Auto Network Speeds Rise As Carmakers Prep For Autonomy

By John Koon - 07 Dec, 2023 - Comments: 0

In-vehicle networks are starting to migrate from domain architectures to zonal architectures, an approach that will simplify and speed up communication in a vehicle using fewer protocols, less wiring, and ultimately lower cost. Zonal architectures will partition vehicles into zones that are more manageable and flexible, but getting there will take time. There is so much legacy technology in ... » read more

AI Races To The Edge

By Karen Heyman - 07 Dec, 2023 - Comments: 0

AI is becoming increasingly sophisticated and pervasive at the edge, pushing into new application areas and even taking on some of the algorithm training that has been done almost exclusively in large data centers using massive sets of data. There are several key changes behind this shift. The first involves new chip architectures that are focused on processing, moving, and storing data more... » read more

Startup Funding: November 2023

By Jesse Allen - 06 Dec, 2023 - Comments: 0

November was a banner month for quantum computing startups, with two raising rounds of $100 million for their superconducting and silicon spin qubit technology. Another significant round went to a company developing photonic-based systems. Several other companies drew funding, including one applying quantum sensors to semiconductor inspection. Sizeable funding also went to an autonomous tran... » read more

AI Accelerator Architectures Poised For Big Changes

By Ann Mutschler - 04 Dec, 2023 - Comments: 5

AI is driving a frenzy of activity in the chip world as companies across the semiconductor ecosystem race to include AI in their product lineup. The challenge now is how to make AI run faster, use less energy, and to be able to leverage it from the edge to the data center — particularly with the rollout of large language models. On the hardware side, there are two main approaches for accel... » read more

System State Challenges Widen

By Brian Bailey - 30 Nov, 2023 - Comments: 0

Knowing the state of a system is essential for many analysis and debug tasks, but it's becoming more difficult in heterogeneous systems that are crammed with an increasing array of features. There is a limit as to how many things engineers can keep track of, and the complexity of today's systems extends far beyond that. Hierarchy and abstraction are used to help focus on the important aspect... » read more

EDA Pushes Deeper Into AI

By Karen Heyman - 30 Nov, 2023 - Comments: 0

EDA vendors are ramping up the use of AI/ML in their tools to help chipmakers and systems companies differentiate their products. In some cases, that means using AI to design AI chips, where the number and breadth of features and potential problems is exploding. What remains to be seen is how well these AI-designed chips behave over time, and where exactly AI benefits design teams. And all o... » read more

3D-ICs May Be The Least-Cost Option

By Brian Bailey - 30 Nov, 2023 - Comments: 1

When 2.5D and 3D packaging were first conceived, the general consensus was that only the largest semiconductor houses would be able to afford them, but development costs are quickly coming under control. In some cases, these advanced packages actually may turn out to be the lowest-cost options. With stacked die [1], each die is considered to be a complete functional block or sub-system. In t... » read more

Making Heterogeneous Integration More Predictable

By Ed Sperling - 29 Nov, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss problems and potential solutions in heterogeneous integration with Dick Otte, president and CEO of Promex Industries; Mike Kelly, vice president of chiplets/FCBGA integration at Amkor Technology; Shekhar Kapoor, senior director of product management at Synopsys; John Park, product management group director in Cadence's Custom I... » read more

Autonomous Vehicles: Not Ready Yet

By John Koon - 27 Nov, 2023 - Comments: 0

The swirl of activity around L4 and L5 vehicles has yet to result in a successful demonstration of an autonomous vehicle that can navigate the streets of a city or highway without incident, and there is a growing body of real-world data showing that much work still needs to be done. Robo-taxi trials in big cities such as San Francisco, Los Angeles, and soon San Diego, are proving that autono... » read more

Applying ML In Failure Analysis

By Anne Meixner - 20 Nov, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss how increasing complexity in semiconductor and packaging technology is driving shifts in failure analysis methods, with Frank Chen, director of applications and product management at Bruker Nano Surfaces & Metrology; Mike McIntyre, director of product management in the Enterprise Business Unit at Onto Innovation; Kamran H... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.