Thermal issues related to hybrid bonding of 3D-stacked HBM; GAA metrology; data center architecture for LLMs; CPU fuzzers; planarization for layouts in advanced nodes; rowhammer attacks on GPUs; photonic SRAM for fast IMC; colloidal coordination nanosheets; physics-based ASICs; NEM switches in a SOI foundry process.
New technical papers recently added to Semiconductor Engineering’s library:
| Name of Paper | Research Organizations |
|---|---|
| Thermal Issues Related to Hybrid Bonding of 3D-Stacked HBM: A Comprehensive Review | Chungbuk National University |
| 3D Atomic-Scale Metrology of Strain Relaxation and Roughness in Gate-All-Around (GAA) Transistors via Electron Ptychography | Cornell University, ASM and TSMC |
| Scaling Intelligence: Designing Data Centers for Next-Gen Language Models | Intel Corporation and Georgia Tech |
| Encarsia: Evaluating CPU Fuzzers via Automatic Bug Injection | ETH Zurich |
| Reduced Topography After Stop on Nitride (SON) STI CMP Through Improved Post-Bulk Planarity for Diverse Layouts in Advanced Nodes | Fraunhofer IPMS |
| GPUHammer: Rowhammer Attacks on GPU Memories are Practical | University of Toronto |
| X-pSRAM: A Photonic SRAM with Embedded XOR Logic for Ultra-Fast In-Memory Computing | University of Wisconsin–Madison and USC |
| Rationally Engineered Heterometallic Metalladithiolene Coordination Nanosheets with Defined Atomic Arrangements | Tokyo University of Science |
| Solving the compute crisis with physics-based ASICs | Normal Computing Corporation, ARIA, UCSB et al. |
| Volatile and non-volatile nano-electromechanical switches fabricated in a CMOS-compatible silicon-on-insulator foundry process | KTH Royal Institute of Technology, University of Bristol, EPFL, imec, and Ghent University |
Find more semiconductor research papers here.
Leave a Reply