Processing-in-DRAM; co-packaged optics; SOT-MRAM development; efficient wearables; open-source heterogeneous SoCs for AI; Cu–Cu bonding reliability; multifunctional 2D FETs; wafer defect classification.
New technical papers recently added to Semiconductor Engineering’s library:
| Technical Paper | Research Organizations |
|---|---|
| Memory-Centric Computing: Recent Advances in Processing-in-DRAM | ETH Zurich |
| Next generation Co-Packaged Optics Technology to Train & Run Generative AI Models in Data Centers and Other Computing Applications | IBM |
| Recent progress in spin-orbit torque magnetic random-access memory | imec |
| Enabling Efficient Wearables: An Analysis of Low-Power Microcontrollers for Biomedical Applications | EPFL |
| Open-Source Heterogeneous SoCs for AI: The PULP Platform Experience | University of Bologna |
| Ammonia Plasma Surface Treatment for Enhanced Cu–Cu Bonding Reliability for Advanced Packaging Interconnection |
Myongji University |
| Multifunctional 2D FETs exploiting incipient ferroelectricity in freestanding SrTiO3 nanomembranes at sub-ambient temperatures | Penn State University and University of Minnesota |
| Semi-Supervised Learning with Wafer-Specific Augmentations for Wafer Defect Classification | Korea University |
Find all technical papers here.
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