tag: University of Minnesota

Chip Industry Week In Review
By The SE Staff - 12 Jul, 2024 - Comments: 0

The U.S. Department of Commerce issued a notice of intent  to fund new R&D activities to establish and accelerate domestic advanced packaging capacity. CHIPS for America expects to award up to $1.6 billion in funding innovation across five R&D areas, as outlined in the vision for the National Advanced Packaging Manufacturing Program (NAPMP), with about $150 million per award in each... » read more

Chip Industry Week In Review
By The SE Staff - 07 Jun, 2024 - Comments: 0

Rapidus and IBM are jointly developing mass production capabilities for chiplet-based advanced packages. The collaboration builds on an existing agreement to develop 2nm process technology. Vanguard and NXP will jointly establish VisionPower Semiconductor Manufacturing Company (VSMC) in Singapore to build a $7.8 billion, 12-inch wafer plant. This is part of a global supply chain shift “Out... » read more

Startup Funding: February 2024
By Jesse Allen - 06 Mar, 2024 - Comments: 0

A startup developing AI chips dedicated to low-power AI inferencing captured one of the largest rounds of February. The startup, Recogni, already offers a low-power vision inferencing chip. Several other sizeable rounds were focused on the automotive space, with robotaxis, autonomous delivery, and the sensors that enable them. Another active area, power electronics drew funding for several c... » read more

Chip Industry Week In Review
By The SE Staff - 02 Feb, 2024 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan. Cadence introduced an AI-based thermal stress and analysis platform aimed at 2.5D and 3D-ICs, and cooling for PCBs and electronic assemblies. The company also debuted a HW/SW accelerated digital twin solution for multi-physics system design and analysis, combining GPU-resident computational fluid dynamics (CFD) solvers with dedicated GPU hardwar... » read more

Startup Funding: November 2023
By Jesse Allen - 06 Dec, 2023 - Comments: 0

November was a banner month for quantum computing startups, with two raising rounds of $100 million for their superconducting and silicon spin qubit technology. Another significant round went to a company developing photonic-based systems. Several other companies drew funding, including one applying quantum sensors to semiconductor inspection. Sizeable funding also went to an autonomous tran... » read more

Chip Industry Talent Shortage Drives Academic Partnerships
By Liz Allan - 16 Oct, 2023 - Comments: 0

Universities around the world are forming partnerships with semiconductor companies and governments to help fill open and future positions, to keep curricula current and relevant, and to update and expand skills for working engineers. Talent shortages repeatedly have been cited as the number one challenge for the chip industry. Behind those concerns are several key drivers, and many more dom... » read more

A Microfluidics Device That Can Perform ANN Computation On Data Stored In DNA
By Technical Paper Link - 06 Sep, 2023 - Comments: 0

A technical paper titled “Neural network execution using nicked DNA and microfluidics” was published by researchers at University of Minnesota Twin-Cities and Rochester Institute of Technology. Abstract: "DNA has been discussed as a potential medium for data storage. Potentially it could be denser, could consume less energy, and could be more durable than conventional storage media such a... » read more

Chip Industry’s Technical Paper Roundup: August 9
By Liz Allan - 09 Aug, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=124 /] More Reading Technical Paper Library home » read more

How Band Nesting Can Achieve Near-Perfect Optical Absorption In Just Two Layers Of TMD Materials
By Technical Paper Link - 02 Aug, 2023 - Comments: 0

A technical paper titled “Achieving near-perfect light absorption in atomically thin transition metal dichalcogenides through band nesting” was published by researchers at University of Minnesota, University of Notre Dame, and Korea Advanced Institute of Science and Technology (KAIST). Abstract: "Near-perfect light absorbers (NPLAs), with absorbance, λ, of at least 99%, have a wide ... » read more

Chip Industry’s Technical Paper Roundup: July 24
By Liz Allan - 24 Jul, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=119 /] More Reading Technical Paper Library home » read more

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