category: System-Level Design

category: IoT, Security & Automotive

Blog Review: Jan. 15
By Jesse Allen - 15 Jan, 2025 - Comments: 0

Siemens EDA's Stephen V. Chavez argues that the placement of decoupling capacitors on a PCB can make or break a design's power delivery system and provides some best practices and design considerations, such as ensuring even distribution on a board rather than crowding them around chips. Synopsys' Stelios Diamantidis predicts that in 2025, AI agents will begin collaborating with other AI age... » read more

EDA Revenue Hit Record High In Q3
By Ed Sperling - 14 Jan, 2025 - Comments: 0

EDA and IP revenue increased 8.8% in Q3 2024, dragged down from the double-digit growth of recent quarters by a softening in sales to China, according to the most recent report by SEMI. For more than a decade, China's growth propped up the entire tools industry, reporting consistent double-digit growth growth that reached as high as 40% quarter over quarter. But with ongoing trade restrictio... » read more

Startup Challenges In A Changing EDA World
By Brian Bailey - 13 Jan, 2025 - Comments: 0

The Electronic Design Automation (EDA) industry is a mature industry, but it's also one that is constantly changing. Each process node and packaging technology advancement places new demands and constraints on existing tools. In addition, changing design problems and paradigms transform how design teams operate, and the goals they target. For a relatively small industry, EDA requires a dispr... » read more

Startup Funding: Q4 2024
By Jesse Allen - 08 Jan, 2025 - Comments: 0

The fourth quarter of 2024 saw five mega-rounds of over $100 million. One of the hottest areas continues to be AI hardware, with one company developing RISC-V AI processor IP bringing in nearly $700 million in the largest round for a chip design startup this year. It was far from the only AI startup, however, as several companies gathered support for neuromorphic designs focused on ultra-low po... » read more

Blog Review: Jan. 8
By Jesse Allen - 08 Jan, 2025 - Comments: 0

Cadence's Igor Krause unravels the different Orthogonal Header Content (OHC) types in PCIe 6.0, which work as an extra header for the Transaction Layer Packet (TLP) that incorporates information fields that are needed depending on the TLP type. Siemens EDA's Yunhong Min considers how AI and machine learning are reshaping functional verification workflows from translating specifications to de... » read more

Top Tech Videos Of 2024
By Liz Allan - 31 Dec, 2024 - Comments: 0

In 2024, hot topics included challenges involving chiplets and heterogeneous integration, AI, data management, MCUs, power semis, software-defined vehicles, sensors, adaptive test, yield tracking, safety monitoring, security, and much more. Top 5 most watched videos in 2024: Overlay Optimization In Advanced IC Substrates How To Stop Row Hammer Attacks What’s Changing In DRAM ... » read more

Accelerating Artificial Intelligence Innovation With Concurrent Design Engineering
By Keysight - 20 Dec, 2024 - Comments: 0

Artificial intelligence (AI) is transforming every industry and creating new demands for computing performance, efficiency, and scalability. Designers are creating and deploying AI-dedicated chips to meet these challenges and enable faster and smarter applications across various domains, such as cloud, edge, mobile, automotive, and the Internet of Things (IoT). However, designing AI chips is no... » read more

Calibre DesignEnhancer Design-Stage Layout Modification Improves Power Management Faster And Earlier
By Siemens EDA - 20 Dec, 2024 - Comments: 0

In today’s IC designs, effective power management through layout optimization is crucial for achieving PPA targets. This paper, written by Jeff Wilson, describes how the Calibre DesignEnhancer platform, is used to specifically tackle the EMIR components of power management. DesignEnhancer offers P&R and custom/analog design teams a fast, integrated environment for implementing Calibre-cle... » read more

Design And Verification Issues In 2024
By Brian Bailey - 19 Dec, 2024 - Comments: 0

At the end of each year, I look back over the stories published and those that top the charts in terms of readership. I concentrate on those stories that are about the EDA tools and flows and the factors that are influencing them. These are good indicators of the problems designers and verification teams are facing today, and where they are looking for answers. This year's leading categories... » read more

Introduction Of High Bandwidth Embedded USB2v2 (eUSB2v2) Standard
By Sanjeet Kumar - 19 Dec, 2024 - Comments: 0

Universal Serial Bus (USB) technology is the most popular connector in every computing device, but when it comes to embedded applications, where only a specific device function may be required, the architectural philosophy of the USB technology becomes inefficient. One example could be USB cameras. With increasing user expectations of camera resolution and frame rates, the bandwidth constrai... » read more

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