category: Top Stories

category: IoT, Security & Automotive

Lab-To-Fab Testing
By Ed Sperling - 08 Oct, 2018 - Comments: 0

Test equipment vendors are working on integrating testing and simulation in the lab with testing done later in the fab, setting the stage for what potentially could be the most significant change in semiconductor test in years. If they are successful, this could greatly simplify design for test, which has become increasingly difficult as chips get more complex, denser, and as more heterogene... » read more

Automakers Take On More Responsibility
By Kevin Fogarty - 08 Oct, 2018 - Comments: 0

Chip and EDA companies are scrambling to deal with stiff safety regulations and harsh environmental conditions for automotive chips, but automakers are making big changes of their own to ensure all those components work together as expected. The result is a significant shift of responsibilities of companies in the automotive supply chain. Carmakers traditionally have left verification, valid... » read more

Auto Chip Design, Test Changes Ahead
By Kevin Fogarty - 19 Sep, 2018 - Comments: 0

The automotive industry’s unceasing demand for performance, coupled with larger and more complex processors, are driving broad changes in how electronics are designed, verified and tested. What's changing is that these systems, which include AI-oriented logic developed at the most advanced process nodes, need to last several times longer than traditional IT and consumer devices, and they n... » read more

The Race To Zero Defects
By Jeff Dorsch - 10 Sep, 2018 - Comments: 1

By Jeff Dorsch and Ed Sperling Testing chips is becoming more difficult, more time-consuming, and much more critical—particularly as these chips end up in cars, industrial automation, and a variety of edge devices. Now the question is how to provide enough test coverage to ensure that chips will work as expected without slowing down the manufacturing process or driving up costs. Balanci... » read more

Cobalt Shortages Ahead
By Mark LaPedus - 10 Sep, 2018 - Comments: 0

Rapid growth of electric vehicles is creating an enormous demand for cobalt, causing tight supply, high prices and supply chain issues for this critical material. Cobalt is a ferromagnetic metal and one of the key materials used in lithium-ion batteries for cell phones, notebook PCs, battery-electric cars and hybrids. It also is used in alloys and semiconductors. And while the IC industry co... » read more

Old Vs. New Packages
By Jeff Dorsch - 15 Aug, 2018 - Comments: 2

Over the years, the semiconductor industry has witnessed a parade of packaging innovations, such as system-in-package, semiconductor embedded in substrate, and fan-out wafer-level packaging. Two interesting packaging innovations are now being used in the process of miniaturizing microchips and electronics. One is a new concept that combines two tried-and-true technologies. The other is a de... » read more

The Chiplet Race Begins
By Mark LaPedus - 06 Aug, 2018 - Comments: 1

Momentum is building for the development of advanced packages and systems using so-called chiplets, but the technology faces some challenges in the market. A group led by DARPA, as well as Marvell, zGlue and others are pursuing chiplet technology, which is a different way of integrating multiple dies in a package or system. In fact, the Defense Advanced Research Projects Agency (DARPA), part... » read more

Return Of The Organic Interposer
By Ed Sperling - 06 Aug, 2018 - Comments: 2

Organic interposers are resurfacing as an option in advanced packaging, several years after they were first proposed as a means of reducing costs in 2.5D multi-die configurations. There are several reasons why there is a renewed interest in this technology: More companies are pushing up against the limits of Moore's Law, where the cost of continuing to shrinking features is exorbitant. ... » read more

Auto Chip Test Getting Harder
By Kevin Fogarty - 06 Aug, 2018 - Comments: 3

Chipmakers and test/validation companies are helping lead the effort to develop self-driving cars, but they are facing a wide range of technical and even cultural barriers. Advanced driver assist systems (ADAS) already are the most complex systems by far in modern cars, the best of which hover between Level 2 and Level 3 on the five-step autonomy ladder maintained by the Society of Automotiv... » read more

New 5G Hurdles
By Ed Sperling - 01 Aug, 2018 - Comments: 1

Semiconductor Engineering sat down to talk about challenges and progress in 5G with Yorgos Koutsoyannopoulos, president and CEO of Helic; Mike Fitton, senior director of strategic planning and business development at Achronix; Sarah Yost, senior product marketing manager at National Instruments; and Arvind Vel, director of product management at ANSYS. What follows are excerpts of that conversat... » read more

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