category: Test, Measurement and Analytics

category: IoT, Security & Automotive

Supply Chain Security And Counterfeit Detection Using Universal Chip Telemetry (UCT)
By proteanTecs - 09 Aug, 2022 - Comments: 0

The recent shortage of chip supply and long lead times prompted system makers to turn to second tier suppliers and distributors for fulfilling their semiconductor needs. This in turn has put the spotlight on the growing concern of fraudulent or counterfeited Integrated Circuits (ICs). Proteus deep data analytics based on Universal Chip Telemetry (UCT) provides a new approach to supply chain ... » read more

Improving Yield With Machine Learning
By Laura Peters - 12 Jul, 2022 - Comments: 0

Machine learning is becoming increasingly valuable in semiconductor manufacturing, where it is being used to improve yield and throughput. This is especially important in process control, where data sets are noisy. Neural networks can identify patterns that exceed human capability, or perform classification faster. Consequently, they are being deployed across a variety of manufacturing proce... » read more

Software Infrastructure For Silicon Lifecycle Management
By Siemens EDA - 12 Jul, 2022 - Comments: 0

Semiconductor technology continues to deliver higher levels of logic density in the era of nanometer processes. System-on-chip (SoC) teams can deliver even higher functionality when coupled with the massive integration possibilities of three-dimensional integrated circuit (3DIC) architectures. However, this growth must be matched by increases in capabilities and productivity in the collection a... » read more

Up And Away: Clear-Eyed Considerations For Your Cloud-Adoption Journey
By Miki Banatwala - 12 Jul, 2022 - Comments: 0

It’s no secret the cloud is a driving force powering the digital transformation. However, cloud adoption is rarely a one-size-fits-all operation. Even when done correctly, it can bring about company-wide transformations unique to each organization. At the very core, the move to the cloud is akin to a culture change, and understanding these changes can make the transition successful. The follo... » read more

Finding Frameworks For End-To-End Analytics
By Anne Meixner - 12 Jul, 2022 - Comments: 0

End-to-end analytics can improve yield and ROI on tool purchases, but reaping those benefits will require common data formats, die traceability, an appropriate level of data granularity — and a determination of who owns what data. New standards, guidelines, and consortium efforts are being developed to remove these barriers to data sharing for analytics purposes. But the amount of work req... » read more

Minimizing Execution Risk In Test Solution Development
By David Ducrocq - 12 Jul, 2022 - Comments: 0

Test development projects are a mix of engineering disciplines with a complex and interdependent ecosystem. The ability to assess risks and their impact on the entire project can be the difference between success and failure. A technical project lead provides a single point of responsibility for assessing technical risk across the project, developing mitigation plans, and driving countermeasure... » read more

E-beam’s Role Grows For Detecting IC Defects
By Karen Heyman - 12 Jul, 2022 - Comments: 1

The perpetual march toward smaller features, coupled with growing demand for better reliability over longer chip lifetimes, has elevated inspection from a relatively obscure but necessary technology into one of the most critical tools in fab and packaging houses. For years, inspection had been framed as a battle between e-beam and optical microscopy. Increasingly, though, other types of insp... » read more

Leverage Functional Interfaces For High-Speed Test Access During All Phases Of The Silicon Lifecycle
By Ash Patel - 12 Jul, 2022 - Comments: 0

Chip testing used to be straightforward. The development team used fault simulation to select a subset of the functional tests that could detect most possible manufacturing faults. These were translated to test patterns that ran on automated test equipment (ATE) to screen out defective dies at wafer test and bad packaged chips in final test. Lots of new technology was introduced over time, incl... » read more

Elevating Production Testing With Deep Data Analytics And ACS At The Edge And Cloud
By proteanTecs - 12 Jul, 2022 - Comments: 0

The level of system integration continues to increase at a rate of greater than 30% per year — fueled by the industry’s desire for increased capability, advanced process nodes, and "more than Moore" packaging techniques. Co-optimization of the hardware and software have also been required not only at the design stage, but at test and in the field. This white paper will present how to ele... » read more

Chip Data Joins The Party
By Richard Oxland - 12 Jul, 2022 - Comments: 0

Perhaps you’ve heard of silicon lifecycle management (product lifecycle management for your semiconductor) but considered it a “far-future” practice that you can safely ignore for now. While many pieces of a complete silicon lifecycle solutions (SLS) are not yet in place, the components are coming together every day. Today, in fact, Siemens’ Tessent offers a new suite of software ser... » read more

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