Dealing With Heat In Near-Memory Compute Architectures


The explosion in data forcing chipmakers to get much more granular about where logic and memory are placed on a die, how data is partitioned and prioritized to utilize those resources, and what the thermal impact will be if they are moved closer together on a die or in a package. For more than a decade, the industry has faced a basic problem — moving data can be more resource-intensive tha... » read more

Heterogeneous Integration Co-Design Won’t Be Easy


The days of “throwing it over the wall” are over. Heterogeneous integration is ushering in a new era of silicon chip design with collaboration at its core—one that lives or dies on seamless interaction between your analog and digital IC and package design teams. Heterogeneous integration is the use of advanced packaging technologies to combine smaller, discrete chiplets into one syste... » read more

The New Disruptive Force In High-End AIoT Markets


MediaTek is known for its SoC solutions in the mobile and consumer device markets. In fact, the smartphone market is now producing the most advanced and performant SoC designs on the planet. MediaTek is a vital part of this innovation. Each year it produces a range of chipsets for the mobile market, like the flagship Dimensity 9000 which adopted Arm’s v9 CPU and Mali-GPU technologies to del... » read more

Meeting Today’s Challenges For LVS


At least one thing is for certain in semiconductor development: bigger and more complex designs put lots of pressure on electronic design automation (EDA) tools and methodologies. Yesterday’s chip is today’s IP block, and entire racks of electronics are being packed into system-on-chip (SoC) devices. EDA tools must evolve constantly in order to keep pace with size and complexity while meeti... » read more

Best Practice: Scale-Resolving Simulations In Ansys CFD


While today’s CFD simulations are mainly based on Reynolds-Averaged Navier-Stokes (RANS) turbulence models, it is becoming increasingly clear that certain classes of flows are better covered by models in which all or a part of the turbulence spectrum is resolved in at least a portion of the numerical domain. Such methods are termed Scale-Resolving Simulation (SRS) models in this paper. This r... » read more

Silicon Lifecycle Management Platform


Silicon Lifecycle Management (SLM) is an emerging paradigm within the industry that is making product development and deployment more deterministic. In-silicon observability and insight are key when it comes to SLM and as an industry we can no longer afford to be blind to what is happening inside the chip. SLM is starting to close the loop between design and in-field. Click here to read more. » read more

Detection Of Electric Vehicles And Photovoltaic Systems In Smart Meter Data


In the course of the switch to renewable energy sources, there is a shift from a few large energy sources (power plants) to a large number of small, distributed energy sources (e.g., photovoltaic systems) and energy storage devices (e.g., electric vehicles). This results in the need to know and identify these energy sources and sinks as soon as new devices are installed, in order to ensure grid... » read more

PLANAR: A Programmable Accelerator For Near-Memory Data Rearrangement


Many applications employ irregular and sparse memory accesses that cannot take advantage of existing cache hierarchies in high performance processors. To solve this problem, Data Layout Transformation (DLT) techniques rearrange sparse data into a dense representation, improving locality and cache utilization. However, prior proposals in this space fail to provide a design that (i) scales with m... » read more

Research Bits: Oct. 10


Disposable water-activated battery Researchers at Empa developed a water-activated disposable paper battery that could be used in low-power, single-use disposable electronics such as smart labels for tracking objects, environmental sensors, and medical diagnostic devices. The battery is made of at least one cell measuring one centimeter squared and consisting of three inks printed onto a re... » read more

Research Bits: Oct. 4


2D electrode for ultra-thin semiconductors Researchers from the Korea Institute of Science and Technology (KIST), Japan's National Institute for Materials Science, and Kunsan National University designed two-dimensional semiconductor-based electronic and logic devices, with electrical properties that can be selectively controlled through a new 2D electrode material, chlorine-doped tin diseleni... » read more

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