Chip Industry Technical Paper Roundup: Sept. 17


New technical papers recently added to Semiconductor Engineering’s library: [table id=356 /] More ReadingTechnical Paper Library home » read more

Research Bits: Sept. 9


All-silicon polarization multiplexer Researchers from the University of Adelaide and Osaka University propose an ultra-wideband integrated terahertz polarization (de)multiplexer implemented on a substrateless silicon base, which they tested in the sub-terahertz J-band (220-330 GHz) for 6G communications. “Our proposed polarization multiplexer will allow multiple data streams to be transmi... » read more

Chip Industry Technical Paper Roundup: Sept. 9


New technical papers recently added to Semiconductor Engineering’s library: [table id=354 /] More ReadingTechnical Paper Library home » read more

Research Bits: Sept. 3


3D printing of specialized antennas, sensors Researchers from the National University of Singapore developed a 3D printing technique that can be used to create three dimensional, self-healing electronic circuits. Called tension-driven CHARM3D, the technique enables the 3D printing of free-standing metallic structures without requiring support materials and external pressure. It uses Field�... » read more

Chip Industry Technical Paper Roundup: Sept. 3


New technical papers recently added to Semiconductor Engineering’s library: [table id=256 /] More ReadingTechnical Paper Library home » read more

Security Technical Paper Roundup: Aug. 27


A number of hardware security-related technical papers were presented at the August 2024 USENIX Security Symposium. The organization provides open access research, and the presentation slides and papers are free to the public. Topics include side-channel attacks and defenses, embedded security, fuzzing, fault injection, logic locking, Rowhammer, and more. Here are some highlights with associate... » read more

Research Bits: Aug. 27


Ammonia-free GaN Researchers from Nagoya University discovered a way to grow gallium nitride (GaN) semiconductors without using ammonia. The process is both more environmentally friendly and allows for high-quality growth of crystals at a lower cost. Metal organic chemical vapor deposition (MOCVD) is the most common technique for GaN production, which uses ammonia (NH3) gas as the source of... » read more

Chip Industry Technical Paper Roundup: August 20


New technical papers recently added to Semiconductor Engineering’s library: [table id=252 /] More ReadingTechnical Paper Library home » read more

Research Bits: Aug. 20


EUV mirror interference lithography Researchers from the Paul Scherrer Institute developed an EUV lithography technique that can produce conductive tracks with a separation of just five nanometers by exposing the sample indirectly rather than directly. Called EUV mirror interference lithography (MIL), the technique uses two mutually coherent beams that are reflected onto the wafer by two id... » read more

Chip Industry Technical Paper Roundup: August 13


New technical papers recently added to Semiconductor Engineering’s library: [table id=249 /] More ReadingTechnical Paper Library home   » read more

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