category: Manufacturing, Packaging and Materials

category: IoT, Security & Automotive

Industry 4.0 Reaches Into the Subfab
By Applied Materials - 14 Dec, 2018 - Comments: 0

To unlock the full potential of their manufacturing systems and personnel, companies in many industries are rapidly moving toward highly automated systems and digital data-driven methods and tools. Widely known as “smart manufacturing” or Industry 4.0, the resulting productivity improvements are often so dramatic that many people are calling this shift a new industrial revolution. The se... » read more

Smart Manufacturing
By Ed Sperling - 12 Dec, 2018 - Comments: 0

Tom Salmon, vice president of collaborative technology platforms at SEMI, talks about smart manufacturing, and the role of AI, smart gateways, and digital twins. https://youtu.be/e9DQ_Xfc2K0     See other tech talk videos here.   » read more

Manufacturing Bits: Dec. 11
By Mark LaPedus - 11 Dec, 2018 - Comments: 0

FinFET vs. FD-SOI pH sensors At the recent 2018 IEEE International Electron Devices Meeting (IEDM), TSMC and National Tsing Hua University presented a paper on an ion detector or pH sensor based on a 16nm finFET technology. Researchers have developed an advanced version of an ion-sensitive field-effect transistor (ISFET). Originally developed in the 1970s, ISFETs are pH sensors that are use... » read more

Packaging Biz Faces Challenges in 2019
By Mark LaPedus - 10 Dec, 2018 - Comments: 0

The IC packaging industry is bracing for slower growth, if not uncertainty, in 2019, even though advanced packaging remains a bright spot in the market. Generally, IC packaging houses saw strong demand in the first part of 2018, but the market cooled in the second half of the year due to a slowdown in memory. Going forward, the slower IC packaging market is expected to extend into the first ... » read more

Where Advanced Packaging Makes Sense
By Ed Sperling - 10 Dec, 2018 - Comments: 0

Semiconductor Engineering sat down with Chenglin Liu, director of package engineering at Marvell; John Hunt, senior director of engineering at ASE; Eric Tosaya, senior director of package manufacturing at eSilicon; and Juan Rey, vice president of engineering for Calibre at Mentor, a Siemens Business. What follows are excerpts of that discussion, which was held in front of a live audience at MEP... » read more

The Case For Chiplets
By Ed Sperling - 10 Dec, 2018 - Comments: 0

Kandou’s Amin Shokrollahi looks at what’s behind the momentum for a LEGO-like approach, where the challenges are, and how the cost compares with other approaches. https://youtu.be/7QHEeagdLzk     ___________________________________ Find more tech talk videos here .   » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 07 Dec, 2018 - Comments: 0

Fab tools/manufacturing Lam Research has accepted Martin Anstice’s resignation as chief executive and a member of the board. Lam has named Tim Archer as president and chief executive effective immediately. Archer, who served as Lam’s president and chief operating officer, has been named to the board. One analyst provided a comment on the situation at Lam. “In our view, Mr. Archer is very... » read more

Manufacturing Bits: Dec. 4
By Mark LaPedus - 04 Dec, 2018 - Comments: 0

Probing Mars Equipped with a CCD camera, a temperature probe and a seismic instrument, NASA's robotic system or lander recently landed on Mars. On Nov. 26, the robotic system--dubbed the Interior Exploration using Seismic Investigations, Geodesy and Heat Transport (InSight)--landed on Mars after nearly a seven-month, 300-million-mile (485-million-kilometer) journey from Earth. The lander t... » read more

Trade Disputes Increase Market Uncertainty
By Joanne Itow - 04 Dec, 2018 - Comments: 0

The World Semiconductor Trade Statistics (WSTS) organization held its bi-annual forecast meeting in Scottsdale, Arizona last month, and one of the topics that seemed to be on everyone’s mind is the impact of tariffs and the trade tensions between the United States and China. The need to impose tariffs on U.S. imports of semiconductors is perplexing and frequently confusing. President Trum... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 30 Nov, 2018 - Comments: 0

Chipmakers GlobalFoundries has announced that its advanced silicon-germanium (SiGe) offering is available for prototyping on 300mm wafers. GF’s SiGe technology has been shipping on its 200mm production line in Burlington, Vt. The technology, a 90nm SiGe process, is moving to 300mm wafers at GF’s Fab 10 facility in East Fishkill, N.Y. The SiGe technology is called 9HP. “The increasing ... » read more

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