category: Low Power-High Performance

category: IoT, Security & Automotive

12 Ways To Elevate Electronic Design Process Using PADS eBook
By Siemens EDA - 07 Dec, 2022 - Comments: 0

When using PADS Professional Premium, designers have access to standard PCB design functionality, such as schematic definition and physical layout, as well previously optional add-on features (now standard) and all of the latest cloud apps, including: Schematic definition: Access to everything you need: Circuit design and simulation, Component selection, library management, and signal integr... » read more

Tensilica DSP Code Generation Toolbox With MATLAB/Simulink
By Cadence - 07 Dec, 2022 - Comments: 0

MATLAB and Simulink are widely used for modeling and simulating real-time dynamical systems. To verify the performance of MATLAB/Simulink models of these systems in a real-time application, MATLAB/Simulink models are converted to embedded C code and executed on a target processor or its equivalent Instruction Set Simulator (ISS). To deploy the generated C code in a processor, the genera... » read more

Jitter Budgeting For Clock Distribution Networks In High-Speed PHYs And SerDes
By Synopsys - 07 Dec, 2022 - Comments: 0

This paper presents a simple but practically precise estimation of periodic single-tone power supply induced jitter (PSIJ) for MOS clock buffer chains. The estimation is algebraically simple for its analytical closed-form expression requiring only a few circuit simulation results without the pre-knowledge of circuit device SPICE parameters. The expression is well suited to predict period PSIJ, ... » read more

Research Bits: Dec. 5
By Jesse Allen - 05 Dec, 2022 - Comments: 0

Protonic programmable resistors for AI Researchers from the Massachusetts Institute of Technology (MIT) developed an analog deep learning processor based on protonic programmable resistors arranged in an array. In the processor, increasing and decreasing the electrical conductance of protonic resistors enables analog machine learning. The conductance is controlled by the movement of protons... » read more

How To Make The Charging Infrastructure For Electric Vehicles Smart
By Infineon - 30 Nov, 2022 - Comments: 0

Renewable energies and the increasing emergence of electric vehicles are putting a strain on the electricity grid. The former are not constantly available, and the latter require additional energy while charging. This leads to the need for introducing a new, smart charging infrastructure to avoid instabilities at the grid level. This white paper explains what is involved in making a charging in... » read more

The Computational Electromagnetics Simulation Challenge Of 3D-IC
By Kelly Damalou - 29 Nov, 2022 - Comments: 0

By Kelly Damalou and Matt Commens Innovation in semiconductor design today is energized primarily by AI/ML, data centers, autonomous and electric vehicles, 5G/6G, and IoT. Recently developed 2.5 and 3D-IC silicon-based packaging technologies have advanced the state of the art beyond SoC technologies which first united digital, analog, and memory functions on a single chip in the '90s. These ... » read more

Research Bits: Nov. 21
By Jesse Allen - 21 Nov, 2022 - Comments: 0

Graphene heater for phase-change switches Researchers from the University of Washington, Stanford University, Charles Stark Draper Laboratory, University of Maryland, and Massachusetts Institute of Technology designed an energy-efficient, silicon-based non-volatile switch that manipulates light through the use of a phase-change material and graphene heater. Aiming to reduce the power consum... » read more

Challenges And Solutions In Chip Design
By Marc Swinnen - 21 Nov, 2022 - Comments: 0

Ansys is hosting IDEAS Digital Forum 2022, a no-cost virtual event that brings together industry executives and technical design experts to discuss the latest in EDA for Semiconductors, Electronics, and Photonics. The December 6th on-line event starts with Keynote addresses from Raja Koduri from Intel, Pankaj Kukkal from Qualcomm, and insights into the metaverse from DP Prakash with start-up... » read more

On-Chip Power Distribution Modeling Becomes Essential Below 7nm
By Ann Mutschler - 16 Nov, 2022 - Comments: 0

Modeling power distribution in SoCs is becoming increasingly important at each new node and in 3D-ICs, where tolerances involving power are much tighter and any mistake can cause functional failures. At mature nodes, where there is more metal, power problems continue to be rare. But at advanced nodes, where chips are running at higher frequencies and still consuming the same or greater power... » read more

Research Bits: Nov. 15
By Jesse Allen - 15 Nov, 2022 - Comments: 0

Low temperature 3D bonding Scientists from Osaka University developed a new method for the direct three-dimensional bonding of copper electrodes using silver layers. The method works at low temperatures and does not require external pressure. "Our process can be performed under gentle conditions, at relatively low temperatures and without added pressure, but the bonds were able to withstand... » read more

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