category: News

category: IoT, Security & Automotive

CHIPS Act: U.S. Releases New Implementation Strategy
By Linda Christensen - 06 Sep, 2022 - Comments: 1

The U.S. Department of Commerce today published "A Strategy For The CHIPS For America Fund," outlining its implementation approach to distributing $50 billion from the CHIPS Act of 2022. Find the full strategy paper here, and the executive summary here. Program Goals The program's four primary goals are: Establish and expand domestic production of leading edge semiconductors in ... » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 02 Sep, 2022 - Comments: 0

New fab construction At an event in Arizona, U.S. Commerce Secretary Gina Raimondo urged states to compete for funding made available for producing semiconductors by the U.S. federal government. Indeed, several companies are already doing just that. The latest developments include: Micron plans to invest approximately $15 billion through 2030 for a new memory fab near its existing headquart... » read more

Week In Review: Auto, Security, Pervasive Computing
By Linda Christensen - 02 Sep, 2022 - Comments: 0

The great EV ramp EV-related developments are everywhere. California’s move to ban sales of new internal-combustion vehicles by 2035, and the U.S. government’s sweeping embrace of clean-energy, are in lockstep with recent moves by the auto industry and related supply chains, as well as cutting-edge research. One of the big breakthroughs is the ability to charge an EV in 10 minutes witho... » read more

Week In Review: Design, Low Power
By Marie C. Baca - 02 Sep, 2022 - Comments: 0

Trade regulations/legal The U.S. government placed new restrictions on sales of GPUs to China that could be used for high-performance computing, artificial intelligence, and other advanced applications. NVIDIA said in an SEC filing Wednesday that officials told the company it must seek an export license for sales to China or Russia of its A100 and H100 chips, and any system that includes those... » read more

Blog Review: Aug. 31
By Jesse Allen - 31 Aug, 2022 - Comments: 0

Cadence's Paul McLellan wonders what's happened to 450mm wafers as equipment development efforts end, the only wafer fab is decommissioned, and manufacturers see little likelihood to recoup further investment in R&D. Synopsys' Manuel Mota finds that the scale and modular flexibility of chiplets can help meet narrowing time-to-market windows and looks at how UCIe provides a complete stack... » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 26 Aug, 2022 - Comments: 0

Regional Shifts Supply chains are moving away from China. Apple, Honda, and Mazda are in line to diversify their manufacturing across different regions, according to one report. Another report says Apple plans to manufacture some of its new iPhone 14s in India. Mexico wants to be part of U.S.’s drive to move chip manufacturing closer to home, hosting American financiers to discuss elect... » read more

Week In Review: Design, Low Power
By Marie C. Baca - 26 Aug, 2022 - Comments: 0

Quantum computing Baidu introduced a 10-qubit quantum computer called Qianshi and what it described as “the world's first all-platform quantum hardware-software integration solution that provides access to various quantum chips via mobile app, PC, and cloud.” The company said it has also completed the design of a 36-qubit quantum chip. Scientists said “levitating” nanoparticles co... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 26 Aug, 2022 - Comments: 0

Automotive, mobility California will ban the sale of new gasoline vehicles so that by 2035 100% of new cars and light trucks sold in California will be zero-emission vehicles. NXP Semiconductors announced multi-year supply agreements for its S32 family. Agreements to supply the S32 domain and zonal automotive processors to OEMs will include upcoming 5nm ASIL-D processors. Keysight Techno... » read more

Blog Review: Aug. 24
By Jesse Allen - 24 Aug, 2022 - Comments: 0

Synopsys' Manuel Mota presents an overview of some of the newest multi-chip module packaging types and their advantages and disadvantages for different kinds of applications, as well as the importance of die-to-die interfaces. Cadence's Steve Brown finds that innovative products require that electronics be analyzed in the context of the environment in which they run, making mechanical and el... » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 19 Aug, 2022 - Comments: 0

The U.S. Commerce Department issued export controls on key technologies, including gallium oxide (Ga2O3) and diamond substrates, which are used at high voltages and temperatures, as well as EDA tools specifically developed for GAA FETs. It's not clear how this will impact EDA companies, because many of the tools that will be used for designing for GAA FETs already are in use today for finFETs. ... » read more

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