category: Manufacturing, Packaging and Materials

category: IoT, Security & Automotive

Scaling Sideways
By Ed Sperling - 19 Jul, 2018 - Comments: 0

The next steps in semiconductor technology don't follow the same vectors. While 3nm chips are likely to roll out at some point in the future, it's not clear what the business case will be for developing them. What's clear is the number of companies developing chips at that node will shrink to a handful (or less), because they're going to be far too expensive to design, verify and manufacture... » read more

Leti’s Next Focus
By Mark LaPedus - 19 Jul, 2018 - Comments: 0

Emmanuel Sabonnadière, chief executive of Leti, sat down with Semiconductor Engineering to discuss R&D trends, a new deal with Soitec, and the latest developments at the France-based research organization. Leti is a research institute of CEA Tech. What follows are excerpts of that conversation. SE: Leti recently formed an alliance with Soitec. Under the terms, Leti and Soitec are formin... » read more

Embedded Flash Scaling Limits
By Mark LaPedus - 19 Jul, 2018 - Comments: 3

Embedded nonvolatile flash memory has played a key role in chips for years, but the technology is beginning to face some scaling and cost roadblocks and it’s not clear what comes next. Embedded flash is used in several markets, such as automotive, consumer and industrial. But the automotive sector appears to be the most concerned about the future of the technology. Typically, a car incorpo... » read more

Estimating MOSFET Leakage From Low-Cost, Low-Resolution Fast Parametric Test
By PDF Solutions - 19 Jul, 2018 - Comments: 0

A method of estimating the subthershold component of MOSFET off-state current (Ioffs) using low-cost, low-resolution fast parallel parametric test is introduced. This method measures the subthreshold slope and uses it to estimate Ioffs. Measurements of individual transistors show a very good agreement between measured Ioffs and Ioffs estimated using our approach. For a simple pad-efficient tran... » read more

The Role Of Cobalt In Enabling AI
By Jonathan Bakke - 19 Jul, 2018 - Comments: 0

We are on the cusp of the biggest computing wave yet — the AI era driven by Big Data. Enabling this era will require significant enhancements in processor performance and in the capacity and latency of memory. These requirements are coming at a time when the industry is being increasingly challenged by a slowdown in classic Moore’s Law scaling. What’s needed to continue driving the indust... » read more

22nm Process Technology
By Ed Sperling - 19 Jul, 2018 - Comments: 0

Jamie Shaeffer, senior director of product line management at GlobalFoundries, talks about how FD-SOI compares with bulk technologies, where it will be used and why, and future stacking options. https://youtu.be/2i7GJRxcNRs » read more

Moving To ASICs For ADAS
By Gary Dagastine - 19 Jul, 2018 - Comments: 0

By some estimates, there are now more than 260 startups and established companies around the world scrambling to develop, qualify and bring to market chips and technologies for new ADAS (advanced driver-assistance systems) and autonomous driving applications. Accordingly, venture capitalists, technology companies, carmakers, Tier 1 automotive suppliers and others are sharply ratcheting up ... » read more

The Era Of Data, By The Numbers
By Scott Stevens - 19 Jul, 2018 - Comments: 0

Standing-room only keynote speeches. A future awash in data amassed by transformative technologies and applications, with semiconductors at their core. Smart everything: Cars, medicine, manufacturing, workforce, you name it. The sheer numbers impressed as a record lineup of SEMICON West keynote speakers offered a glowing portrait of the future: The semiconductor industry stands on the cusp o... » read more

New Roadmap For Electronics
By Ed Sperling - 19 Jul, 2018 - Comments: 0

Tech Talk: Melissa Grupen-Shemansky, CTO for SEMI’s FlexTech Group and Advanced Packaging program, looks at what’s changing now that Moore’s Law is slowing, and how packaging is changing as the traditional physical boundaries of electronics begin breaking down. https://youtu.be/UpH1m8Oru90 » read more

Fabs Meet Machine Learning
By Mark LaPedus - 19 Jul, 2018 - Comments: 2

Aki Fujimura, chief executive of D2S, sat down with Semiconductor Engineering to discuss Moore’s Law and photomask technology. Fujimura also explained how artificial intelligence and machine learning are impacting the IC industry. What follows are excerpts of that conversation. SE: For some time, you’ve said we need more compute power. So we need faster chips at advanced nodes, but cost... » read more

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