category: Round Tables

category: IoT, Security & Automotive

Big Changes Ahead For Analog Design
By Ed Sperling - 06 Nov, 2024 - Comments: 1

Experts at the Table: Semiconductor Engineering sat down to discuss the impact of heterogeneous integration on in-house analog tools, and how that is changing the design process, with Mo Faisal, president and CEO of Movellus; Hany Elhak, executive director of product management at Synopsys; Cedric Pujol, product manager at Keysight; and Pradeep Thiagarajan, principal product manager for custom ... » read more

RISC-V Conformance
By Brian Bailey - 31 Oct, 2024 - Comments: 0

Experts At The Table: Despite growing excitement and participation in the development of the RISC-V ecosystem, significant holes remain in the development flow. One of the most concerning is conformance, which must exist before software portability becomes possible. Semiconductor Engineering discussed the issue with John Min, vice president of customer service at Arteris; Zdeněk Přikryl, CTO... » read more

Monolithic Vs. Heterogeneous Integration
By Ed Sperling - 24 Oct, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss two very different paths forward for semiconductors and what's needed for each, with Jamie Schaeffer, vice president of product management at GlobalFoundries; Dechao Guo, director of advanced logic technology R&D at IBM; Dave Thompson, vice president at Intel; Mustafa Badaroglu, principal engineer at Qualcomm; and Thomas Po... » read more

Unbundling Analog From Digital Where It Makes Sense
By Ed Sperling - 17 Oct, 2024 - Comments: 0

Semiconductor Engineering sat down to discuss what's changing in analog design with the shift toward heterogeneous integration and more safety- and mission-critical applications with Mo Faisal, president and CEO of Movellus; Hany Elhak, executive director of product management at Synopsys; Cedric Pujol, product manager at Keysight; and Pradeep Thiagarajan, principal product manager for custom I... » read more

New Challenges In IC Reliability
By Ed Sperling - 15 Oct, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss reliability of chips, how it is changing, and where the new challenges are, with Steve Pateras, vice president of marketing and business development at Synopsys; Noam Brousard, vice president of solutions engineering at proteanTecs; Harry Foster, chief verification scientist at Siemens EDA; and Jerome Toublanc, high-tech soluti... » read more

Barriers To Chiplet Sockets
By Brian Bailey - 30 Sep, 2024 - Comments: 0

Experts At The Table: Demand for chiplets is growing, but debate continues about whether standards and general-purpose chiplets will kick-start the commercialization boom, or whether success will come through customization of those chiplets. Semiconductor Engineeering sat down to discuss these and other related issues with Elad Alon, CEO of Blue Cheetah; Mark Kuemerle, vice president of technol... » read more

Devising Security Solutions For Hardware Threats
By Adam Kovac - 25 Sep, 2024 - Comments: 0

Experts At The Table: Hardware security has evolved considerably in recent years, but getting products to market is a challenge in an environment where threats are always evolving and rarely predictable. That’s especially true given the sheer volume and variety of products being introduced. Semiconductor Engineering sat down with a panel of experts at the Design Automation Conference in San F... » read more

What Comes After HBM For Chiplets
By Brian Bailey - 18 Sep, 2024 - Comments: 0

Experts At The Table: Semiconductor Engineering sat down to discuss what will trigger the creation of a commercial chiplet marketplace, and what those chiplet-based designs will look like, with Elad Alon, CEO of Blue Cheetah; Mark Kuemerle, vice president of technology at Marvell; Kevin Yee, senior director of IP and ecosystem marketing at Samsung; Sailesh Kumar, CEO of Baya Systems; and Tanuja... » read more

Striking A Balance On Efficiency, Performance, And Cost
By Ed Sperling - 11 Sep, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss power-related issues such as voltage droop, application-specific processing elements, the impact of physical effects in advanced packaging, and the benefits of backside power delivery, with Hans Yeager, senior principal engineer, architecture, at Tenstorrent; Joe Davis, senior director for Calibre interfaces and EM/IR product m... » read more

Defining The Chiplet Socket
By Brian Bailey - 29 Aug, 2024 - Comments: 0

Experts At The Table: The semiconductor industry has been buzzing with the possibilities surrounding chiplets, but so far this packaging technology has been confined to large semiconductor companies that are vertically integrated. The industry has been attempting to open this up to a broader group of people. To work out what this means for chiplets, and what standardization will be required, Se... » read more

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