category: Special Reports

category: IoT, Security & Automotive

Where Are The Autonomous Cars?
By Marie C. Baca - 08 Aug, 2022 - Comments: 0

Are we there yet? Governments, consumers, and engineers alike want to know how close the automotive world is to producing a fully autonomous Level 5 vehicle. While some experts say such vehicles could hit the road in the next few years, they're a shrinking minority. Most forecasts say a truly self-driving car is at least a decade away — and maybe much longer, because it requires disruptive... » read more

Scaling, Advanced Packaging, Or Both
By Ed Sperling - 01 Aug, 2022 - Comments: 0

Chipmakers are facing a growing number of challenges and tradeoffs at the leading edge, where the cost of process shrinks is already exorbitant and rising. While it's theoretically possible to scale digital logic to 10 angstroms (1nm) and below, the likelihood of a planar SoC being developed at that nodes appears increasingly unlikely. This is hardly shocking in an industry that has heard pr... » read more

Near-Threshold Computing Gets A Boost
By Brian Bailey - 25 Jul, 2022 - Comments: 0

Near-threshold computing has long been used for power-sensitive devices, but some surprising, unrelated advances are making it much easier to deploy. While near-threshold logic has been an essential technique for applications with the lowest power consumption, it always has been difficult to use. That is changing, and while it is unlikely to become a mainstream technique, it is certainly bec... » read more

Hybrid Bonding Moves Into The Fast Lane
By Laura Peters - 21 Jul, 2022 - Comments: 1

The industry’s unquenchable thirst for I/O density and faster connections between chips, particularly logic and cache memory, is transforming system designs to include 3D architectures, and hybrid bonding has become an essential component in that equation. Hybrid bonding involves die-to-wafer or wafer-to-wafer connection of copper pads that carry power and signals and the surrounding diele... » read more

Keeping IC Packages Cool
By Laura Peters and Karen Heyman - 07 Jun, 2022 - Comments: 0

Placing multiple chips into a package side-by-side can alleviate thermal issues, but as companies dive further into die stacking and denser packaging to boost performance and reduce power, they are wrestling with a whole new set of heat-related issues. The shift to advanced packaging enables chipmakers to meet demands for increasing bandwidth, clock speeds, and power density for high perform... » read more

Chip Substitutions Raising Security Concerns
By Ed Sperling - 02 Jun, 2022 - Comments: 0

Substituting chips is becoming more common in the electronics industry as shortages drag on, allowing systems vendors to continue selling everything from cars to manufacturing equipment and printer cartridges without waiting for a commoditized part. But substitutions aren't always an even swap, and they increase security risks in ways that may take years to show up or fully understand. So fa... » read more

How To Optimize A Processor
By Brian Bailey - 26 May, 2022 - Comments: 0

Optimizing any system is a multi-layered problem, but when it involves a processor there are at least three levels to consider. Architects must be capable of thinking across these boundaries because the role of each of the layers must be both understood and balanced. The first level of potential optimization is at the system level. For example, how does data come in and out of the processing... » read more

Big Changes In Embedded Software
By Ann Mutschler - 28 Apr, 2022 - Comments: 0

Every good hardware or software design starts with a structured approach throughout the design cycle, but as chip architectures and applications begin focusing on specific domains and include some version of AI, that structure is becoming more difficult to define. Embedded software, which in the past was written for very narrow functions with a minimal footprint, is increasingly getting blended... » read more

Paving The Way To Chiplets
By Mark LaPedus - 25 Apr, 2022 - Comments: 2

The packaging industry is putting pieces in place to broaden the adoption of chiplets beyond just a few chip vendors, setting the stage for next-generation 3D chip designs and packages. New chiplet standards, and a cost analysis tool for determining the feasibility of a given chiplet-based design, are two new and important pieces. Along with other efforts, the goal is to propel the chiplet m... » read more

Electric Planes Taking Off
By SE Staff - 07 Apr, 2022 - Comments: 0

As the aeronautics industry and aviation startups design and test zero-emissions aircraft, they are solving problems beyond just adapting to fuel sources that cut greenhouse gas emissions. Problems of weight, noise, redundancy, refueling, cost, and turnaround time are being tackled one airline seat at time. Powerful tools can help aircraft designers look at the aircraft system as a whole, fe... » read more

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