IC Stresses Affect Reliability At Advanced Nodes


Thermal-induced stress is now one of the leading causes of transistor failures, and it is becoming a top focus for chipmakers as more and different kinds of chips and materials are packaged together for safety- and mission-critical applications. The causes of stress are numerous. In heterogeneous packages, it can stem from multiple components composed of different materials. “These materia... » read more

Boosting Data Center Memory Performance In The Zettabyte Era With HBM3


We are living in the Zettabyte era, a term first coined by Cisco. Most of the world’s data has been created over the past few years and it is not set to slow down any time soon. Data has become not just big, but enormous! In fact, according to the IDC Global Datasphere 2022-2026 Forecast, the amount of data generated over the next 5 years will be at least 2x the amount of data generated over ... » read more

Challenges With Adaptive Control


Historically, the performance and power consumption of a system was controlled by what could be done at design time, but chips today are becoming a lot more adaptive. This has become a necessity for cutting edge nodes, but also provides a lot of additional benefits at the expense of greater complexity and verification challenges. Design margins are a tradeoff between performance and yield. C... » read more

Don’t Let Your ML Accelerator Vendor Tell You The ‘F-Word’


Machine learning (ML) inference in devices is all the rage. Nearly every new system on chip (SoC) design start for mobile phones, tablets, smart security cameras, automotive applications, wireless systems, and more has a requirement for a hefty amount of ML capability on-chip. That has silicon design teams scrambling to find ML processing power to add to the existing menu of processing engines ... » read more

Improving Chip Efficiency, Reliability, And Adaptability


Peter Schneider, director of Fraunhofer Institute for Integrated Circuits' Engineering of Adaptive Systems Division, sat down with Semiconductor Engineering to talk about new models and approaches for ensuring the integrity and responsiveness of systems, and how this can be done within a given power budget and at various speeds. What follows are excerpts of that conversation. SE: Where are y... » read more

Bridging The Digital Divide With Ultra Low-Cost Smartphones


According to the Alliance for Affordable Internet, 2.5 billion people in emerging economies now have access to mobile broadband coverage, but many still cannot afford the typical smartphone. They need a device that hits the right price point, and also provides the right capabilities to support and enhance them in their daily lives. Despite greater connectivity, hitting this ‘smartphone sweet... » read more

Ensuring Signal And Power Integrity In Today’s High-Speed Designs


Leading-edge chip desiLeading-edge chip design was never easy, but it’s getting harder all the time. Rapid advances in communication systems are driving data rates higher. With the emergence of artificial intelligence (AI) applications and the increased need for data processing, high quality data transfer is increasingly critical. Faster data rates and more complex protocols are exacerbating ... » read more

Advanced Auto-Routing For TSMC InFO Technologies


At the recent TSMC OIP Symposium, John Park presented 'Advanced Auto-Routing for TSMC InFO Technologies.' InFO stands for "integrated fanout" and is the lower performance, lower complexity technology for advanced packaging. For details of TSMC's whole packaging portfolio, see my post TSMC OIP: 3DFabric Alliance and 3Dblox. Here's the slide TSMC presented from that presentation on InFO. As you... » read more

Making Electric Vehicles Go Further With New Materials


It’s no secret that vehicle original equipment manufacturers (OEMs) are aggressively pursuing electric vehicle (EV) development. Among the headwinds they face in selling their technology to consumers are price and vehicle range. Not surprisingly, there is a direct correlation between the two — in 2021, for any EV under $40,000, the average vehicle range was 187 miles, while the lowest veh... » read more

Holistic Die-to-Die Interface Design Methodology For 2.5-D Multi-Chip-Module Systems


More than Moore technologies can be supported by system level diversification enabled by chiplet based integrated systems within multi-chip-modules (MCM) and silicon interposer based 2.5D systems. The division of large system-on-chip dies into smaller chiplets with different technology nodes specific to the chiplet application requirement enables the performance enhancement at system level whil... » read more

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