category: Top Stories

category: IoT, Security & Automotive

Gaps Emerge In Automotive Test
By Ed Sperling - 07 May, 2019 - Comments: 1

Demands by automakers for zero defects over 18 years are colliding with real-world limitations of testing complex circuitry and interactions, and they are exposing a fundamental disconnect between mechanical and electronic expectations that could be very expensive to fix. This is especially apparent at leading-edge nodes, where much of the logic is being developed for AI systems and image se... » read more

Make Your Own Energy
By Ann Mutschler - 02 May, 2019 - Comments: 2

Regenerative braking and other forms of energy capture are becoming more popular and increasingly effective. What started as a way of increasing the range of electric or hybrid vehicles is now being applied to everything from green buildings to industrial robots. The automotive industry is still the main driver of this technology. The idea that braking can generate energy has been around for... » read more

Creating A Roadmap For Hardware Security
By Kevin Fogarty and Ed Sperling - 02 May, 2019 - Comments: 0

The U.S. Department of Defense and private industry consortiums are developing comprehensive and cohesive cybersecurity plans that will serve as blueprints for military, industrial and commercial systems. What is particularly noteworthy in all of these efforts is the focus on semiconductors. While software can be patched, vulnerabilities such as Spectre, Meltdown and Foreshadow need to be de... » read more

April’19 Startup Funding: Corporate Gushers
By Jeff Dorsch - 02 May, 2019 - Comments: 0

It was another rich month for startups, large and small. In April’s top 11 funding rounds, five were investments by big corporations or corporate venture capital funds—an investor consortium led by the SoftBank Vision Fund, PayPal, Ford Motor, NTT DoCoMo, and HAPSMobile, a joint venture of SoftBank Group and AeroVironment. Those 11 investments totaled $3.74 billion. Intel Capital was als... » read more

IP Requires System Context At 6/5/3nm
By Ann Mutschler - 01 May, 2019 - Comments: 0

Driven by each successive generation of semiconductor manufacturing technology, complexity has reached dizzying levels. Every part of the design, verification and manufacturing is more complicated and intense the more transistors are able to be packed onto a die. For these reasons, the entire system must be taken into consideration as a whole – not just as individual building blocks as could ... » read more

Focus Shifting From 2.5D To Fan-Outs For Lower Cost
By Ed Sperling - 29 Apr, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss advanced packaging with Calvin Cheung, vice president of engineering at ASE; Walter Ng, vice president of business management at UMC; Ajay Lalwani, vice president of global manufacturing operations at eSilicon; Vic Kulkarni, vice president and chief strategist in the office of the CTO at ANSYS; and Tien Shiah, senior manager for memory at Samsung. W... » read more

Automotive, AI Drive Big Changes In Test
By Ann Mutschler - 25 Apr, 2019 - Comments: 0

Design for test is becoming enormously more challenging at advanced nodes and in increasingly heterogeneous designs, where there may be dozens of different processing elements and memories. Historically, test was considered a necessary but rather mundane task. Much has changed over the past year or so. As systemic complexity rises, and as the role of ICs in safety-critical markets continues ... » read more

When Verification Leads
By Brian Bailey - 25 Apr, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss the implications of having an executable specification that drives verification with Hagai Arbel, CEO for VTool; Adnan Hamid, CEO for Breker Verification; Mark Olen, product marketing manager for Mentor, a Siemens Business; Jim Hogan, managing partner of Vista Ventures; Sharon Rosenberg, senior solutions architect for Cadence Design Systems; and Tom... » read more

The Case For Embedded FPGAs Strengthens And Widens
By Brian Bailey - 25 Apr, 2019 - Comments: 2

The embedded FPGA, an IP core integrated into an ASIC or SoC, is winning converts. System architects are starting to see the benefits of eFPGAs, which offer the flexibility of programmable logic without the cost of FPGAs. Programmable logic is especially appealing for accelerating machine learning applications that need frequent updates. An eFPGA can provide some architects the cover they ne... » read more

Controlling IC Manufacturing Processes For Yield
By Ed Sperling - 24 Apr, 2019 - Comments: 0

Equipment and tools vendors are starting to focus on data as a means of improving yield, adding more sensors and analysis capabilities into the manufacturing flow to circumvent problems in real time. How much this will impact the cost of developing complex chips at leading-edge nodes, and in 2.5D and 3D-IC packages, remains to be seen. But the race to both generate data during manufacturing ... » read more

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