Chip Industry Technical Paper Roundup: Sept 8


New technical papers recently added to Semiconductor Engineering’s library: [table id=471 /] Find more semiconductor research papers here. » read more

Wafer-Scale Heterogeneous Integration of Lithium Tantalate Films on Low-Loss Silicon Nitride Photonic ICs (EPFL, KIT, CAS, IPQ)


A new technical paper titled "Heterogeneously integrated lithium tantalate-on-silicon nitride modulators for high-speed communications" was published by researchers at EPFL, Chinese Academy of Sciences, IPQ and KIT. Abstract "Driven by the prospects of higher bandwidths for optical interconnects, integrated modulators involving materials beyond those available in silicon manufacturing incre... » read more

Chip Industry Technical Paper Roundup: August 26


New technical papers recently added to Semiconductor Engineering’s library: [table id=467 /] Find more semiconductor research papers here. » read more

Research Bits: August 26


THz-optical converter Researchers from École Polytechnique Fédérale de Lausanne (EPFL) and Harvard University designed a chip that can convert between electromagnetic pulses in the terahertz and optical ranges on the same device. Applications include communication, sensing, spectroscopy, and computing. The design embeds micron-sized transmission lines into a lithium niobate photonic chip... » read more

Wire-Friendly Domain-Specific Processor for Angstrom-Era Nodes with High Core Density (Politecnico di Torino, imec et al.)


A new technical paper titled "Physical Design Exploration of a Wire-Friendly Domain-Specific Processor for Angstrom-Era Nodes" was published by researchers at Politecnico di Torino, EPFL, National Technical University of Athens and imec. Abstract "This paper presents the physical design exploration of a domain-specific processor (DSIP) architecture targeted at machine learning (ML), address... » read more

Chip Industry Week in Review


Intel reported flat year-over year revenue for Q2, exceeding Wall Street's pessimistic expectations. In a message to employees, CEO Lip-Bu Tan said the company will: Cut about 15% of its staff, ending the year with about 75,000 employees, down from a high of nearly 132,000 in 2022; Scrap projects in Poland and Germany, consolidate other sites in central America and Southeast Asia, and s... » read more

Chip Industry Technical Paper Roundup: July 22


New technical papers recently added to Semiconductor Engineering’s library: [table id=456 /] Find more semiconductor research papers here.   » read more

Volatile And Non-Volatile NEM Switches Fabricated In A CMOS-Compatible SOI Foundry Platform (KTH, U. of Bristol, EPFL, Imec)


A new technical paper titled "Volatile and non-volatile nano-electromechanical switches fabricated in a CMOS-compatible silicon-on-insulator foundry process" was published by researchers at KTH Royal Institute of Technology, University of Bristol, EPFL, imec, and Ghent University. Abstract "Nanoelectromechanical (NEM) switches have the advantages of zero leakage current, abrupt switching ch... » read more

Chip Industry Week in Review


[Editor's Note: Early edition due to the U.S. July 4th holiday.] The U.S. government lifted export restrictions that barred Synopsys, Siemens EDA, and Cadence from selling EDA tools to China. In a statement, Synopsys said it received a letter from the U.S. Commerce Department immediately rescinding those restrictions. Siemens issued a similar statement. Which tools or hardware accelerated t... » read more

Chip Industry Technical Paper Roundup: May 20


New technical papers recently added to Semiconductor Engineering’s library: [table id=432 /] Find more semiconductor research papers here. » read more

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