Kandou’s Amin Shokrollahi looks at what’s behind the momentum for a LEGO-like approach, where the challenges are, and how the cost compares with other approaches.
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This will go down as a good year for the semiconductor industry, where new markets and innovation were both necessary and rewarded.
New architectures, packaging approaches gain ground as costs increase, but shrinking features continues to play a role.
The term creates hope for some, fear for others, and confusion for all.
Work begins on building a quantum computing ecosystem.
Semiconductor devices face many hazards before and after manufacturing that can cause them to fail prematurely.
Interest in the open-source ISA marks a significant shift among chipmakers, but it will require continued industry support to be successful.
Chips will cost more to design and manufacture even without pushing to the latest node, but that’s not the whole story.
This will go down as a good year for the semiconductor industry, where new markets and innovation were both necessary and rewarded.
Slowdown due to impact on timing, and dependencies between power, thermal and timing that may not be caught by signoff tools.
Experts at the Table, Part 1: Impact on the supply chain, who’s using advanced packaging, and the cost of packaging versus device scaling.
Access to source code makes it attractive for custom applications, but gaps remain in the tool flow and in software.
Technology adds more granularity, but starting point for design shifts as architectures cope with greater volumes of data.
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