category: Top Stories

category: IoT, Security & Automotive

Chiplets Gaining Steam
By Ann Mutschler - 06 Nov, 2017 - Comments: 0

Building chips from pre-verified chiplets is beginning to gain traction as a way of cutting costs and reducing time to market for heterogeneous designs. The chiplet concept has been on the drawing board for some time, but it has been viewed more as a possible future direction than a necessary solution. That perception is beginning to change as complexity rises, particularly at advanced nodes... » read more

Where MEMS Can Boldly Go Now
By Jeff Dorsch - 06 Nov, 2017 - Comments: 1

MEMS chips are being designed to go into the human body as biosensors, which will require unique packaging. And as demand grows for assisted and automated driving, MEMS devices also are finding new use cases in automotive electronics, their chief market segment prior to the millennium. Pressure sensors, such as those that monitor the air pressure in tires, remain the biggest type of [getkc i... » read more

Memory Test Challenges, Opportunities
By Jeff Dorsch - 18 Oct, 2017 - Comments: 0

The semiconductor capital equipment market is on fire, and the memory chip test equipment sector is no different. But it is getting much more difficult on the memory side. Memory test vendors are contending with next-generation devices, such as 3D NAND flash memories, HBM2 chips, low-power double-data-rate DRAMs, graphics DRAMs, phase-change memories, magnetoresistive RAMs, and resistive RAM... » read more

Improving Yield, Reliability With Data
By Ann Mutschler - 11 Oct, 2017 - Comments: 0

Big data techniques for sorting through massive amounts of data to identify aberrations are beginning to find a home in semiconductor manufacturing, fueled by new requirements in safety-critical markets such as automotive as well as the rising price of packaged chips in smartphones. Outlier detection—the process of finding data points outside the normal distribution—isn't a new idea. It ... » read more

Toward System-Level Test
By Ed Sperling - 09 Oct, 2017 - Comments: 0

The push toward more complex integration in chips, advanced packaging, and the use of those chips for new applications is turning the test world upside down. Most people think of test as a single operation that is performed during manufacturing. In reality it is a portfolio of separate operations, and the number of tests required is growing as designs become more heterogeneous and as they ar... » read more

Integrated Passives Market Gets Active
By Jeff Dorsch - 09 Oct, 2017 - Comments: 0

Integrated passive devices are seeing greater use within system-in-package technology and numerous applications, including the Internet of Things. The tiny devices are making their way into automotive electronics, consumer electronics, and health-care products, among other uses. Europe is leading the way in supplying IPDs, thanks to offerings from Infineon Technologies, STMicroelectronics, a... » read more

Advanced Packaging’s Progress
By Mark LaPedus - 09 Oct, 2017 - Comments: 0

Shim Il Kwon, CTO at STATS ChipPAC, sat down with Semiconductor Engineering to discuss the current and future trends of chip packaging. What follows are excerpts of that conversation. SE: The outsourced semiconductor assembly and test (OSAT) vendors provide third-party IC-packaging and test services. What are the big challenges for OSATs today? Shim: The OSAT market is very competitive, w... » read more

Plugging Gaps In Advanced Packaging
By Ann Mutschler - 27 Sep, 2017 - Comments: 0

The growing difficulty of cramming more features into an SoC is driving the entire chip industry to consider new packaging options, whether that is a more complex, integrated SoC or some type of advanced packaging that includes multiple chips. Most of the work done in this area so far has been highly customized. But as advanced packaging heads into the mainstream, gaps are beginning to appea... » read more

Light In A Package
By Ed Sperling - 18 Sep, 2017 - Comments: 1

Silicon photonics is gaining significant traction inside the data center, but creating a simpler method of packaging the laser with other circuitry remains a stumbling block for cutting costs and using this technology across a wider swath of applications. Progress does appear to be on the horizon, even though exact time frames remain unclear. The advantages of light in communications are wel... » read more

Get Ready For In-Mold Electronics
By Jeff Dorsch - 11 Sep, 2017 - Comments: 1

Imagine inserting the electronics into a product without using a printed circuit board, a module, or even a system-in-package. That's the promise of in-mold electronics (IME), a technology that has been around for years, but which is just beginning to see wider adoption. The technology is related to conductive inks and transparent conductive films. The IME manufacturing process is said to pr... » read more

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