Kandou’s Amin Shokrollahi looks at what’s behind the momentum for a LEGO-like approach, where the challenges are, and how the cost compares with other approaches.
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New market opportunities and global competitiveness are limited by qualified people.
Better algorithms and more data could bolster adoption, particularly at advanced nodes.
Showing that a processor core adheres to a specification becomes more difficult when the specification is extensible.
New approaches are competing for attention as scaling benefits diminish.
Deeper understanding of equipment behavior and market needs will have broad impact across the semiconductor supply chain.
This will go down as a good year for the semiconductor industry, where new markets and innovation were both necessary and rewarded.
Researchers digging into ways around the von Neumann bottleneck.
Experts at the Table, Part 1: Impact on the supply chain, who’s using advanced packaging, and the cost of packaging versus device scaling.
Companies battle it out to get artificial intelligence to the edge using various chip architectures as their weapons of choice.
30 facilities planned, including 10/7nm processes, but trade war and economic factors could slow progress.
New market opportunities and global competitiveness are limited by qualified people.
New architectures, packaging approaches gain ground as costs increase, but shrinking features continues to play a role.
Four industry experts talk about what’s changing, how quickly, and where the limits are with AI.
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