category: Low Power-High Performance

category: IoT, Security & Automotive

Symmetric Multiprocessing (SMP) RTOS On Xtensa Multicore
By Nayan Gaywala - 13 Feb, 2025 - Comments: 0

An increasing number of multi-threaded embedded applications want to leverage multicore designs. Symmetric Multiprocessing (SMP) RTOS provides automatic load balancing of multiple threads in a multicore environment. Also, numerous legacy multi-threaded embedded applications are deployed on a single-core RTOS that customers want to move to a multicore environment. For these reasons, application ... » read more

Beyond Simulation: Transforming Early IC Design With Insight Analyzer
By Siemens EDA - 13 Feb, 2025 - Comments: 0

Traditional verification methods are proving inadequate for addressing critical reliability challenges in today's increasingly complex integrated circuit (IC) designs. Modern IC design requires a proactive approach to verification that emphasizes early-stage analysis. The shift-left methodology enables earlier identification of potential design risks, addressing the complex challenges of IP blo... » read more

Building Vision-Enabled Devices To Capture The Emerging Wave In IoT
By Diya Soubra - 13 Feb, 2025 - Comments: 0

The evolution of vision (the eye) is considered one of the most significant events in the history of life on Earth. 540 million years ago, during the Cambrian period, there was a sudden burst of evolutionary activity that resulted in the appearance of a variety of new species. Many of these species were characterized by the development of an eye which allowed them to perceive and interact with ... » read more

What Exactly Is Multi-Physics?
By Brian Bailey - 13 Feb, 2025 - Comments: 1

Multi-physics is the new buzzword in semiconductor design and analysis, but the fuzziness of the term is a reflection of just how many new and existing problems need to be addressed simultaneously in the design flow with advanced nodes and packaging. This disaggregation of planar SoCs and the inclusion of more processing elements, memories, interconnects, and passives inside a package has cr... » read more

The Impact of Generative AI on the Edge for the Semiconductor Industry
By Expedera - 12 Feb, 2025 - Comments: 0

In the first of a three-part series, Expedera, in conjunction with the Global Semiconductor Alliance’s Emerging Technologies (EmTech) group, explores “The Impact of Generative AI on the Edge for the Semiconductor Industry”. In this white paper, the working group explores the evolution of Generative AI (GenAI), and how the rapidly evolving semiconductor industry can enable GenAI innovation... » read more

Designing Optimized Software Stacks for Autonomous Systems in Aerospace and Defense
By Ansys - 12 Feb, 2025 - Comments: 0

As autonomous systems percolate through the A&D industry with ever-increasing complexity, the software they use to function must match the current pace of innovation. Achieving this goal will require optimizing the software stacks and fully integrating them into internal and external systems. Want to learn more about autonomous software? In this e-book, you'll: Learn about the softw... » read more

Data Center Solutions: Reducing the Risk of Change
By Cadence - 12 Feb, 2025 - Comments: 0

A panel of thermal and operational experts discuss the evolving challenges in the data center industry and the tools they’re using to overcome them. This eBook details the panel insights, which cover new applications, evolving thermal requirements, innovative cooling technology, and more. Download the eBook for a snapshot of how data center professionals are overcoming the current changes ... » read more

Why HPC Chip Designers Are Looking Into Linear Pluggable Optics
By Synopsys - 12 Feb, 2025 - Comments: 0

This paper delves into the technical complexities and emerging trends in integrating linear pluggable optics within AI chip design. The rapid growth of hyperscale data centers, driven by the demands of LLMs and transformative AI applications, requires innovative solutions optimized for power, latency, and bandwidth. Emerging industry standards are ensuring interoperability between independently... » read more

Research Bits: Feb. 10
By Jesse Allen - 10 Feb, 2025 - Comments: 0

Speeding up 3D NAND etch Researchers from Lam Research, the University of Colorado Boulder, and Princeton Plasma Physics Laboratory (PPPL) investigated ways to speed up the cryogenic reactive ion etching process for 3D NAND by using a combined hydrogen fluoride gas to create the plasma. “Cryo etch with the hydrogen fluoride plasma showed a significant increase in the etching rate compared... » read more

Chiplets: Where Are We Today?
By Barry Pangrle - 05 Feb, 2025 - Comments: 1

The 3rd annual Chiplet Summit was held in Santa Clara from January 21st to 23rd at the Convention Center. The conference continues to grow from its 1st year when it was held at the San Jose Doubletree Hotel (almost exactly 2 years ago). During his Chairman’s Welcome presentation, Chuck Sobey mentioned that there were 41 exhibitors at this year’s conference. Chuck was also the moderator f... » read more

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