category: Top Stories

category: IoT, Security & Automotive

Fan-Out And Packaging Challenges
By Mark LaPedus - 06 Oct, 2021 - Comments: 2

Semiconductor Engineering sat down to discuss various IC packaging technologies, wafer-level and panel-level approaches, and the need for new materials with William Chen, a fellow at ASE; Michael Kelly, vice president of advanced packaging development and integration at Amkor; Richard Otte, president and CEO of Promex, the parent company of QP Technologies; Michael Liu, senior director of globa... » read more

Startup Funding: September 2021
By Jesse Allen - 04 Oct, 2021 - Comments: 0

Startups focused on data center chips had a big month in September. A new emergent from stealth promises to accelerate big data analytics, and startups proving CXL connectivity and high-performance RISC-V chiplets also drew funding. On the other end of the spectrum, NB-IoT and edge AI designers saw investment while a company providing on-chip monitoring can predict when chips will fail. Plus, c... » read more

Overview Of Medical Chip Challenges
By SE Staff - 30 Sep, 2021 - Comments: 0

Medical devices are adopting, and increasingly adapting, a variety of semiconductor technologies to provide new functions and capabilities in smaller form factors. In doing so, they are leveraging increasing processing capabilities, lower power, and new types of sensors to propel health care forward. Many different chip types have been used in medical devices for years, many of them develope... » read more

EDA Vendors Widen Use Of AI
By Ed Sperling - 29 Sep, 2021 - Comments: 0

EDA vendors are widening the use of AI and machine learning to incorporate multiple tools, providing continuity and access to consistent data at multiple points in the semiconductor design flow. While gaps remain, early results from a number of EDA tools providers point to significant improvements in performance, power, and time to market. AI/ML has been deployed for some time in EDA. Still,... » read more

Software-Hardware Co-Design Becomes Real
By Brian Bailey - 27 Sep, 2021 - Comments: 1

For the past 20 years, the industry has sought to deploy hardware/software co-design concepts. While it is making progress, software/hardware co-design appears to have a much brighter future. In order to understand the distinction between the two approaches, it is important to define some of the basics. Hardware/software co-design is essentially a bottom-up process, where hardware is deve... » read more

Optimization Driving Changes In Microarchitectures
By Ann Mutschler - 23 Sep, 2021 - Comments: 0

The semiconductor ecosystem is at a turning point for how to best architect the CPU based on the explosion of data, the increased usage of AI, and the need for differentiation and customization in leading-edge applications. In the past, much of this would have been accomplished by moving to the next process node. But with the benefits from scaling diminishing at each new node, the focus is s... » read more

Containing The Explosion In Data
By Brian Bailey - 23 Sep, 2021 - Comments: 0

The amount of data that could be kept for every design is gargantuan, but even that may not be enough these days as lifecycle management, continuous verification, regulatory requirements, and globalization add to the data that needs to be stored. But data has no value if it cannot be found or used in ways that provide more benefit than the cost of storing it. "Data management is not unique t... » read more

Building Complex Chips That Last Longer
By Ed Sperling - 23 Sep, 2021 - Comments: 0

Semiconductor Engineering sat down to talk about design challenges in advanced packages and nodes with John Lee, vice president and general manager for semiconductors at Ansys; Shankar Krishnamoorthy, general manager of Synopsys' Design Group; Simon Burke, distinguished engineer at Xilinx; and Andrew Kahng, professor of CSE and ECE at UC San Diego. This discussion was held at the Ansys IDEAS co... » read more

Data Tsunami Pushes Boundaries Of IC Interconnects
By Ann Mutschler - 22 Sep, 2021 - Comments: 0

Rapid increases in machine-generated data are fueling demand for higher-performance multi-core computing, forcing design teams to rethink the movement of data on-chip, off-chip, and between chips in a package. In the past, this was largely handled by the on-chip interconnects, which often were a secondary consideration in the design. But with the rising volumes of data in markets ranging fro... » read more

The Silicon Carbide Race Begins
By Patrick Waurzyniak - 20 Sep, 2021 - Comments: 0

The growing adoption of silicon carbide (SiC) for a variety of automotive chips has reached the tipping point where most chipmakers now consider it a relatively safe bet, setting off a scramble to stake a claim and push this wide-bandgap technology into the mainstream. SiC holds great promise for a number of automotive applications, particularly for battery electric vehicles. It can extend d... » read more

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