category: Communication/Data Movement

category: IoT, Security & Automotive

Leveraging In-Package Wireless Technology To Improve The Thermal Behavior Of 2.5D Chiplet-Based SoP
By Technical Paper Link - 19 Sep, 2023 - Comments: 0

A technical paper titled “REMOTE: Re-thinking Task Mapping on Wireless 2.5D Systems-on-Package for Hotspot Removal” was published by researchers at Swiss Federal Institute of Technology Lausanne (EPFL) and University of Applied Sciences and Arts of Western Switzerland (HES-SO). Abstract Excerpt "In this work, we propose a new task mapping heuristic that leverages in-package wireless t... » read more

Automotive Intrusion Detection Methodologies (TU Denmark)
By Technical Paper Link - 06 Sep, 2023 - Comments: 0

A new technical paper titled "Intrusion Detection in the Automotive Domain: A Comprehensive Review" was published by researchers at DTU Compute Technical University of Denmark Abstract "The automotive domain has realized amazing advancements in communication, connectivity, and automation— and at a breakneck pace. Such advancements come with ample benefits, such as the reduction of traffic... » read more

Flexible Hybrid Electronics: Future Standards For Next-Gen 5G/mmWave Wearable and Conformal Applications
By Technical Paper Link - 15 Aug, 2023 - Comments: 0

A technical paper titled “Additively manufactured flexible on-package phased array antennas for 5G/mmWave wearable and conformal digital twin and massive MIMO applications” was published by researchers at Georgia Institute of Technology. Abstract: "This paper thoroughly investigates material characterization, reliability evaluation, fabrication, and assembly processes of additively manufa... » read more

New Architecture Elements For 5G RF Front-End Modules To Reduce Noise, Improve Efficiency, And Allow Multiple Radio Transmitters
By Technical Paper Link - 15 Aug, 2023 - Comments: 0

A technical paper titled “Circuits for 5G RF front-end modules” was published by researchers at Skyworks Solutions Inc. Abstract: "Worldwide adoption of fourth-generation wireless (4G) long-term evolution (LTE) smartphones and the actual transition to fifth-generation wireless (5G) is the main driving engine for semiconductor industry. 5G is expected to reach high data rate speeds (1 Gbps... » read more

Automotive Lidar: Softening The Trade-off Between Ambiguity Range And Speed 
By Technical Paper Link - 28 Jul, 2023 - Comments: 0

A technical paper titled “Overcoming the limitations of 3D sensors with wide field of view metasurface-enhanced scanning lidar” was published by researchers at Université Côte d’Azur and CRHEA. Abstract: "Lidar, a technology at the heart of autonomous driving and robotic mobility, performs 3D imaging of a complex scene by measuring the time of flight of returning light p... » read more

A Flip-Chip, Co-Packaged With Photodiode, High-speed TIA in 16nm FinFET CMOS
By Technical Paper Link - 20 Jul, 2023 - Comments: 0

A technical paper titled "A 112-Gb/s —8.2-dBm Sensitivity 4-PAM Linear TIA in 16-nm CMOS With Co-Packaged Photodiodes" was published by researchers at University of Toronto, Alphawave IP, and Huawei Technologies Canada. Abstract: "A flip-chip co-packaged linear transimpedance amplifier (TIA) in 16-nm fin field effect transistor (FinFET) CMOS demonstrating 112-Gb/s four-level pulse-amplitude... » read more

NoC Obfuscation For Protecting Against Reverse Engineering Attacks (U. Of Florida)
By Technical Paper Link - 20 Jul, 2023 - Comments: 0

A technical paper titled "ObNoCs: Protecting Network-on-Chip Fabrics Against Reverse-Engineering Attacks" was published by researchers at University of Florida. Abstract: "Modern System-on-Chip designs typically use Network-on-Chip (NoC) fabrics to implement coordination among integrated hardware blocks. An important class of security vulnerabilities involves a rogue foundry reverse-engineeri... » read more

A Chiplet-Based Supercomputer For Generative LLMs That Optimizes Total Cost of Ownership
By Technical Paper Link - 20 Jul, 2023 - Comments: 0

A technical paper titled "Chiplet Cloud: Building AI Supercomputers for Serving Large Generative Language Models" was published by researchers at University of Washington and University of Sydney. Abstract: "Large language models (LLMs) such as ChatGPT have demonstrated unprecedented capabilities in multiple AI tasks. However, hardware inefficiencies have become a significant factor limiting ... » read more

An Efficient Method To Develop, Evaluate, and Demonstrate Connected And Autonomous Driving 
By Technical Paper Link - 14 Jul, 2023 - Comments: 0

A technical paper titled "Vehicle-in-Virtual-Environment (VVE) Method for Autonomous Driving System Development, Evaluation and Demonstration" was published by researchers at Ohio State University. Abstract: "The current approach to connected and autonomous driving function development and evaluation uses model-in-the-loop simulation, hardware-in-the-loop simulation and limited proving ground... » read more

Organic Bioelectronic Device To Record And Transmit Brain Signals Plus Provide Power
By Technical Paper Link - 14 Jul, 2023 - Comments: 0

A technical paper titled "Integrated internal ion-gated organic electrochemical transistors for stand-alone conformable bioelectronics" was published by researchers at Columbia University and Columbia University Medical Center. Abstract: "Organic electronics can be biocompatible and conformable, enhancing the ability to interface with tissue. However, the limitations of speed and integration ... » read more

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