Chip Industry Technical Paper Roundup: July 16


New technical papers recently added to Semiconductor Engineering’s library. [table id=244 /] More ReadingTechnical Paper Library home   » read more

Research Bits: July 16


Kirigami-inspired mechanical computer Researchers from North Carolina State University developed a kirigami-inspired mechanical computer that uses a complex structure of rigid, interconnected polymer cubes to store, retrieve, and erase data without relying on electronic components. The system uses 1-centimeter plastic cubes, grouped into functional units consisting of 64 interconnected cubes. ... » read more

2D UltraLow Temperatures, High Performance Quantum


A new technical paper titled "Electrically tunable giant Nernst effect in two-dimensional van der Waals heterostructures" was published by researchers at EPFL and National Institute for Materials Science (Japan). Abstract "The Nernst effect, a transverse thermoelectric phenomenon, has attracted significant attention for its potential in energy conversion, thermoelectrics and spintronics. ... » read more

Research Bits: May 28


Nanofluidic memristive neural networks Engineers from EPFL developed a functional nanofluidic memristive device that relies on ions, rather than electrons and holes, to compute and store data. “Memristors have already been used to build electronic neural networks, but our goal is to build a nanofluidic neural network that takes advantage of changes in ion concentrations, similar to living... » read more

Research Bits: May 21


Lithium tantalate PICs Researchers at EPFL and Shanghai Institute of Microsystem and Information Technology developed scalable photonic integrated circuits (PICs) based on lithium tantalate (LiTaO3). Lithium tantalate can provide excellent electro-optic qualities and is used in telecom 5G RF filters. The team developed a wafer-bonding method for lithium tantalate, which is compatible with s... » read more

Chip Industry Week In Review


President Biden will raise the tariff rate on Chinese semiconductors from 25% to 50% by 2025, among other measures to protect U.S. businesses from China’s trade practices. Also, as part of President Biden’s AI Executive Order, the Administration released steps to protect workers from AI risks, including human oversight of systems and transparency about what systems are being used. Intel ... » read more

Chip Industry Technical Paper Roundup: May 7


New technical papers added to Semiconductor Engineering’s library this week. [table id=223 /] More ReadingTechnical Paper Library home » read more

Chip Industry Week In Review


Samsung and Synopsys collaborated on the first production tapeout of a high-performance mobile SoC design, including CPUs and GPUs, using the Synopsys.ai EDA suite on Samsung Foundry's gate-all-around (GAA) process. Samsung plans to begin mass production of 2nm process GAA chips in 2025, reports BusinessKorea. UMC developed the first radio frequency silicon on insulator (RF-SOI)-based 3D IC ... » read more

Distributing RTL Simulation Across Thousands Of Cores On 4 IPU Sockets (EPFL)


A technical paper titled “Parendi: Thousand-Way Parallel RTL Simulation” was published by researchers at EPFL. Abstract: "Hardware development relies on simulations, particularly cycle-accurate RTL (Register Transfer Level) simulations, which consume significant time. As single-processor performance grows only slowly, conventional, single-threaded RTL simulation is becoming less practical... » read more

Voltage Reference Architectures For Harsh Environments: Quantum Computing And Space


A technical paper titled “Cryo-CMOS Voltage References for the Ultrawide Temperature Range From 300 K Down to 4.2 K” was published by researchers at Delft University of Technology, QuTech, Kavli Institute of Nanoscience Delft, and École Polytechnique Fédérale de Lausanne (EPFL). Abstract: "This article presents a family of sub-1-V, fully-CMOS voltage references adopting MOS devices in ... » read more

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