category: News

category: IoT, Security & Automotive

The Week In Review: Manufacturing
By Mark LaPedus - 03 Feb, 2017 - Comments: 0

Manufacturing Veeco Instruments has signed a definitive agreement to acquire Ultratech. With the deal, Veeco will enter into the lithography market for chip-packaging as well as the laser spike anneal business. Veeco is a supplier of MOCVD tools. The implied total transaction value is approximately $815 million and the implied enterprise value is approximately $550 million. FlexTech, a SE... » read more

The Week In Review: IoT
By Jeff Dorsch - 03 Feb, 2017 - Comments: 0

Finance NXP Semiconductors reported its Secure Connected Devices group posted revenue of $569 million in the fourth quarter, a gain of 10% from a year earlier. NXP CEO Richard Clemmer said in a statement, “All major product lines contributed to a seasonally solid quarter.” The chip company reported Q4 revenue of $2.44 billion and 2016 revenue of nearly $9.5 billion. Consortia Bosch, C... » read more

The Week In Review: Design
By Jesse Allen - 03 Feb, 2017 - Comments: 0

Tools Synopsys announced the latest version of its VCS functional verification solution, which integrates native fine-grained parallelism (FGP) and additional engine optimizations for simulation on existing x86 CPU server configurations. Aldec released the latest version of its requirements lifecycle management solutions for FPGAs/SoCs, adding certification document templates and review c... » read more

Blog Review: Feb. 1
By Jesse Allen - 01 Feb, 2017 - Comments: 0

Synopsys' Anand Thiruvengadam investigates the challenges and tradeoffs that come with different abstraction models and use models in mixed-signal verification. Cadence's Paul McLellan highlights 16 big questions facing autonomous cars, from a presentation by Andreessen-Horowitz's Frank Chen. Mentor's Colin Walls says that when it comes to free stuff, keep an eye out for the real cost. ... » read more

Rethinking Stats In Manufacturing Equipment
By Ed Sperling - 01 Feb, 2017 - Comments: 1

Consolidation, slower market growth due to increasing complexity, and extended lead times have prompted SEMI to drop its book-to-bill reports. Long considered the best way to assess the health of the semiconductor manufacturing equipment business, the industry organization now views the book-to-bill report as far less valuable than in the past. "At the leading edge, there are only a handf... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 27 Jan, 2017 - Comments: 0

Chipmakers Faced with a huge write-down at its nuclear operations, Toshiba is looking to spin off its semiconductor division, which makes NAND. As expected, Toshiba seeks investors in the new company, according to Nikkei. Western Digital (WD) is one potential investor. Foxconn is another possible investor, according to CNBC. Peregrine Semiconductor has rolled out its latest RF SOI process.... » read more

The Week In Review: IoT
By Jeff Dorsch - 27 Jan, 2017 - Comments: 0

Finance Ring, which sells Internet-connected doorbells, security cameras, and other products, received another $109 million in private funding, bringing its total funding to $209 million. DFJ Growth, Goldman Sachs Investment Partners, and Qualcomm Ventures led the Series D round, with participation by Richard Branson and other existing investors. Ring says its products are available in 100 cou... » read more

The Week In Review: Design
By Jesse Allen - 27 Jan, 2017 - Comments: 0

Tools Cadence launched its Sigrity 2017 technology portfolio for PCB power and signal integrity signoff, adding a power topology viewer and editor, library management for power integrity models, and a PCI Express 4.0 compliance kit for checking signal integrity. Memory Spin Transfer Technologies delivered samples of fully functional ST-MRAM (spin transfer magneto-resistive random acces... » read more

Blog Review: Jan. 25
By Jesse Allen - 25 Jan, 2017 - Comments: 0

Synopsys' Anand Thiruvengadam looks at why there's an increased need for mixed-signal verification. Mentor's Craig Armenti argues for incorporating design for reliability into PCB projects. Cadence's Paul McLellan reports from the latest in ESDA's Emerging Companies series about the roots and future of RISC-V. NI's James Kimery shares updates from the 3GPP Workshop on 5G in Vienna. ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 20 Jan, 2017 - Comments: 0

Chipmakers 2017 is just getting underway and there appears to be more restructuring in the IC industry. Toshiba is looking to spin off its semiconductor division and Western Digital (WD) plans to take a minority stake, according to Nikkei, which added that Toshiba would sell a 20% stake for 200-300 billion yen ($1.78-$2.65 billion). “The arrangement would provide Toshiba with short term fund... » read more

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