Chip Industry’s Technical Paper Roundup: November 6


New technical papers added to Semiconductor Engineering’s library this week. [table id=162 /] More Reading Technical Paper Library home » read more

Research Bits: October 31


Skinlike sensor for robots University of British Columbia engineers with help from researchers from Frontier Robotics, Honda research institute, created a soft sensor that approximates skin. Mostly made of silicone rubber, the sensor uses weak electric fields to sense objects, even at a distance, and can detect forces into and along its surface. The sensor could provide touch sensitivity and d... » read more

Chip Industry’s Technical Paper Roundup: October 31


New technical papers added to Semiconductor Engineering’s library this week. [table id=159 /] More Reading Technical Paper Library home » read more

Research Bits: October 24


Photonic-electronic hardware processes 3D data Researchers from the University of Oxford, University of Muenster, University of Heidelberg, and University of Exeter are developing integrated photonic-electronic hardware capable of processing three-dimensional data, which the team claims boosts data processing parallelism for AI tasks. The researchers added an extra parallel dimension to the... » read more

Chip Industry’s Technical Paper Roundup: October 24


New technical papers added to Semiconductor Engineering’s library this week. [table id=157 /] More Reading Technical Paper Library home » read more

Chip Industry’s Technical Paper Roundup: October 17


New technical papers added to Semiconductor Engineering’s library this week. [table id=155 /] More Reading Technical Paper Library home » read more

Research Bits: October 17


High-entropy multielement ink semiconductors Researchers from Lawrence Berkeley National Laboratory and UC Berkeley developed a high-entropy semiconducting material called ‘multielement ink’ that can be processed at low-temperature or room temperature. “The traditional way of making semiconductor devices is energy-intensive and one of the major sources of carbon emissions,” said Pei... » read more

Chip Industry’s Technical Paper Roundup: October 9


New technical papers added to Semiconductor Engineering’s library this week. [table id=153 /] More Reading Technical Paper Library home » read more

Chip Industry’s Technical Paper Roundup: October 3


New technical papers recently added to Semiconductor Engineering’s library: [table id=150 /] Related Reading Technical Paper Library home » read more

Research Bits: October 3


Growing indium selenide at scale Researchers from the University of Pennsylvania, Brookhaven National Laboratory, and the Air Force Research Laboratory grew the 2D semiconductor indium selenide (InSe) on a full-size, industrial-scale wafer. It can also be deposited at temperatures low enough to integrate with a silicon chip. The team noted that producing large enough films of InSe has prove... » read more

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