category: Test, Measurement and Analytics

category: IoT, Security & Automotive

Modeling Silicon Photonics Process Parameter Variations In Synopsys OptoCompiler-OptSim
By Synopsys - 08 Nov, 2022 - Comments: 0

Silicon photonics (SiPh) refers to the enablement of photonic integrated circuits (PIC) over silicon wafer. SiPh enables compatibility with existing CMOS manufacturing infrastructure for large-scale integration and brings the associated benefits to the photonics, namely, lower footprint, lower thermal effects, and co-packaging of electronics and photonics on the same chip. One of the side-effec... » read more

Super-Resolution Microscopy
By Bruker - 08 Nov, 2022 - Comments: 0

The enhanced resolving power of super-resolution microscope technology enables the imaging and quantitative analysis of cellular dynamics and nanostructures that were previously inaccessible. Download this eBook to learn about: Principles and advantages of super-resolution microscopy (SRM) for life sciences research. Problems solved by SRM Common approaches to achieving be... » read more

Simplifying The Path From Design To Test
By Richard Fanning - 08 Nov, 2022 - Comments: 0

By Richard Fanning and John Rowe Getting an integrated circuit (IC) from design to test is an arduous process that encompasses a number of steps, including: Design for Test (DFT): processes that ensure the chip is designed in such a way that it can be tested Development: the development of automated test programs (ATPs) Bench: evaluating the device at the bench to ensure the desig... » read more

Test Connections Clean Up With Real-Time Maintenance
By Anne Meixner - 08 Nov, 2022 - Comments: 0

Test facilities are beginning to implement real-time maintenance, rather than scheduled maintenance, to reduce manufacturing costs and boost product yield. Adaptive cleaning of probe needles and test sockets can extend equipment lifetimes and reduce yield excursions. The same is true for load board repair, which is moving toward predictive maintenance. But this change is much more complicate... » read more

Automated Optical Inspection
By Ed Sperling - 07 Nov, 2022 - Comments: 0

Building good automated models for inspection require more data to be collected, both good and bad. Vijay Thangamariappan, R&D engineer at Advantest, explains how to develop models for automating optical inspection, using a multi-thousand pin socket as an example for how machine learning has helped reduce the return rate due to defects from 2% down to zero. He also explains how to achieve t... » read more

Optimizing Vmin With Path Margin Monitors
By Ash Patel - 24 Oct, 2022 - Comments: 0

By Firooz Massoudi and Ash Patel Choosing the right operating voltage for various digital blocks within a semiconductor device is one of the most important tasks faced by chip designers. Operating voltage has major effects on performance, power consumption, and reliability. Increasing the voltage generally increases performance, but at the cost of more power and higher lifetime operating cos... » read more

Why Silent Data Errors Are So Hard To Find
By Anne Meixner - 11 Oct, 2022 - Comments: 1

Cloud service providers have traced the source of silent data errors to defects in CPUs — as many as 1,000 parts per million — which produce faulty results only occasionally and under certain micro-architectural conditions. That makes them extremely hard to find. Silent data errors (SDEs) are random defects produced in manufacturing, not a design bug or software error. Those defects gene... » read more

Yield Is Top Issue For MicroLEDs
By Laura Peters - 11 Oct, 2022 - Comments: 0

MicroLED display makers are marching toward commercialization, with products such as Samsung’s The Wall TV and Apple’s smart watch expected to be in volume production next year or in 2024. These tiny illuminators are the hot new technology in the display world, enabling higher pixel density, better contrast, lower power consumption, and higher luminance in direct sunlight — while consu... » read more

Bump Co-Planarity And Inconsistencies Cause Yield, Reliability Issues
By Karen Heyman - 11 Oct, 2022 - Comments: 0

Bumps are a key component in many advanced packages, but at nanoscale levels making sure all those bumps have a consistent height is an increasing challenge. Without co-planarity, surfaces may not properly adhere. That can reduce yield if the problem is not identified in packaging, or it can cause reliability problems in the field. Identifying those issues requires a variety of process steps... » read more

Heterogeneous Integration: Exposing Large Panels With Fewer Shots
By John Chang - 11 Oct, 2022 - Comments: 0

By John Chang, with Corey Shay, James Webb, and Timothy Chang The More than Moore era is upon us, as manufacturers increasingly turn to back-end advances to meet the next-generation device performance gains of today and tomorrow. In the advanced packaging space, heterogeneous integration is one tool helping accomplish these gains by combining multiple silicon nodes and designs inside one pac... » read more

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