category: Top Stories

category: IoT, Security & Automotive

Applications, Challenges For Using AI In Fabs
By Mark LaPedus - 14 Apr, 2021 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss chip scaling, transistors, new architectures, and packaging with Jerry Chen, head of global business development for manufacturing & industrials at Nvidia; David Fried, vice president of computational products at Lam Research; Mark Shirey, vice president of marketing and applications at KLA; and Aki Fujimura, CEO of D2S. Wh... » read more

Many Chiplet Challenges Ahead
By Brian Bailey - 12 Apr, 2021 - Comments: 0

Over the past couple of months, Semiconductor Engineering has looked into several aspects of 2.5D and 3D system design, the emerging standards and steps that the industry is taking to make this more broadly adopted. This final article focuses on the potential problems and what remains to be addressed before the technology becomes sustainable to the mass market. Advanced packaging is seen as ... » read more

Interconnects In A Domain-Specific World
By Brian Bailey - 08 Apr, 2021 - Comments: 0

Moving data around is probably the least interesting aspect of system design, but it is one of three legs that defines the key performance indicators (KPI) for a system. Computation, memory, and interconnect all need to be balanced. Otherwise, resources are wasted and performance is lost. The problem is that the interconnect is rarely seen as a contributor to system functionality. It is seen... » read more

Energy Harvesting Shows New Signs of Life
By Bryon Moyer - 08 Apr, 2021 - Comments: 1

Energy harvesting is seeing renewed activity in select markets, years after some high-profile attempts to build this into consumer electronics stalled out. Costs, manufacturing challenges, and market resistance kept this technology from moving forward, more than a decade after it was being touted as the best way forward for consumer electronics and devices that were hard to access. While sol... » read more

More Data Drives Focus On IC Energy Efficiency
By Ann Mutschler - 08 Apr, 2021 - Comments: 0

Computing workloads are becoming increasingly interdependent, raising the complexity level for chip architects as they work out exactly where that computing should be done and how to optimize it for shrinking energy margins. At a fundamental level, there is now more data to compute and more urgency in getting results. This situation has forced a rethinking of how much data should be moved, w... » read more

Startup Funding: March 2021
By Jesse Allen - 07 Apr, 2021 - Comments: 0

Self-driving vehicles revved up investors in March, with two companies receiving over $200M apiece as they prepare for their systems to enter mass production. One focuses on software for passenger vehicles, while the other is looking to autonomous trucks. Both of the companies received investment from automakers, with China's largest carmaker SAIC joining each of the funding rounds. It was also... » read more

AI In Inspection, Metrology, And Test
By SE Staff - 06 Apr, 2021 - Comments: 0

AI/ML is creeping into multiple processes within the fab and packaging houses, although not necessarily for the purpose it was originally intended. The chip industry is just beginning to learn where AI makes sense and where it doesn't. In general, AI works best as a tool in the hands of someone with deep domain expertise. AI can do certain things well, particularly when it comes to pattern m... » read more

Sharing Secure Chip Data For Analytics
By Anne Meixner - 06 Apr, 2021 - Comments: 0

New approaches and standards are being developed to securely share manufacturing and test data across the supply chain, moves that have long been considered critical to the reliability of end devices and faster time to yield and profitability. It will take time before these methods become widespread in the IC supply chain. But there is increasing agreement these kinds of measures are essenti... » read more

Monitoring Chips On Many Levels
By Bryon Moyer - 06 Apr, 2021 - Comments: 1

Monitoring is an important trend for optimizing yield, performance, and uptime in systems that use complex integrated circuits, but not all monitoring is the same. In fact, there are multiple levels of monitors. In many cases, they can be used together to help solve problems when something is amiss. They also can be used to help identify who in the supply chain owns the fix. “If the sys... » read more

New Uses For AI
By Ed Sperling - 01 Apr, 2021 - Comments: 0

AI is being embedded into an increasing number of technologies that are commonly found inside most chips, and initial results show dramatic improvements in both power and performance. Unlike high-profile AI implementations, such as self-driving cars or natural language processing, much of this work flies well under the radar for most people. It generally takes the path of least disruption, b... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy