category: Top Stories

category: IoT, Security & Automotive

Startup Funding: December 2020
By Jesse Allen - 06 Jan, 2021 - Comments: 1

AI hardware startups were hot in our December startup-funding focus, with two companies landing rounds exceeding $100M and plenty of others seeing investment. Two Chinese EDA companies received funding in a bid to boost the country's semiconductor ecosystem. One company providing control systems for fabs achieved $8M in Series A, and both autonomous driving and electric vehicles pulled in lots ... » read more

CEO Outlook: 2021
By Ed Sperling - 04 Jan, 2021 - Comments: 0

The new year will be one of significant transition and innovation for the chip industry, but there are so many new applications and market segments that broad generalizations are becoming less meaningful. Unlike in years past, where sales of computers or smart phones were a good indication of how the chip industry would fare, end markets have both multiplied and splintered, greatly increasin... » read more

Testing More To Boost Profits
By Anne Meixner - 30 Dec, 2020 - Comments: 0

Not all chips measure up to spec, but as more data becomes available and the cost of these devices continues to rise, there is increasing momentum to salvage and re-purpose chips for other applications and markets. Performance-based binning is as old as color-banded resistors, but the practice is spreading — even for the most advanced nodes and packages. Over the last three decades, engine... » read more

2020: A Turning Point In The Chip Industry
By Brian Bailey - 28 Dec, 2020 - Comments: 3

At the start of 2020, most of the industry was upbeat and sales forecasts for the year were good. Then the pandemic hit, and fear gripped most of the industry — but not for long. New markets emerged, demand increased, and the levels of innovation went far beyond what had been forecast. While hope is on the horizon that the virus will be contained during 2021, life will not return to the ol... » read more

Why It’s So Hard To Stop Cyber Attacks On ICs
By Ed Sperling - 23 Dec, 2020 - Comments: 0

Semiconductor Engineering sat down to discuss security risks across multiple market segments with Helena Handschuh, security technologies fellow at Rambus; Mike Borza, principal security technologist for the Solutions Group at Synopsys; Steve Carlson, director of aerospace and defense solutions at Cadence; Alric Althoff, senior hardware security engineer at Tortuga Logic; and Joe Kiniry, princi... » read more

RISC-V Verification Challenges Spread
By Ann Mutschler - 22 Dec, 2020 - Comments: 0

The RISC-V ecosystem is struggling to keep pace with rapid innovation and customization, which is increasing the amount of verification work required for each design and spreading that work out across more engineers at more companies. The historical assumption is that verification represents 60% to 80% or more of SoC project effort in terms of cost and time for a mature, mainstream processor... » read more

Stretching Engineers
By Brian Bailey - 22 Dec, 2020 - Comments: 1

Engineering has one constant — you innovate or fall by the wayside. That is true both for the things that are designed and for the engineers who design and build them. Today’s systems are putting new strains on engineers who can no longer be "tall and thin" or "short and fat." Those descriptions pertain to an engineer who is either highly specialized or one who has much broader experience. ... » read more

Multicore Debug Evolves To The System-Level
By Ann Mutschler - 22 Dec, 2020 - Comments: 0

The proliferation and expansion of multicore architectures is making debug much more difficult and time-consuming, which in turn is increasing demand for more comprehensive system-level tools and approaches. Multicore/multiprocessor designs are the most complex devices to debug. More interactions and interdependencies between cores mean more things possibly can go wrong. In fact, so many pro... » read more

Variation Threat In Advanced Nodes, Packages Grows
By Ed Sperling - 21 Dec, 2020 - Comments: 0

Variation is becoming a much bigger and more complex problem for chipmakers as they push to the next process nodes or into increasingly dense advanced packages, raising concerns about the functionality and reliability of individual devices, and even entire systems. In the past, almost all concerns about variation focused on the manufacturing process. What printed on a piece of silicon didn't... » read more

3D NAND’s Vertical Scaling Race
By Mark LaPedus - 17 Dec, 2020 - Comments: 1

3D NAND suppliers are accelerating their efforts to move to the next technology nodes in a race against growing competition, but all of these vendors are facing an assortment of new business, manufacturing, and cost challenges. Two suppliers, Micron and SK Hynix, recently leapfrogged the competition and have taken the scaling race lead in 3D NAND. But Samsung and the Kioxia-Western Digital (... » read more

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