category: Manufacturing, Packaging and Materials

category: IoT, Security & Automotive

Manufacturing Bits: Feb. 16
By Mark LaPedus - 16 Feb, 2016 - Comments: 0

Monoxide chips Two-dimensional (2D) materials are gaining steam in the R&D labs. The 2D materials could enable a new class of field-effect transistors (FETs), but the technology isn’t expected to appear until sometime in the next decade. The 2D materials include graphene, boron nitride and the transition-metal dichalcogenides (TMDs). One TMD, molybdenum diselenide (MoS2), is gaining inter... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 12 Feb, 2016 - Comments: 0

SUNY Polytechnic Institute (SUNY Poly) and GlobalFoundries announced the establishment of a new Advanced Patterning and Productivity Center (APPC). The $500 million, 5-year program will accelerate the introduction of extreme ultraviolet (EUV) lithography technologies into manufacturing. The center is located at the Colleges of Nanoscale Science and Engineering (CNSE) in Albany, N.Y. -------... » read more

Manufacturing Bits: Feb. 9
By Mark LaPedus - 09 Feb, 2016 - Comments: 1

3D chip consortium The 3D integration consortium of IRT Nanoelec has a new member--EV Group. Based in Grenoble, France, IRT Nanoelec is an R&D center headed by CEA-Leti. Formed in 2012, the 3D integration consortium is one of IRT’s core programs. EV Group joins Leti, Mentor Graphics, SET and STMicroelectronics as members of the 3D consortium. The program is developing a 3D integration ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 05 Feb, 2016 - Comments: 0

Samsung introduced inFlux, a new lineup of high-flux, linear LED modules optimized for industrial lighting applications such as plants, parking lots and warehouses. The LED modules serve as a replacement for conventional T8 and T5HO tubes and are suitable for high-flux LED luminaires covering up to 40,000lm. The semiconductor market is off to a slow start in 2016. And it might be a long yea... » read more

Manufacturing Bits: Feb. 2
By Mark LaPedus - 02 Feb, 2016 - Comments: 0

Do-it-yourself optoelectronics The University of Illinois at Urbana-Champaign has developed a technology to make optical components on a do-it-yourself basis. To make a component, researchers have devised what they call plasmon-assisted etching. The process makes use of a nanostructured template, which can be used to create optical components. The template is a 2D array of gold pillar-su... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 29 Jan, 2016 - Comments: 0

Qualcomm recently announced the new Snapdragon 820. The cell-phone chipset is based on Samsung Electronics’ new 14nm LPP (Low-Power Plus) process, the second-generation of the company’s 14nm finFET process technology. What’s next? Qualcomm is developing the Snapdragon 830. “Snapdragon 830 leaks indicate that the chip will sport 8GB of RAM, an enhanced Kryo custom architecture, and fabbe... » read more

Manufacturing Bits: Jan. 26
By Mark LaPedus - 26 Jan, 2016 - Comments: 0

Giant vice Deutsches Elektronen-Synchrotron (DESY), a research center within the Helmholtz Association, has installed a giant vise or press in its organization. The vise, dubbed the Large Volume Press (LVP), measures 4.5 meters in height and weighs 35 tons. It can exert a force of up to 500 tons on each of its three axes. [caption id="attachment_25030" align="alignleft" width="160"] Th... » read more

Inside Neuromorphic Computing
By Mark LaPedus - 25 Jan, 2016 - Comments: 2

Semiconductor Engineering sat down to talk about neuromorphic technology with Guy Paillet, chief executive of General Vision. The fabless IC design house is a pioneer and supplier of neuromorphic chips. What follows are excerpts of that conversation. SE: In 1993, you invented and co-patented a neural networking chip with IBM. Then, you joined General Vision in 1999. Briefly tell us about Gen... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 22 Jan, 2016 - Comments: 0

Samsung Electronics announced that it has begun producing the industry’s first 4-gigabyte DRAM package based on the second-generation High Bandwidth Memory (HBM2) interface. The 4GB HBM2 package is created by stacking a buffer die at the bottom and four 8-gigabit core dies on top. These are then vertically interconnected by TSV holes and microbumps. A single 8Gb HBM2 die contains over 5,000 T... » read more

Industry Road Map Under Construction
By Ed Sperling - 21 Jan, 2016 - Comments: 0

While most engineers think in terms of PPA—the classic power, performance and area tradeoffs—their bosses tend to see the world in terms of risk vs. opportunity. Until 22nm, these two objectives moved forward at roughly the same pace, despite the growing technical challenges of fitting more functionality into an SoC. Much has changed since then, and even more will change over the next f... » read more

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