System Bits: March 17


Symmetry in graphene growth According to Rice University researchers, what lies beneath growing islands of graphene is important to its properties. The team analyzed patterns of graphene – a single-atom-thick sheet of carbon – grown in a furnace via chemical vapor deposition and discovered that the geometric relationship between graphene and the substrate, the underlying material on whi... » read more

Power/Performance Bits: March 17


Artificial photosynthesis: leaves of nickel Inspired by a chemical process found in leaves, Caltech scientists developed an electrically conductive film that could help pave the way for devices capable of harnessing sunlight to split water into hydrogen fuel. When applied to semiconducting materials (it's been tested with silicon, indium phosphide, and cadmium telluride), the team's film ... » read more

The Week In Review: Manufacturing


Look out below! Intel has lowered its first-quarter revenue outlook. The company now expects first-quarter revenue to be $12.8 billion, plus or minus $300 million, compared to the previous expectation of $13.7 billion, plus or minus $500 million. “Intel may be experiencing greater-than-expected seasonal declines in both notebooks and desktops,” said Doug Freedman, an analyst with RBC Capita... » read more

The Week In Review: Design/IoT


Mergers & Acquisitions NXP added to its list of recent acquisitions with Athena SCS, a UK-based provider of embedded software and cryptography for smart cards and NFC. Lattice Semiconductor closed its all-cash $606.6 million acquisition of Silicon Image. Tools Cadence unveiled the Innovus Implementation System. The physical implementation tool sports massively parallel architect... » read more

Blog Review: March 11


How are sensors like a scallop's eyes? Rambus' Patrick Gill guides you through day in the life of the mollusk to show how inspiration for IoT was found in the sea. Cadence's Dimitry Pavlovsky discusses some of the intricacies associated with creating VIP for processor interconnect systems such as CHI, and how other tools are necessary to complete the task. Following Google's warning of a ... » read more

Power/Performance Bits: March 10


Simulated memories Resistance-switching cells hold promise as a faster, higher capacity, lower power replacement for current non-volatile memory. Yet "the mechanisms that govern their remarkable properties have been poorly understood, limiting our ability to assess the ultimate performance and potential for commercialization," said Alejandro Strachan, professor of materials engineering at Pu... » read more

System Bits: March 10


Surviving entanglement breakdown Researchers at MIT have discovered that preserving the fragile quantum property known as entanglement isn’t necessary to reap benefits. By way of background, the MIT team reminded that the promise of quantum information processing, i.e., solving problems that classical computers can’t, as well as perfectly secure communication depends on a phenomenon cal... » read more

Manufacturing Bits: March 10


Hi-tech pens The University of California at San Diego has developed a hi-tech ballpoint pen. Researchers have taken off-the-shelf ballpoint pens and filled them with bio inks. With so-called enzymatic-ink-based roller pens, users are able to draw biocatalytic sensors on a surface. [caption id="attachment_18297" align="alignleft" width="300"] Researchers draw sensors capable of detecting... » read more

The Week In Review: Manufacturing


EUV lithography remains a mixed bag, according to analysts. "We are downgrading shares of ASML to 'Sector Perform' from 'Outperform' as we think shares appear fully valued based on midterm lithography demand and our view that meaningful EUV adoption is still several years out," said Weston Twigg, an analyst with Pacific Crest Securities, in a new report. "We think the reality is that it is not ... » read more

The Week In Review: Design/IoT


Mergers & Acqusitions Mentor Graphics acquired Tanner EDA, bolstering their position in tools for analog, mixed-signal and MEMs. Terms of the deal were not disclosed. NXP joins forces with Freescale. The merger carries a $16.7 billion price tag and potentially creates a new leader in the automotive and MCU markets. Standards Accellera sent UVM 1.2 off to the IEEE P1800.2 working... » read more

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