category: Low Power-High Performance

category: Auto, Security & Edge AI

Redefining AI Inference With New Silicon Architecture
By Tanushri Shah - 09 Apr, 2026 - Comments: 0

AI inference is rapidly becoming the largest and most demanding segment of the AI market, but the cost of running these workloads continues to be a major challenge. VSORA, a fabless semiconductor company, is tackling this problem head-on with a fresh approach to high‑performance AI processing and a deep collaboration with Cadence. VSORA develops advanced AI chips that dramatically reduce t... » read more

State Of The Market For Edge Silicon
By Ed Sperling - 08 Apr, 2026 - Comments: 0

The explosion of data and the rapid ramp of AI is causing significant changes in how chips are architected. At the edge, the key metrics are power, latency, and performance, but those can vary significantly by application and by workload. Steve Roddy, chief marketing officer at Quadric, talks about the need to balance performance and efficiency with flexibility for different applications, what ... » read more

AI At The Edge Ubiquitous, Agentic, Multimodal, and Hardware-Accelerated
By Expedera - 08 Apr, 2026 - Comments: 0

Over the past decade, cloud-based artificial intelligence (AI) has undergone significant maturation. Cloud-based AI now reliably supports large-scale model training, massive data storage, and centralized orchestration of AI workloads. At the same time, limitations—such as latency, bandwidth costs, privacy concerns, catastrophic consequences in the event of failure, and dependency on continuou... » read more

Engineer’s Guide to Simulating Electronics Cooling: eBook
By Cadence - 08 Apr, 2026 - Comments: 0

Struggling with overheating PCBs, airflow bottlenecks, or long thermal simulation runtimes? As power densities rise and form factors shrink, electronics cooling is no longer a late-stage check — it’s a core design requirement. Poor thermal performance leads to hotspots, reduced reliability, field failures, and costly redesigns. Learn how to use intelligent thermal simulation to predic... » read more

Inside the AI Accelerator: Essential IP Design Solutions: eBook
By Synopsys - 08 Apr, 2026 - Comments: 0

This eBook explores how next‑gen AI accelerators break past single‑chip limits using advanced IP, high‑speed interconnects, memory interfaces, and multi‑die architectures. You’ll see how optical links push bandwidth further and how built‑in security IP keeps AI data protected without slowing performance. What you'll learn: How UALink, PCIe, CXL, and Ultra Ethernet enable sca... » read more

Research Bits: Apr. 6
By Jesse Allen - 06 Apr, 2026 - Comments: 0

Reservoir computing Researchers from Loughborough University designed a memristor reservoir computing chip that can process data that changes over time directly in hardware. “Inspired by the way the human brain forms very numerous and seemingly random neuronal connections between all its neurons, we created complex, random, physical connections in an artificial neural network by designing... » read more

Research Bits: Mar. 31
By Jesse Allen - 31 Mar, 2026 - Comments: 0

2D hard mask material Researchers from Penn State University and University of Chemistry and Technology Prague propose using the 2D material chromium oxychloride (CrOCl) as a hard mask, because its layered structure is resistant to plasma etching and enables it to be an effective mask at smaller thicknesses. “This 2D material is like lasagna. It’s a layer-by-layer structure,” said Zih... » read more

Research Bits: Mar. 24
By Jesse Allen - 24 Mar, 2026 - Comments: 0

Dual-modulated transistor Researchers from Daegu Gyeongbuk Institute of Science and Technology (DGIST) and University of Cambridge designed dual-modulated vertically stacked transistors in which two gates, positioned above and below in a sandwich-like structure, control the channel through different mechanisms. The lower electrode contains microscopic openings to allow electric signals to p... » read more

Memory For AI At The Edge
By Ed Sperling - 18 Mar, 2026 - Comments: 0

Inferencing at the edge has very different needs than training large language models or large-scale inferencing in AI data centers. Many edge devices run on a battery. They're price-sensitive, and they are constrained by the physical area of the device. As a result, the amount of memory that can be packed into these devices is also limited. Steve Woo, Rambus fellow and distinguished inventor, t... » read more

Research Bits: Mar. 17
By Jesse Allen - 17 Mar, 2026 - Comments: 0

Photonic ski jumps Researchers from Massachusetts Institute of Technology (MIT), MITRE, University of Arizona, and Sandia National Laboratories developed a new class of photonic devices that enable the precise broadcasting of light from a chip into free space. The chip uses an array of microscopic structures that curl upward, resembling tiny ski jumps, and allows control over how light is e... » read more

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