tag: Tokyo University of Science

Research Bits: Dec. 11
By Jesse Allen - 11 Dec, 2024 - Comments: 0

Photonic AI processor Researchers from Massachusetts Institute of Technology (MIT), Enosemi, and Periplous developed a fully integrated photonic processor that can perform all the key computations of a deep neural network optically on the chip. The chip is fabricated using commercial foundry processes and uses three layers of devices that perform linear and nonlinear operations. A particula... » read more

Chip Industry Week In Review
By The SE Staff - 29 Nov, 2024 - Comments: 0

Intel CEO Pat Gelsinger retired on Dec. 1, according to the company. He will be replaced by two interim co-CEOs, David Zinsner, who also continues to serve as CFO  and Michelle Johnston Holthaus, who has been named CEO of Intel Products. In addition, Frank Yeary was named interim executive chairman. Intel has been under pressure investors as non-traditional rivals, including Arm and NVIDIA, co... » read more

Research Bits: April 8
By Jesse Allen - 08 Apr, 2024 - Comments: 0

Annealing processor Researchers from the Tokyo University of Science designed a scalable, fully-coupled annealing processor with 4096 spins on a single board with 36 CMOS chips, with parallelized capabilities for accelerated solving of combinatorial optimization problems. "We want to achieve advanced information processing directly at the edge, rather than in the cloud, or performing prepro... » read more

Research Bits: Jan. 16
By Jesse Allen - 16 Jan, 2024 - Comments: 0

3D stacking of 2D materials Researchers from Penn State University demonstrated monolithic 3D integration with 2D transistors made from 2D semiconductors called transition metal dichalcogenides. The 2D materials have unique electronic and optical properties, including sensitivity to light, making them ideal for use as sensors. “One challenge is the process temperature ceiling of 450 degre... » read more

Research Bits: September 5
By Jesse Allen - 05 Sep, 2023 - Comments: 0

Layered TMD semiconductors Scientists from Tsinghua University investigated fabrication techniques for fabricating and engineering transition metal dichalcogenides (TMDs). By modulating TMDs with various methods, including phase engineering, defect engineering, doping, and alloying, the material class could provide a wide range of alternatives for high-quality layered semiconductors with st... » read more

Chip Industry’s Technical Paper Roundup: July 18
By Liz Allan - 18 Jul, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=118 /] (more…) » read more

Redox-Based Ionic Devices For High-Performance Neuromorphic Computing
By Technical Paper Link - 14 Jul, 2023 - Comments: 0

A technical paper titled "A Redox-Based Ion-Gating Reservoir, Utilizing Double Reservoir States in Drain and Gate Nonlinear Responses" was published by researchers at National Institute for Materials Science (NIMS) and Tokyo University of Science. Abstract: "Herein, physical reservoir computing with a redox-based ion-gating reservoir (redox-IGR) comprising LixWO3 thin film and lithium-ion co... » read more

Week In Review: Design, Low Power
By Jesse Allen - 07 Jul, 2023 - Comments: 0

Worldwide semiconductor industry sales dropped 21% year-over-year in May to $40.7 billion, mostly driven by decreases in the Americas (-22%), Asia Pacific/All Other (-23%), and China (-29%). But there also were hints of a recovery. The three-month moving average showed a 1.7% increase in sales, with the largest increases in China (+3.9%) and Europe (+2%). “Despite continuing market sluggishne... » read more

Chip Industry’s Technical Paper Roundup: Mar. 6
By Linda Christensen - 06 Mar, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=84 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

Fabricating Multi-Walled Carbon Nanotubes On Plastic Film
By Technical Paper Link - 04 Mar, 2023 - Comments: 0

A new technical paper titled "Direct formation of carbon nanotube wiring with controlled electrical resistance on plastic films" was published by researchers at Tokyo University of Science. The paper states, "we have developed a simple method to fabricate multi-walled carbon nanotube (MWNT) wiring on a plastic film at room temperature under atmosphere pressure. By irradiating a MWNT thin fil... » read more

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