Software-Defined Hardware Architectures

By Brian Bailey - 31 May, 2023 - Comments: 0

Hardware/software co-design has been a goal for several decades, but success has been limited. More recently, progress has been made in optimizing a processor as well as the addition of accelerators for a given software workload. While those two techniques can produce incredible gains, it is not enough. With increasing demands being placed on all types of processing, single-processor solutio... » read more

Chiplet Planning Kicks Into High Gear

By Ann Mutschler - 25 May, 2023 - Comments: 0

Chiplets are beginning to impact chip design, even though they are not yet mainstream and no commercial marketplace exists for this kind of hardened IP. There are ongoing discussions about silicon lifecycle management, the best way to characterize and connect these devices, and how to deal with such issues as uneven aging and thermal mismatch. In addition, a big effort is underway to improve... » read more

Chip Design CEO Outlook

By Ed Sperling - 25 May, 2023 - Comments: 0

Semiconductor Engineering sat down with Joseph Sawicki, executive vice president for IC EDA at Siemens Digital Industries Software; John Kibarian, president and CEO of PDF Solutions; John Lee, general manager and vice president of Ansys' Semiconductor Business Unit; Niels Faché, vice president and general manager of PathWave Software Solutions at Keysight; Dean Drako, president and CEO of IC M... » read more

IP Becoming More Complex, More Costly

By Brian Bailey - 25 May, 2023 - Comments: 0

Success in the semiconductor intellectual property (IP) market requires more than a good bit of RTL. New advances mandate a complete design, implementation, and verification team, which limits the number of companies competing in this market. What constitutes an IP block has changed significantly since the concept was first introduced in the 1990s. What was initially just a piece of RTL (reg... » read more

Startup Funding: April 2023

By Jesse Allen - 03 May, 2023 - Comments: 0

Packaging was a hot spot in April, with one of the largest rounds going to a middle-end-of-line advanced packaging company. A second packaging company also drew significant funding for its focus on wafer-level packaging for CMOS image sensors. Two packaging substrate manufacturers also saw investment. Two photoresist makers also drew sizeable rounds. Both they and the packaging companies are... » read more

AI Adoption Slow For Design Tools

By Brian Bailey - 01 May, 2023 - Comments: 0

A lot of excitement, and a fair amount of hype, surrounds what artificial intelligence (AI) can do for the EDA industry. But many challenges must be overcome before AI can start designing, verifying, and implementing chips for us. Should AI replace the algorithms in use today, or does it have a different role to play? At the end of the day, AI is a technique that has strengths and weaknesses... » read more

EDA Makes A Frenzied Push Into Machine Learning

By Ed Sperling - 27 Apr, 2023 - Comments: 0

Machine learning is becoming a competitive prerequisite for the EDA industry. Big chipmakers are endorsing and demanding it, and most EDA companies are deploying it for one or more steps in the design flow, with plans to add much more over time. In recent weeks, the three largest EDA vendors have made sweeping announcements about incorporating ML into their tools at their respective user eve... » read more

True 3D-IC Problems

By Brian Bailey - 27 Apr, 2023 - Comments: 0

Placing logic on logic may sound like a small step, but several problems must be overcome to make it a reality. True 3D involves wafers stacked on top of each other in a highly integrated manner. This is very different from 2.5D integration, where logic is placed side-by-side, connected by an interposer. And there are some intermediate solutions today where significant memory is stacked on l... » read more

Designing For In-Circuit Monitors

By Ann Mutschler - 27 Apr, 2023 - Comments: 0

In every application space the semiconductor ecosystem touches, in-circuit monitors and sensors are playing an increasing role in silicon lifecycle management and concepts around reliability and resiliency — both during design as well as in the field. The combination of true system-level design, in/on-chip monitors, and improved data analysis are expected to drastically improve reliability... » read more

Startup Funding: March 2023

By Jesse Allen - 05 Apr, 2023 - Comments: 0

Funding was broadly spread between sectors in March, with automotive edging ahead thanks to a more than $100 million round for a company manufacturing electric, autonomous heavy commercial trucks for freight logistics. To keep up with the amount of information presented by cars and ADAS, several companies raised funds for head-up displays with increasing levels of detail and expanded fields of ... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

category: Top Stories

category: IoT, Security & Automotive

Software-Defined Hardware Architectures

Chiplet Planning Kicks Into High Gear

Chip Design CEO Outlook

IP Becoming More Complex, More Costly

Startup Funding: April 2023

AI Adoption Slow For Design Tools

EDA Makes A Frenzied Push Into Machine Learning

True 3D-IC Problems

Designing For In-Circuit Monitors

Startup Funding: March 2023

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Knowledge Centers
Entities, people and technologies explored