category: Low Power-High Performance

category: IoT, Security & Automotive

Why Your Data Center Needs a Digital Twin
By Cadence - 15 Jan, 2025 - Comments: 0

The global digital twin market is on a rapid ascent, projected to skyrocket from $11.51 billion in 2023 to $137.67 billion by 2030. Spanning industries from aerospace to healthcare, digital twins are becoming an essential tool for efficient management. But what is a digital twin? Essentially, it’s a digital replica of any real-world entity—a product, system, or process—used for simulation... » read more

Research Bits: Jan. 13
By Jesse Allen - 13 Jan, 2025 - Comments: 0

High-temp electrochemical memory Researchers from the University of Michigan and Sandia National Laboratory propose a nonvolatile electrochemical memory that can store and rewrite information at temperatures over 1100°F (600°C), enabling it to continue working in environments as extreme as the surface of Venus. Instead of transporting electrons, the memory moves oxygen ions between layere... » read more

Research Bits: Jan. 7
By Jesse Allen - 07 Jan, 2025 - Comments: 0

Deep UV microLED for maskless lithography Researchers from the Hong Kong University of Science and Technology, Southern University of Science and Technology, and the Suzhou Institute of Nanotechnology developed an aluminum gallium nitride deep-ultraviolet microLED display array for maskless lithography.  They also built a maskless lithography prototype platform. "The team achieved key brea... » read more

Research Bits: Dec. 24
By Jesse Allen - 24 Dec, 2024 - Comments: 0

Growing multilayered chips Researchers from MIT, Samsung Advanced Institute of Technology, Sungkyunkwan University, and University of Texas at Dallas developed a method to fabricate a multilayered chip with alternating layers of semiconducting material grown directly on top of each other. The approach enables high-performance transistors and memory and logic elements on any random crystalline ... » read more

Research Bits: Dec. 16
By Jesse Allen - 16 Dec, 2024 - Comments: 0

Soft liquid metal vias Researchers from Virginia Tech and University of Pennsylvania found a way to create soft, flexible electric connections through circuit layers. The method could be used for soft robotics and wearable devices. The technique uses liquid metal microdroplets to create a stair-like structure that forms soft vias and planar interconnects through and across circuit layers wi... » read more

Integrating Ethernet, PCIe, And UCIe For Enhanced Bandwidth And Scalability For AI/HPC Chips
By Madhumita Sanyal - 12 Dec, 2024 - Comments: 0

By Madhumita Sanyal and Aparna Tarde Multi-die architectures are becoming a pivotal solution for boosting performance, scalability, and adaptability in contemporary data centers. By breaking down traditional monolithic designs into smaller, either heterogeneous or homogeneous dies (also known as chiplets), engineers can fine-tune each component for specific functions, resulting in notable im... » read more

Why PCIe And CXL Are Essential Interconnects For The AI Era
By Lou Ternullo - 12 Dec, 2024 - Comments: 0

As the demand for AI and machine learning accelerates, the need for faster and more flexible data interconnects has never been more critical. Traditional data center architectures face several challenges in enabling efficient and scalable infrastructure to meet the needs of emerging AI use cases. The wide variety of AI use cases translate into different types of workloads. Some require high ... » read more

Addressing Reset Tree Design Challenges For Complex SoCs With Advanced Structural Checks
By Reetika - 12 Dec, 2024 - Comments: 0

As SoC designs continue to evolve, the complexity of reset architectures has grown significantly. Traditionally, clock tree synthesis has been a major focus due to timing challenges, but now reset trees demand equal attention. With multiple reset sources, designers must deal with reset trees that can be more intricate than clock trees. Errors within a reset tree can lead to serious issues, incl... » read more

Automakers And Industry Need Specific, Extremely Robust, Heterogeneously Integrated Chiplet Solutions
By Andy Heinig - 12 Dec, 2024 - Comments: 0

Chiplets offer great potential for the automotive and industrial sectors, especially as these applications often have high performance requirements but are needed only in small quantities. The modular principle behind chiplets enables efficient design and production: individual components have to be produced only once and can then be flexibly combined to create tailored solutions. This offers m... » read more

NPU Acceleration For Multimodal LLMs
By Pat Donnelly - 12 Dec, 2024 - Comments: 0

Transformer-based models have rapidly spread from text to speech, vision, and other modalities. This has created challenges for the development of Neural Processing Units (NPUs). NPUs must now efficiently support the computation of weights and propagation of activations through a series of attention blocks. Increasingly, NPUs must be able to process models with multiple input modalities with ac... » read more

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