category: Manufacturing, Packaging and Materials

category: IoT, Security & Automotive

Human Factors In Automation Software
By Selim Nahas - 17 Nov, 2016 - Comments: 1

The semiconductor industry offers some of the most advanced manufacturing environments featuring sophisticated automation and cutting-edge process controls. A typical day in a fab revolves around the production of billions of highly complex, extremely small structures where even the tiniest variations can impact device performance. Even though these production processes are highly automated, te... » read more

Making 2.5D, Fan-Outs Cheaper
By Ed Sperling - 17 Nov, 2016 - Comments: 2

Now that it has been shown to work, the race is on to make advanced [getkc id="27" kc_name="packaging"] more affordable. While device scaling could continue for another decade or more, the number of companies that can afford to develop SoCs at the leading edge will continue to decline. The question now being addressed is what can supplant it, supplement it, or redefine it. At the center o... » read more

A Product Development Flow For 5G/LTE Envelope Tracking Power Amplifiers
By NI - 17 Nov, 2016 - Comments: 0

Next-generation communication systems will rely on system architectures that will challenge component level design. This NI AWR software white paper examines the use of envelope tracking (ET), digital pre-distortion, and impedance matching via load pull to improve the efficiency and linearity performance of RF PAs targeting 4G and 5G applications. To read more, click here. » read more

Mastering The Magic Of Multi-Patterning
By Mentor, a Siemens Business - 17 Nov, 2016 - Comments: 0

Multi-patterning technology was introduced at the 20 nm node to overcome lithographic limitations in current IC manufacturing processes. While processes like double and triple patterning may sometimes seem like magic, successfully implementing multi-patterning compliance in the IC design and verification flow requires a thorough understanding of multi-patterning techniques and their impact on y... » read more

Why EUV Is So Difficult
By Mark LaPedus - 17 Nov, 2016 - Comments: 23

For years, extreme ultraviolet (EUV) lithography has been a promising technology that was supposed to help enable advanced chip scaling. But after years of R&D, EUV is still not in production despite major backing from the industry, vast resources and billions of dollars in funding. More recently, though, [gettech id="31045" comment="EUV"] lithography appears to be inching closer to pos... » read more

Bringing Advanced Semiconductor Manufacturing Technologies To Higher Education
By Jimmy Gu - 17 Nov, 2016 - Comments: 0

Universities and other institutions of higher learning play a key role in developing our next generation of semiconductor technologies. Along with the theory of semiconductor technology, our next generation of scientists and engineers must learn about the practical methods used to design and manufacture the latest generation of semiconductor products. Recently, Coventor’s predictive, 3D proce... » read more

Oscilloscopes: The EE’s Stethoscope
By Gale Morrison - 17 Nov, 2016 - Comments: 0

Oscilloscopes are like the electricity to your house. You don't give it much thought until a storm knocks it out. The entire electronics industry can't function without oscilloscopes. But this equipment is such a constant and so consistent, we sometimes forget it's there. Semiconductor Engineering spent time with three Test & Measurement (T&M) industry stalwarts to talk about Oscillo... » read more

Manufacturing Bits: Nov. 15
By Mark LaPedus - 15 Nov, 2016 - Comments: 0

Tiny magnifying glass The University of Cambridge has devised what researchers claim is the world’s smallest magnifying glass. More specifically, researchers developed a tiny optical cavity, dubbed a pico-cavity. The pico-cavity consists of self-assembled, biphenyl-4-thiol molecules. These materials are sandwiched between gold nanostructures the size of a single atom. With the pico-cav... » read more

Samsung To Buy Harman For $8B
By Ann Mutschler - 14 Nov, 2016 - Comments: 0

To fulfill a strategic priority in automotive and connected technologies for Samsung Electronics, the Korean chipmaking giant announced today it is acquiring leading Tier 1 automotive supplier Harman International Industries for $112.00 per share in cash, or total equity value of approximately $8.0 billion.  Samsung estimates the addressable market for automotive is expected to grow to mor... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 11 Nov, 2016 - Comments: 1

Fab tools Is Nikon’s semiconductor lithography equipment business on the ropes? Amid losses and dwindling market share, the company has announced a major restructuring plan for this unit. It will reduce fixed costs related to its 193nm immersion scanner business “by headcount rationalization and re-assignments of 1,000 employees,” according to Nikon. In addition, Nikon is reassessing its... » read more

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