Manufacturing Bits: Nov. 27


New kilogram definition After years of debate and scientific work, a group of delegates from 60 countries have voted to redefine four key unit measurements—the kilogram, electric current (ampere), temperature (kelvin), and the amount of substance (mole). The vote took place at the recent 26th General Conference of Weights and Measures. Hosted by the International Bureau of Weights and Mea... » read more

Getting Down To Business On Chiplets


Government agencies, industry groups and individual companies are beginning to rally around various chiplet models, setting the stage for complex chips that are quicker and cheaper to build using standardized interfaces and components. The idea of putting together different modules like LEGOs has been talked about for the better part of a decade. So far, only Marvell has used this concept co... » read more

Week In Review: Manufacturing, Test


R&D Imec and CEA-Leti have signed a memorandum of understanding under which the two R&D organizations will form a strategic partnership in the domains of artificial intelligence and quantum computing. Europe hopes to accelerate its effort in both AI and quantum computing. Market research TrendForce announced the ranking of top 10 fabless IC design houses worldwide based on their revenues f... » read more

Manufacturing Bits: Nov. 20


Predicting crystal structures A group of researchers have improved a crystal structure prediction algorithm, enabling the ability to develop new crystal structures and compounds at faster rates. In 2005, Artem Oganov, now a professor at the Skolkovo Institute of Science and Technology (Skoltech) and the Moscow Institute of Physics and Technology (MIPT), developed a crystal structure predic... » read more

Foundries Prepare For Battle At 22nm


After introducing new 22nm processes over the last year or two, foundries are gearing up the technology for production—and preparing for a showdown. GlobalFoundries, Intel, TSMC and UMC are developing and/or expanding their efforts at 22nm amid signs this node could generate substantial business for applications like automotive, IoT and wireless. But foundry customers face some tough choic... » read more

Week In Review: Manufacturing, Test


Test There is more consolidation in the ATE business. In October, Cohu completed the acquisition of Xcerra, a supplier of ATE and other products. Then, Astronics this week entered into an agreement for the sale of the intellectual-property and certain assets associated with its semiconductor test business to Advantest for $185 million in cash. The sale additionally includes a $30 million earn-... » read more

2 Big Shifts, Lots Of Questions


The proliferation of AI everywhere, and ongoing efforts by big systems companies to develop their own chips, could have a profound effect on semiconductor manufacturing for years to come. AI is a multi-faceted topic, but what makes this particularly interesting from a semiconductor standpoint is the architecture of AI-specific chips. So far, most of these chips have been developed for data c... » read more

What’s The Outlook for Memory?


What a difference a year makes in the memory business. At this time last year, the industry was in the midst of a boom cycle for both NAND and DRAM. More specifically, there was huge demand for 3D NAND. Then, starting in the first quarter of 2018, the NAND market began to decline and it continues to fall. And now, the DRAM market is also falling off the cliff. So, it’s time to take a q... » read more

A VC View Of The AI Landscape


In this blog post, I’ll highlight my takeaways from the recent AI Hardware Summit where I participated as a panelist. The conference’s focus on developing hardware accelerators for neural networks and computer vision attracted companies from across the ecosystem – AI chip startups, semiconductor companies, system vendors/OEMs, data center providers, financial services companies and VCs,... » read more

Some Chipmakers Sidestep Scaling, Others Hedge


The rising cost of developing chips at 7nm coupled with the reduced benefits of scaling have pried open the floodgates for a variety of options involving new materials, architectures and packaging that either were ignored or not fully developed in the past. Some of these approaches are closely tied to new markets, such as assisted and autonomous vehicles, robotics and 5G. Others involve new ... » read more

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