Verification Methodologies Evolve, But Slowly

By Brian Bailey - 29 Sep, 2022 - Comments: 0

Semiconductor Engineering sat down to discuss digital twins and what is required to develop and verify new chips across a variety of industries, such as automotive and aerospace, with Larry Lapides, vice president of sales for Imperas Software; Mike Thompson, director of engineering for the verification task group at OpenHW; Paul Graykowski, technical marketing manager for Arteris IP; Shantanu ... » read more

How Mature Are Verification Methodologies?

By Brian Bailey - 14 Sep, 2022 - Comments: 0

Semiconductor Engineering sat down to discuss differences between hardware and software verification and changes and challenges facing the chip industry, with Larry Lapides, vice president of sales for Imperas Software; Mike Thompson, director of engineering for the verification task group at OpenHW; Paul Graykowski, technical marketing manager for Arteris IP; Shantanu Ganguly, vice president o... » read more

Verification Scorecard: How Well Is The Industry Doing?

By Brian Bailey - 25 Aug, 2022 - Comments: 0

Semiconductor Engineering sat down to discuss how well verification tools and methodologies have been keeping up with demand, with Larry Lapides, vice president of sales for Imperas Software; Mike Thompson, director of engineering for the verification task group at OpenHW; Paul Graykowski, technical marketing manager for Arteris IP; Shantanu Ganguly, vice president of product marketing at Caden... » read more

Is Standardization Required For Security?

By Ann Mutschler - 04 Aug, 2022 - Comments: 1

Semiconductor Engineering sat down to discuss chip and system security with Mike Borza, fellow and scientist on the security IP team at Synopsys; Lee Harrison, automotive IC test solutions manager at Siemens Digital Industries Software; Jason Oberg, founder and CTO of Cycuity (formerly Tortuga Logic); Nicole Fern, senior security analyst at Riscure; Norman Chang, fellow and CTO of the electroni... » read more

Bespoke Silicon Redefines Custom ASICs

By Ann Mutschler - 28 Jul, 2022 - Comments: 0

Semiconductor Engineering sat down to discuss bespoke silicon and what's driving that customization with Kam Kittrell, vice president of product management in the Digital & Signoff group at Cadence; Rupert Baines, chief marketing officer at Codasip; Kevin McDermott, vice president of marketing at Imperas; Mo Faisal, CEO of Movellus; Ankur Gupta, vice president and general manager of Siemens... » read more

Data Management Evolves

By Ann Mutschler - 19 Jul, 2022 - Comments: 0

Semiconductor Engineering sat down to discuss data management challenges with Jerome Toublanc, business development executive at Ansys; Kam Kittrell, vice president of product management in the Digital & Signoff Group at Cadence; Simon Rance, vice president of marketing at Cliosoft; Rob Conant, vice president of software and ecosystem at Infineon Technologies; and Michael Munsey, senior dir... » read more

Customization, Heterogenous Integration, And Brute Force Verification

By Ed Sperling - 14 Jul, 2022 - Comments: 0

Semiconductor Engineering sat down to discuss why new approaches are required for heterogeneous designs, with Bari Biswas, senior vice president for the Silicon Realization Group at Synopsys; John Lee, general manager and vice president of the Ansys Semiconductor business unit; Michael Jackson, corporate vice president for R&D at Cadence; Prashant Varshney, head of product for Microsoft Azu... » read more

EDA Gaps At The Leading Edge

By Ed Sperling - 29 Jun, 2022 - Comments: 1

Who Benefits From Chiplets, And When

By Ed Sperling - 31 May, 2022 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss new packaging approaches and integration issues with Anirudh Devgan, president and CEO of Cadence; Joseph Sawicki, executive vice president of Siemens EDA; Niels Faché, vice president and general manager at Keysight; Simon Segars, advisor at Arm; and Aki Fujimura, chairman and CEO of D2S. This discussion was held in front of a... » read more

Bridging IC Design, Manufacturing, And In-Field Reliability

By Ed Sperling - 18 May, 2022 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about silicon lifecycle management and how that can potentially glue together design, manufacturing, and devices in the field, with Prashant Goteti, principal engineer at Intel; Rob Aitken, R&D fellow at Arm; Zoe Conroy, principal hardware engineer at Cisco; Subhasish Mitra, professor of electrical engineering and computer sci... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

category: Round Tables

category: IoT, Security & Automotive