Using 5nm Chips And Advanced Packages In Cars


Semiconductor Engineering sat down to discuss the impact of advanced node chips and advanced packaging on automotive reliability with Jay Rathert, senior director of strategic collaborations at KLA; Dennis Ciplickas, vice president of advanced solutions at PDF Solutions; Uzi Baruch, vice president and general manager of the automotive business unit at OptimalPlus; Gal Carmel, general manager of... » read more

Preventing Chips From Burning Up During Test


It’s become increasingly difficult to manage the heat generated during IC test. Absent the proper mitigations, it’s easy to generate so much heat that probe cards and chips literally can burn up. As a result, implementing temperature-management techniques is becoming a critical part of IC testing. “We talk about systems, saying the system is good,” said Arun Krishnamoorthy, senior... » read more

Cloud Vs. On-Premise Analytics


The immense and growing volume of data generated in chip manufacturing is forcing chipmakers to rethink where to process and store that data. For fabs and OSATs, this decision is not one to be taken lightly. The proprietary nature of yield, performance, and other data, and corporate policies to retain tight control of that data, have so far limited outsourcing to the cloud. But as the amount... » read more

Making Sure AI/ML Works In Test Systems


Artificial intelligence/machine learning is being utilized increasingly to find patterns and outlier data in chip manufacturing and test, improving the overall yield and reliability of end devices. But there are too many variables and unknowns to reliably predict how a chip will behave in the field using just AI. Today, every AI use case — whether a self-driving car or an industrial sortin... » read more

Design Issues For Chips Over Longer Lifetimes


Semiconductor Engineering sat down to discuss the myriad challenges associated with chips used in complex systems over longer periods of time them with Jean-Marie Brunet, senior director for the Emulation Division at Siemens EDA; Frank Schirrmeister, senior group director for solution marketing at Cadence; Maurizio Griva, R&D Manager at Reply; and Laurent Maillet-Contoz, system and architec... » read more

Making Sense Of New Edge-Inference Architectures


New edge-inference machine-learning architectures have been arriving at an astounding rate over the last year. Making sense of them all is a challenge. To begin with, not all ML architectures are alike. One of the complicating factors in understanding the different machine-learning architectures is the nomenclature used to describe them. You’ll see terms like “sea-of-MACs,” “systolic... » read more

Auto OEMs Face New Competitive Threats


Automotive design and manufacturing are undergoing a fundamental shift to the left as cars increasingly are electrified and chips take over more functions formerly done by mechanical parts, setting the stage for massive disruption across a supply chain that has been in place for decades. The success of Tesla — a company that had never actually built a chip or a car — was both a surprise ... » read more

Security Provisioning Moves Out Of The Factory


Security credentials traditionally have been provisioned during chip manufacturing, often as a final part of the testing process. That's starting to change. Logistics management can be improved by pushing that process out — even as far as the on-boarding process. And simpler on-boarding can hide most of the details from the user. “The IT approach to provisioning IoT devices has primar... » read more

Chiplets For The Masses


Chiplets are a compelling technology, but so far they are available only to a select few players in the industry. That's changing, and the industry has taken little steps to get there, but timing for when you will be able to buy a chiplet to integrate into your system remains uncertain. While new fabrication nodes continue to be developed, scaling is coming to an end, be it for physical or e... » read more

Predicting And Avoiding Failures In Automotive Chips


Semiconductor Engineering sat down to discuss automotive electronics reliability with Jay Rathert, senior director of strategic collaborations at KLA; Dennis Ciplickas, vice president of advanced solutions at PDF Solutions; Uzi Baruch, vice president and general manager of the automotive business unit at OptimalPlus; Gal Carmel, general manager of proteanTecs' Automotive Division; Andre van de ... » read more

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