category: Top Stories

category: Auto, Security & Edge AI

Inside The New Non-Volatile Memories
By Bryon Moyer - 07 Apr, 2020 - Comments: 0

The search continues for new non-volatile memories (NVMs) to challenge the existing incumbents, but before any technology can be accepted, it must be proven reliable. “Everyone is searching for a universal memory,” says TongSwan Pang, Fujitsu senior marketing manager. "Different technologies have different reliability challenges, and not all of them may be able to operate in automotive g... » read more

Reliability Challenges Grow For 5/3nm
By SE Staff - 07 Apr, 2020 - Comments: 0

Ensuring that chips will be reliable at 5nm and 3nm is becoming more difficult due to the introduction of new materials, new transistor structures, and the projected use of these chips in safety- and mission-critical applications. Each of these elements adds its own set of challenges, but they are being compounded by the fact that many of these chips will end up in advanced packages or modul... » read more

The Need For Traceability In Auto Chips
By Anne Meixner - 07 Apr, 2020 - Comments: 4

Someday your car will drive itself to a repair shop for a recall using a scheduling application that is both efficient and can prioritize which vehicles need to be fixed first. But that's still a ways off. Proactive identification of issues is not yet available. To be ready for that, today’s data analytics systems need to begin supporting targeted recalls, enabling predictive maintenance a... » read more

Test Costs Spiking
By Ed Sperling - 10 Mar, 2020 - Comments: 1

The cost of test is rising as a percentage of manufacturing costs, fueled by concerns about reliability of advanced-node designs in cars and data centers, as well as extended lifetimes for chips in those and other markets. For decades, test was limited to a flat 2% of total manufacturing cost, a formula developed prior to the turn of the Millennium after chipmakers and foundries saw the traj... » read more

Taming Novel NVM Non-Determinism
By Bryon Moyer - 10 Mar, 2020 - Comments: 1

New memory technologies may have non-deterministic characteristics that add calibration to the test burden — and may require recalibration during their lifetime. Many of these memories are in development as a result of the search for a storage-class memory (SCM) technology that can bridge the gap between larger, slower memories like flash and faster DRAM memory. There are several approache... » read more

Grading Chips For Longer Lifetimes
By Ed Sperling - 10 Mar, 2020 - Comments: 0

Figuring out how to grade chips is becoming much more difficult as these chips are used in applications where they are supposed to last for decades rather than just a couple of years. During manufacturing, semiconductors typically are run through a battery of tests involving performance and power, and then priced accordingly. But that is no longer a straightforward process for several reason... » read more

Logic Chip, Heal Thyself
By SE Staff - 11 Feb, 2020 - Comments: 0

If a single fault can kill a logic chip, that doesn’t bode well for longevity of complex multi-chip systems. Obsolescence in chips is not just an industry ploy to sell more chips. It is a fact of physics that chips don’t last more than a few years, especially if overheated, and hit with higher voltage than it can stand. The testing industry does a great job finding defects during manufac... » read more

More Data, More Problems In Automotive
By Anne Meixner - 11 Feb, 2020 - Comments: 0

The race toward increasing levels of autonomy is being hampered by competitive concerns over sharing data across the automotive supply chain. Pushing past the initial ADAS levels into full autonomy is expected to take more than a decade, but the infrastructure for those systems, and making sure all assisted and autonomous vehicles work with other vehicles, is under development today. Still, ... » read more

Failure Analysis Becoming Critical To Reliability
By Ed Sperling - 11 Feb, 2020 - Comments: 0

Failure analysis is rapidly becoming a complex, costly and increasingly time-consuming must-do task as demand rises for reliability across a growing range of devices used in markets ranging from automotive to 5G. From the beginning, failure analysis has been about finding out what went wrong in semiconductor design and manufacturing. Different approaches, tools and equipment have improved ov... » read more

Making 3D Structures And Packages More Reliable
By Ed Sperling - 14 Jan, 2020 - Comments: 0

The move to smaller vertical structures and complex packaging schemes is straining existing testing approaches, particularly in heterogeneous combinations on a single chip and in multi-die packages. The complexity of these devices has exploded with the slowdown in scaling, as chipmakers turn to architectural solutions and new transistor structures rather than just relying on shrinking featur... » read more

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