Luminaries See Growth Opportunities For Photomask Writers


Multi-beam mask writers (MBMWs) are the new kid on the block of the photomask writers, so growth predictions aren’t surprising. In fact, 90% of the industry luminaries surveyed by the eBeam Initiative think that new MBMW purchases will increase over the next three years, as shown in figure 1. Looking at that chart, industry luminaries predict sales of new photomask writers to increase across ... » read more

New Ways To Improve Batteries


Researchers around the world are racing to develop more efficient, denser, and safer battery technology, and they are reaching far beyond where research has gone before. Much of this is being driven by concern over exhaust from internal combustion engines, which are responsible for a significant portion of global CO2 emissions. Nearly all carmakers today have announced plans to develop batte... » read more

The Evolution Of Plasma Process Power


The year 1981 was notable for a variety of technology breakthroughs. It saw the inaugural mission of the Space Shuttle Columbia and the debut of the DeLorean car. The IBM PC, Commodore 64, and the ZX81 were among the personal computers to hit store shelves. It also marked the year, four decades ago, that Advanced Energy was founded and took its first steps towards a mission to enable custom... » read more

Semiconductor Industry Faces Stiff Competition For Talent


For decades, the semiconductor industry has been defined by our ability to innovate. Each time we’ve been faced with seemingly insurmountable technological challenges, we have invented innovative approaches and methods to solve them, and in doing so, we’ve helped to transform how the world works, plays, learns, and connects. Today, we are again faced with a critical new challenge: the gl... » read more

Sustainability In Creating Next-Gen Materials


In recent years, sustainable manufacturing has become increasingly vital in the materials industry with growing concerns about the impact of manufacturing on the environment. Minimizing the intrinsic risks associated with any manufacturing operation while maximizing the quality and opportunities that arise with improved products is and should be the goal of almost every manufacturer today. At... » read more

Future Challenges For Advanced Packaging


Michael Kelly, vice president of advanced packaging development and integration at Amkor, sat down with Semiconductor Engineering to talk about advanced packaging and the challenges with the technology. What follows are excerpts of that discussion. SE: We’re in the midst of a huge semiconductor demand cycle. What’s driving that? Kelly: If you take a step back, our industry has always ... » read more

Metal Thermal Interface Material For The Next Generation FCBGA


Thermal interface materials (TIMs) have been widely adopted for improved thermal dissipation in flip chip ball grid array (FCBGA), flip chip lidded ball grid array (FCLGA) and flip chip pin grid array (FCPGA) packaging. As the next generation devices' requirements for power get even higher, enhanced thermal performance at the package level is increasingly important. A typical TIM applies a poly... » read more

Design Technology Co-Optimization


Rising complexity is making it increasingly difficult to optimize chips for yield and reliability. David Fried, vice president of computational products at Lam Research, examines the benefits of automated rules to manage the relationship between layout and design requirements on one side, and process flows and rules/checks on the other. Benefits include reduced margin, shortened time to market,... » read more

Manufacturing Bits: Jan. 18


Proton/antiproton measurements CERN, the European Organization for Nuclear Research, has made a breakthrough in particle physics by conducting the world’s most precise measurements and comparisons between protons and antiprotons. The breakthrough can help scientists gain a better understand of particle physics as well as the origins and the composition of the universe. It can also bring n... » read more

Week In Review: Manufacturing, Test


Chipmakers, OEMs TSMC reported sales of $15.736 billion for the fourth quarter of 2021, up 5.7% sequentially. Net income grew 6.4% quarter-over-quarter. In the fourth quarter, shipments of 5nm accounted for 23% of total wafer revenues, while 7nm accounted for 27%. In the first quarter of 2022, TSMC’s sales are expected to be between $16.6 billion to $17.2 billion. TSMC also expects its 20... » read more

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