Chip Industry Week In Review


Rapidus and IBM are jointly developing mass production capabilities for chiplet-based advanced packages. The collaboration builds on an existing agreement to develop 2nm process technology. Vanguard and NXP will jointly establish VisionPower Semiconductor Manufacturing Company (VSMC) in Singapore to build a $7.8 billion, 12-inch wafer plant. This is part of a global supply chain shift “Out... » read more

Startup Funding: February 2024


A startup developing AI chips dedicated to low-power AI inferencing captured one of the largest rounds of February. The startup, Recogni, already offers a low-power vision inferencing chip. Several other sizeable rounds were focused on the automotive space, with robotaxis, autonomous delivery, and the sensors that enable them. Another active area, power electronics drew funding for several c... » read more

Chip Industry Week In Review


By Jesse Allen, Gregory Haley, and Liz Allan. Cadence introduced an AI-based thermal stress and analysis platform aimed at 2.5D and 3D-ICs, and cooling for PCBs and electronic assemblies. The company also debuted a HW/SW accelerated digital twin solution for multi-physics system design and analysis, combining GPU-resident computational fluid dynamics (CFD) solvers with dedicated GPU hardwar... » read more

Startup Funding: November 2023


November was a banner month for quantum computing startups, with two raising rounds of $100 million for their superconducting and silicon spin qubit technology. Another significant round went to a company developing photonic-based systems. Several other companies drew funding, including one applying quantum sensors to semiconductor inspection. Sizeable funding also went to an autonomous tran... » read more

Chip Industry Talent Shortage Drives Academic Partnerships


Universities around the world are forming partnerships with semiconductor companies and governments to help fill open and future positions, to keep curricula current and relevant, and to update and expand skills for working engineers. Talent shortages repeatedly have been cited as the number one challenge for the chip industry. Behind those concerns are several key drivers, and many more dom... » read more

A Microfluidics Device That Can Perform ANN Computation On Data Stored In DNA


A technical paper titled “Neural network execution using nicked DNA and microfluidics” was published by researchers at University of Minnesota Twin-Cities and Rochester Institute of Technology. Abstract: "DNA has been discussed as a potential medium for data storage. Potentially it could be denser, could consume less energy, and could be more durable than conventional storage media such a... » read more

Chip Industry’s Technical Paper Roundup: August 9


New technical papers recently added to Semiconductor Engineering’s library: [table id=124 /] More Reading Technical Paper Library home » read more

How Band Nesting Can Achieve Near-Perfect Optical Absorption In Just Two Layers Of TMD Materials


A technical paper titled “Achieving near-perfect light absorption in atomically thin transition metal dichalcogenides through band nesting” was published by researchers at University of Minnesota, University of Notre Dame, and Korea Advanced Institute of Science and Technology (KAIST). Abstract: "Near-perfect light absorbers (NPLAs), with absorbance, λ, of at least 99%, have a wide ... » read more

Chip Industry’s Technical Paper Roundup: July 24


New technical papers recently added to Semiconductor Engineering’s library: [table id=119 /] More Reading Technical Paper Library home » read more

Topological Semimetal Synthesized Thin Film That Can Increase Power and Memory Storage While Using Less Energy


A technical paper titled "Robust negative longitudinal magnetoresistance and spin-orbit torque in sputtered Pt3Sn and Pt3SnxFe1-x topological semimetal" was published by researchers at University of Minnesota. Abstract: "Contrary to topological insulators, topological semimetals possess a nontrivial chiral anomaly that leads to negative magnetoresistance and are hosts to both conductive bulk ... » read more

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