Research Bits: Sept. 24


Modeling negative capacitance Researchers from Lawrence Berkeley National Laboratory developed an open-source 3D simulation framework capable of modeling the atomistic origins of negative capacitance in ferroelectric thin films at the device level. When a material has negative capacitance, it can store a greater amount of electrical charge at lower voltages. The team believes the FerroX fra... » read more

Chip Industry Technical Paper Roundup: Sept. 24


New technical papers recently added to Semiconductor Engineering’s library: [table id=358 /] More ReadingTechnical Paper Library home » read more

Research Bits: Sept. 17


DNA data storage plus compute Researchers from North Carolina State University and Johns Hopkins University created a DNA-based device that can perform both data storage and computing functions. “Specifically, we have created polymer structures that we call dendricolloids – they start at the microscale, but branch off from each other in a hierarchical way to create a network of nanoscal... » read more

Chip Industry Technical Paper Roundup: Sept. 17


New technical papers recently added to Semiconductor Engineering’s library: [table id=356 /] More ReadingTechnical Paper Library home » read more

Research Bits: Sept. 9


All-silicon polarization multiplexer Researchers from the University of Adelaide and Osaka University propose an ultra-wideband integrated terahertz polarization (de)multiplexer implemented on a substrateless silicon base, which they tested in the sub-terahertz J-band (220-330 GHz) for 6G communications. “Our proposed polarization multiplexer will allow multiple data streams to be transmi... » read more

Chip Industry Technical Paper Roundup: Sept. 9


New technical papers recently added to Semiconductor Engineering’s library: [table id=354 /] More ReadingTechnical Paper Library home » read more

Research Bits: Sept. 3


3D printing of specialized antennas, sensors Researchers from the National University of Singapore developed a 3D printing technique that can be used to create three dimensional, self-healing electronic circuits. Called tension-driven CHARM3D, the technique enables the 3D printing of free-standing metallic structures without requiring support materials and external pressure. It uses Field�... » read more

Chip Industry Technical Paper Roundup: Sept. 3


New technical papers recently added to Semiconductor Engineering’s library: [table id=256 /] More ReadingTechnical Paper Library home » read more

Security Technical Paper Roundup: Aug. 27


A number of hardware security-related technical papers were presented at the August 2024 USENIX Security Symposium. The organization provides open access research, and the presentation slides and papers are free to the public. Topics include side-channel attacks and defenses, embedded security, fuzzing, fault injection, logic locking, Rowhammer, and more. Here are some highlights with associate... » read more

Research Bits: Aug. 27


Ammonia-free GaN Researchers from Nagoya University discovered a way to grow gallium nitride (GaN) semiconductors without using ammonia. The process is both more environmentally friendly and allows for high-quality growth of crystals at a lower cost. Metal organic chemical vapor deposition (MOCVD) is the most common technique for GaN production, which uses ammonia (NH3) gas as the source of... » read more

← Older posts Newer posts →