category: Top Stories

category: IoT, Security & Automotive

Tapping Into Non-Volatile Logic
By Bryon Moyer - 21 Apr, 2021 - Comments: 0

Research is underway to develop a new type of logic device, called non-volatile logic (NVL), based on ferroelectric FETs. FeFETs have been a topic of high interest at recent industry conferences, but the overwhelming focus has been using them in memory arrays. The memory bit cell, however, is simply a transistor that can store a state. That can be leveraged in other applications. “Non-v... » read more

Foundry Wars Begin
By Mark LaPedus - 19 Apr, 2021 - Comments: 3

Leading-edge foundry vendors are gearing up for a new, high-stakes spending and technology race, setting the stage for a possible shakeup across the semiconductor manufacturing landscape. In March, Intel re-entered the foundry business, positioning itself against Samsung and TSMC at the leading edge, and against a multitude of foundries working at older nodes. Intel announced plans to build ... » read more

The Quest For Curvilinear Photomasks
By Mark LaPedus - 15 Apr, 2021 - Comments: 1

The semiconductor industry is making noticeable progress on the development of advanced curvilinear photomasks, a technology that has broad implications for chip designs at the most advanced nodes and the ability to manufacture those chips faster and cheaper. The question now is when will this technology move beyond its niche-oriented status and ramp up into high-volume manufacturing. For ye... » read more

Making Chip Packaging More Reliable
By Mark LaPedus - 15 Apr, 2021 - Comments: 0

Packaging houses are readying the next wave of IC packages, but these products must prove to be reliable before they are incorporated into systems. These packages involve several advanced technologies, such as 2.5D/3D, chiplets and fan-out, but vendors also are working on new versions of more mature package types, like wirebond and leadframe technologies. As with previous products, packaging... » read more

Going Vertical With GaN Devices
By Katherine Derbyshire - 15 Apr, 2021 - Comments: 1

Gallium nitride has long been on the horizon for a variety of uses in semiconductors, but implementing this on a commercial scale has been relatively slow due to a variety of technical hurdles. That may be about to change. The wide bandgap of GaN makes it particularly attractive material for power conversion applications. Still, actually realizing its benefits in commercial devices has been ... » read more

Applications, Challenges For Using AI In Fabs
By Mark LaPedus - 14 Apr, 2021 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss chip scaling, transistors, new architectures, and packaging with Jerry Chen, head of global business development for manufacturing & industrials at Nvidia; David Fried, vice president of computational products at Lam Research; Mark Shirey, vice president of marketing and applications at KLA; and Aki Fujimura, CEO of D2S. Wh... » read more

Many Chiplet Challenges Ahead
By Brian Bailey - 12 Apr, 2021 - Comments: 0

Over the past couple of months, Semiconductor Engineering has looked into several aspects of 2.5D and 3D system design, the emerging standards and steps that the industry is taking to make this more broadly adopted. This final article focuses on the potential problems and what remains to be addressed before the technology becomes sustainable to the mass market. Advanced packaging is seen as ... » read more

Interconnects In A Domain-Specific World
By Brian Bailey - 08 Apr, 2021 - Comments: 0

Moving data around is probably the least interesting aspect of system design, but it is one of three legs that defines the key performance indicators (KPI) for a system. Computation, memory, and interconnect all need to be balanced. Otherwise, resources are wasted and performance is lost. The problem is that the interconnect is rarely seen as a contributor to system functionality. It is seen... » read more

Energy Harvesting Shows New Signs of Life
By Bryon Moyer - 08 Apr, 2021 - Comments: 1

Energy harvesting is seeing renewed activity in select markets, years after some high-profile attempts to build this into consumer electronics stalled out. Costs, manufacturing challenges, and market resistance kept this technology from moving forward, more than a decade after it was being touted as the best way forward for consumer electronics and devices that were hard to access. While sol... » read more

More Data Drives Focus On IC Energy Efficiency
By Ann Mutschler - 08 Apr, 2021 - Comments: 0

Computing workloads are becoming increasingly interdependent, raising the complexity level for chip architects as they work out exactly where that computing should be done and how to optimize it for shrinking energy margins. At a fundamental level, there is now more data to compute and more urgency in getting results. This situation has forced a rethinking of how much data should be moved, w... » read more

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