category: News

category: IoT, Security & Automotive

Blog Review: March 4
By Jesse Allen - 04 Mar, 2015 - Comments: 0

Is gate-level simulation still necessary? Mentor's Gordon Allan asserts it is, and gives a list of reasons why the pain is worth the peace of mind. Synopsys' Aron Pratt concludes his series on parameterization strategies with a process that allows the testbench to make use of parameterized interfaces without imposing limits on VIP access. Should you use EUV or quadruple patterning for 7nm... » read more

System Bits: March 3
By Ann Mutschler - 03 Mar, 2015 - Comments: 0

Observing antiferromagnetic order in ultracold atoms Rice University researchers have simulated superconducting materials and made headway on a problem that’s vexed physicists for nearly three decades using ultracold atoms as a stand-in for electrons. The research team, led by Rice, included researchers from Ohio State University, Universidade Federal do Rio de Janeiro, University of Cal... » read more

Manufacturing Bits: March 3
By Mark LaPedus - 03 Mar, 2015 - Comments: 0

Nanoimprint consortium CEA-Leti has launched a nanoimprint lithography program in an effort to propel the technology in the marketplace. The imprint program, dubbed Inspire, will focus on various and emerging non-semiconductor applications, according to Laurent Pain, patterning program manager and business development manager within the Silicon Technologies division at the French R&D or... » read more

Power/Performance Bits: March 3
By Jesse Allen - 03 Mar, 2015 - Comments: 0

Black phosphorus photodetectors Phosphorus, a highly reactive element commonly found in match heads, tracer bullets, and fertilizers, can be turned into a stable crystalline form known as black phosphorus. In a new study, researchers from the University of Minnesota used an ultrathin black phosphorus film 20 atoms thick to demonstrate high-speed data communication on nanoscale optical circui... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 27 Feb, 2015 - Comments: 0

At the SPIE Advanced Lithography conference in San Jose, Calif., there were several takeaways. First, the battle for lithography share is heating up at Intel. “We believe Nikon still holds a decent position at Intel, but with ASML gaining some share at 10nm. Nikon could regain some share with its new platform at 7nm, in our view, but it is early to tell. We believe Nikon has improved its posi... » read more

The Week In Review: Design/IoT
By Jesse Allen - 27 Feb, 2015 - Comments: 0

Mergers & Acquisitions NXP acquired Quintic’s Bluetooth Low Energy and Wearable businesses, adding BLTE to their low power RF-connectivity portfolio. The team of approximately 65 is expected to join NXP when the deal closes in Q1 2015. Tools Cadence unveiled the integration of Forte's Cynthesizer with their own C-to-Silicon Compiler. The result is the Stratus high-level synthesis... » read more

Blog Review: Feb. 25
By Jesse Allen - 25 Feb, 2015 - Comments: 0

Synopsys' Aron Pratt continues his series on SystemVerilog interfaces and strategies for dealing with parameterization. There are workarounds to the problems it introduces, but they come with a price. Mentor's John Day digs into Volvo's plans for autonomous autos. There are a lot of speedbumps ahead, and while it's easy to build a self-driving concept vehicle, actually getting on the road is... » read more

Power/Performance Bits: Feb. 24
By Jesse Allen - 24 Feb, 2015 - Comments: 0

Simulating ultrafast phenomena Interesting phenomena can happen when electronic states in materials are excited during dynamic processes. As an example, electrical charge transfer can take place on quadrillionth-of-a-second, or femtosecond, timescales. Numerical simulations in real-time provide the best way to study these processes. Such simulations, however, can be extremely expensive. R... » read more

System Bits: Feb. 24
By Ann Mutschler - 24 Feb, 2015 - Comments: 0

New solder for semis A research team led by the University of Chicago has demonstrated how semiconductors can be soldered and still deliver good electronic performance by working out new chemistry for a broad class of compositions relevant to semiconductors. The compounds that the team developed can be used to join pieces of semiconductor, which researchers have longed struggled with. Th... » read more

Manufacturing Bits: Feb. 24
By Mark LaPedus - 24 Feb, 2015 - Comments: 0

EUV progress report At the SPIE Advanced Lithography conference in San Jose, Calif., ASML Holding said that one customer, Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), has exposed more than 1,000 wafers on an NXE:3300B EUV system in a single day. This is one step towards the insertion of EUV lithography in volume production. During a recent test run on the system, TSMC exposed 1,022 w... » read more

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