category: Test, Measurement & Analytics

category: IoT, Security & Automotive

High-NA EUVL: Automated Defect Inspection Based on SEMI-SuperYOLO-NAS
By Technical Paper Link - 10 Apr, 2024 - Comments: 0

A new technical paper titled "Towards Improved Semiconductor Defect Inspection for high-NA EUVL based on SEMI-SuperYOLO-NAS" was published by researchers at KU Leuven, imec, Ghent University, and SCREEN SPE. Abstract "Due to potential pitch reduction, the semiconductor industry is adopting High-NA EUVL technology. However, its low depth of focus presents challenges for High Volume Manufac... » read more

Benchmarking Electron Holography And Pixelated STEM On Various Semiconductor Structures
By Technical Paper Link - 06 Feb, 2024 - Comments: 0

A technical paper titled “Measuring electrical properties in semiconductor devices by pixelated STEM and off-axis electron holography (or convergent beams vs. plane waves).” was published by researchers at CEA-LETI at the Universite Grenoble Alpes and EPFL. Abstract: "We demonstrate the use of both pixelated differential phase contrast (DPC) scanning transmission electron microscopy (STEM... » read more

An Overview Of Federal Government Semiconductors And Microelectronics Standards Activities (NIST)
By Technical Paper Link - 12 Jan, 2024 - Comments: 0

A technical paper titled “Semiconductors and Microelectronics Standards, Report of the Semiconductors and Microelectronics Working Group” was published by researchers at the National Institute of Standards and Technology (NIST). Abstract: "This report of the Semiconductors and Microelectronics Working Group of the Interagency Committee on Standards Policy (ICSP) provides an overview of Fe... » read more

A Framework For Improving Current Defect Inspection Techniques For Advanced Nodes
By Technical Paper Link - 12 Dec, 2023 - Comments: 0

A technical paper titled “Improved Defect Detection and Classification Method for Advanced IC Nodes by Using Slicing Aided Hyper Inference with Refinement Strategy” was published by researchers at Ghent University, imec, and SCREEN SPE. Abstract: "In semiconductor manufacturing, lithography has often been the manufacturing step defining the smallest possible pattern dimensions. In recent ... » read more

Small-Footprint Engineered Scattering Elements For Polarization Monitoring Of Photonic ICs
By Technical Paper Link - 05 Dec, 2023 - Comments: 0

A technical paper titled “Engineered scattering elements used as optical test points in photonic integrated circuits” was published by researchers at University of Rochester. Abstract: "Efficient packaging of fabricated photonic integrated circuits (PICs) has been a daunting task given the breadth of applications and skill required for scalable manufacturing. One particular challenge has ... » read more

High-Speed Sparse Scanning Kelvin Probe Force Microscopy
By Technical Paper Link - 14 Nov, 2023 - Comments: 0

A technical paper titled “High-speed mapping of surface charge dynamics using sparse scanning Kelvin probe force microscopy” was published by researchers at Oak Ridge National Laboratory, (ORNL), Sungkyunkwan University, Case Western Reserve University, Flinders University, Bedford Park, and UNSW Sydney. Abstract: "Unraveling local dynamic charge processes is vital for progress in diverse... » read more

Modulated Electron Microscopy Applied In The Process Monitoring Of Memory Cell And The Defect Inspection Of Floating Circuits
By Technical Paper Link - 07 Nov, 2023 - Comments: 0

A technical paper titled “In situ electrical property quantification of memory devices by modulated electron microscopy” was published by researchers at Hitachi High-Tech Corporation, KIOXIA Corporation, and Western Digital. Abstract: "E-beam inspection based on voltage-contrast (VC) defect metrology has been widely utilized for failure mode analysis of memory devices. Variation in e-beam... » read more

CPU Fuzzing Via Intricate Program Generation (ETH Zurich)
By Technical Paper Link - 31 Oct, 2023 - Comments: 0

A technical paper titled “Cascade: CPU Fuzzing via Intricate Program Generation” was published by researchers at ETH Zurich. Abstract: "Generating interesting test cases for CPU fuzzing is akin to generating programs that exercise unusual states inside the CPU. The performance of CPU fuzzing is heavily influenced by the quality of these programs and by the overhead of bug detection. Our a... » read more

Predicting Defect Properties In Semiconductors With Graph Neural Networks
By Technical Paper Link - 24 Oct, 2023 - Comments: 0

A technical paper titled “Accelerating Defect Predictions in Semiconductors Using Graph Neural Networks” was published by researchers at Purdue University, Indian Institute of Technology (IIT) Madras, GE Research, and National Institute of Standards and Technology (NIST). Abstract: "Here, we develop a framework for the prediction and screening of native defects and functional impurities i... » read more

Measurement-Induced Quantum Information Phases On Up To 70 Superconducting Qubits (Google/Stanford)
By Technical Paper Link - 24 Oct, 2023 - Comments: 0

A technical paper titled “Measurement-induced entanglement and teleportation on a noisy quantum processor” was published by researchers at Google Quantum AI, Google Research, Stanford University, University of Texas at Austin, Cornell University, University of Massachusetts, University of Connecticut, Auburn University, University of Technology Sydney, University of California, and Columbia... » read more

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