Audio, Visual Advances Intensify IC Design Tradeoffs


A spike in the number of audio and visual sensors is greatly increasing design complexity in chips and systems, forcing engineers to make tradeoffs that can affect performance, power, and cost. Collectively, these sensors generate so much data that designers must consider where to process different data, how to prioritize it, and how to optimize it for specific applications. The tradeoffs in... » read more

Week In Review: Design, Low Power


Edge, embedded, IoT Renesas Electronics will acquire Reality Analytics, Inc. (Reality AI), a provider of embedded AI and TinyML solutions for advanced non-visual sensing in automotive, industrial, and commercial products. The inference-based AI solutions can be implemented across various endpoint AI applications. “Customers are increasingly demanding highly customized solutions involving emb... » read more

Week In Review: Design, Low Power


Tools, IP, chips Synopsys unveiled a new data-visibility and machine intelligence-guided design optimization solution. DesignDash is complementary to the company's DSO.ai AI-driven design-space-optimization tool and provides a real-time, unified, 360-degree view of all design activities. It uses deep analytics and machine learning to extract and reveal actionable understanding from large amoun... » read more

AI-Powered Verification


With functional verification consuming more time and effort than design, the chip industry is looking at every possible way to make the verification process more effective and more efficient. Artificial intelligence (AI) and machine learning (ML) are being tested to see how big an impact they can have. While there is progress, it still appears to be just touching the periphery of the problem... » read more

Blog Review: June 1


Analog Photonics' Erman Timurdogan, Ren-Jye Shiue, and Mohammad H. Teimourpour, and Ansys' Bozidar Novakovic, Ahsan Alam, and Peter Hallschmid consider the development of photonic process design kits and the importance of choosing a laser model that can optimally satisfy often conflicting requirements between the number of known laser parameters, the model accuracy, and the computational time. ... » read more

Who Benefits From Chiplets, And When


Experts at the Table: Semiconductor Engineering sat down to discuss new packaging approaches and integration issues with Anirudh Devgan, president and CEO of Cadence; Joseph Sawicki, executive vice president of Siemens EDA; Niels Faché, vice president and general manager at Keysight; Simon Segars, advisor at Arm; and Aki Fujimura, chairman and CEO of D2S. This discussion was held in front of a... » read more

Week In Review: Design, Low Power


EnSilica listed on the London Stock Exchange's AIM market under the ticker ENSI. EnSilica designs mixed signal ASICs for system developers in the automotive, industrial, healthcare, and communications markets. It also has a portfolio of core IP covering cryptography, radar and communications systems. AIM is the LSE’s market for small and medium sized growth companies. "In connection with Admi... » read more

How To Optimize A Processor


Optimizing any system is a multi-layered problem, but when it involves a processor there are at least three levels to consider. Architects must be capable of thinking across these boundaries because the role of each of the layers must be both understood and balanced. The first level of potential optimization is at the system level. For example, how does data come in and out of the processing... » read more

Is AI Improving A Broken Process?


Verification is fundamentally comparing two models, each derived independently, to find out if there are any different behaviors expressed between the two models. One of those models represents the intended design, and the other is part of the testbench. In an ideal flow, the design model would be derived from the specification, and each stage of the design process would be adding other deta... » read more

Design For Context And Its Impact On EDA


At the recent CEO panel, Ed Sperling used the term “Design for Context” as one of the key trends, identifying what others have referred to as “domain specific” or “workload specific.” The term struck a chord with me, as I see it in many customer meetings across various industry verticals in the context of a specific industry driving requirements for tools and IP. Undoubtedly, semico... » read more

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