 - Comments: 0

By Máté Stodulka and Tomas Zilhao Borges The demand for immersive, realistic graphics in mobile gaming and AR or VR is pushing the limits of mobile hardware. Achieving lifelike simulations of fluids, cloth, and other materials historically requires intensive mathematical computations. While these traditional methods yield highly accurate results, they have been too resource-heavy to run re... » read more

No Fooling With Voxel Pooling
By Steve Roddy - 13 Mar, 2025 - Comments: 0

A variety of new and complicated transformer models have emerged in the past 18 to 24 months as new “must have” networks in advanced automotive use cases. These novel architectures often introduce new network operators or novel ways of combining tensors – often from different types of sensors – in ways to enhance detection and recognition of objects in L3 / L4 / L5 ADAS and autonomous d... » read more

Integrating Data From Design, Manufacturing, And The Field
By Adam Kovac - 13 Mar, 2025 - Comments: 0

Chip design is starting to include more options to ensure chips behave reliably in the field, boosting the ability to tweak both hardware and software as chips age. The basic problem is that as dimensions become smaller, and as more features are added into devices — especially with heterogeneous assemblies of chiplets running some type of AI — the potential for thermally induced structur... » read more

New Innovative Way To Functionally Verify Heterogeneous 2D/3D Package Connectivity
By Siemens EDA - 12 Mar, 2025 - Comments: 0

Historically, IC package design has been a relatively simple task which allowed the die bumps to be fanned out to a geometry suitable for connecting to a printed circuit board. The package netlist was often captured by the package designer, typically using Excel to manually assign net names to the desired die bumps and BGA balls to achieve the intended connection. Modern package and interpos... » read more

Silicon Reimagined: New Foundations For The Age of AI
By Arm - 12 Mar, 2025 - Comments: 0

The semiconductor industry is undergoing a pivotal transformation driven by the rise of artificial intelligence (AI) and the slowing of traditional Moore’s Law scaling.  In this comprehensive 42 page report, several key trends shaping the industry’s future are highlighted. The push toward more specialized architectures tailored for specific workloads, particularly in AI. The critic... » read more

Application Of External CFD Modeling In Data Center Design
By Cadence - 12 Mar, 2025 - Comments: 0

Rising IT densities and AI workloads demand smarter heat management and equipment placement. This paper "Application of External CFD Modeling in Data Center Design" explores how external computational fluid dynamics (CFD) modeling provides crucial insights by resolving airflow patterns around buildings. Why Choose External CFD Modeling? Recommended by The Green Grid, it helps predict: ... » read more

Unlocking Generative AI On The Edge Across The Semiconductor Value Chain
By Expedera - 12 Mar, 2025 - Comments: 0

In the second of a three-part series, Expedera, in conjunction with the Global Semiconductor Alliance’s Emerging Technologies (EmTech) group, explores “Unlocking Generative AI on the Edge across the Semiconductor Value Chain”. Included in this white paper is an examination of how members of the value chain (including IP providers, EDA vendors, fabless chip makers, foundries, OSATs, OEMs, ... » read more

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