category: Manufacturing

category: IoT, Security & Automotive

Attenuated Phase Shift Masks (attPSM) For EUV (Fraunhofer IISB)
By Technical Paper Link - 08 Jul, 2022 - Comments: 0

New research paper titled "Attenuated phase shift masks: a wild card resolution enhancement for extreme ultraviolet lithography?," from researchers at Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB (Germany). Aim: "We review published research on attenuated phase shift masks (attPSM) for EUV with special emphasis on modeling and fundamental understanding of the ... » read more

One Transistor Process-in-Memory Device Strategy w/ Multi-Functional Multi-Gate One-transistor (MGT) Design of Multiple Electrodes
By Technical Paper Link - 04 Jul, 2022 - Comments: 0

New technical paper titled "Multi-functional multi-gate one-transistor process-in-memory electronics with foundry processing and footprint reduction" from researchers at Ningbo Institute of Materials Technology and Engineering (Chinese Academy of Sciences), Center of Materials Science and Optoelectronics Engineering (University of Chinese Academy of Sciences), Shanghai Institute of Microsystem ... » read more

Thermal Management Challenges and Requirements of 3 types of Microelectronic Devices
By Technical Paper Link - 20 Jun, 2022 - Comments: 0

New technical paper titled "A Review on Transient Thermal Management of Electronic Devices" from researchers at Indian Institute of Technology Bombay. Abstract "Much effort in the area of electronics thermal management has focused on developing cooling solutions that cater to steady-state operation. However, electronic devices are increasingly being used in applications involving time-varyi... » read more

Flexible Microprocessors (FlexiCores)- Natively flexible 4-bit and 8-bit microprocessors optimized for low footprint and yield
By Technical Paper Link - 20 Jun, 2022 - Comments: 0

New research paper titled "FlexiCores: low footprint, high yield, field reprogrammable flexible microprocessors" from researchers at University of Illinois and PragmatIC Semiconductor. Abstract "Flexible electronics is a promising approach to target applications whose computational needs are not met by traditional silicon-based electronics due to their conformality, thinness, or cost requir... » read more

Review of Bumpless Build Cube Using Wafer-on-Wafer & Chip-on-Wafer for Tera-Scale 3D Integration
By Technical Paper Link - 20 Jun, 2022 - Comments: 0

New research paper titled "Review of Bumpless Build Cube (BBCube) Using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI)" from researchers at Tokyo Institute of Technology and others. Abstract "Bumpless Build Cube (BBCube) using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI) is discussed. Bum... » read more

Finding Wafer Defects Using Quantum DL
By Technical Paper Link - 13 Jun, 2022 - Comments: 0

New research paper titled "Semiconductor Defect Detection by Hybrid Classical-Quantum Deep Learning" by researchers at National Tsing Hua University. Abstract "With the rapid development of artificial intelligence and autonomous driving technology, the demand for semiconductors is projected to rise substantially. However, the massive expansion of semiconductor manufacturing and the develo... » read more

Cu/SiO₂ Hybrid Bond Interconnects
By Technical Paper Link - 10 Jun, 2022 - Comments: 0

Technical paper titled "Microstructure Development of Cu/SiO₂ Hybrid Bond Interconnects After Reliability Tests" from researchers at TU Dresden and others. Abstract: "The focus of this study is a detailed characterization of hybrid Cu/SiO 2 wafer-to-wafer bonding interconnects after reliability testing. Hybrid bonding (or direct bond interconnect) is a technology of choice for fine pitch... » read more

High-throughput LHSI Reflectometry Technique For ICU and IWU Measurements of Semiconductor Devices
By Technical Paper Link - 03 Jun, 2022 - Comments: 0

New technical paper titled "Toward realization of high-throughput hyperspectral imaging technique for semiconductor device metrology," from researchers at Samsung Electronics Co. Abstract "Background: High-throughput three-dimensional metrology techniques for monitoring in-wafer uniformity (IWU) and in-cell uniformity (ICU) are critical for enhancing the yield of modern semiconductor manu... » read more

Hybrid Sensing Platform w/Silicon Nanowires on a Fully Functional CMOS Chip Containing the Readout Electronics & Signal amplification
By Technical Paper Link - 03 Jun, 2022 - Comments: 0

New technical paper titled "Multisite Dopamine Sensing With Femtomolar Resolution Using a CMOS Enabled Aptasensor Chip" from TU Dresden, Riken Quantitative Biological Center, Imperial College London, NaMLab gGmbH, ETH Zürich, MaxWell Biosystems AG, TU Wien, and Institute of Radiopharmaceutical Cancer Research. Abstract "Many biomarkers including neurotransmitters are found in external bo... » read more

Improving Atomic Force Microscopy (AFM)
By Technical Paper Link - 17 May, 2022 - Comments: 0

Research paper "Enhancing sensitivity in atomic force microscopy for planar tip-on-chip probes" from Eindhoven University of Technology, Lorraine University and DRF/IRAMIS/SPEC-LEPO, Centre CEA de Saclay. Abstract "We present a new approach to tuning-fork-based atomic force microscopy for utilizing advanced “tip-on-chip” probes with high sensitivity and broad compatibility. Usually, s... » read more

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