category: Top Stories

category: IoT, Security & Automotive

Dealing With Atoms
By Mark LaPedus - 13 Jul, 2015 - Comments: 0

Chipmakers are ramping up a new range of device architectures, such as 3D NAND and finFETs. But to enable current and future devices, IC vendors will require new breakthroughs, including tools that can process tiny structures and films, even at the atomic level. The problem? There are gaps in terms of techniques that can process chips at the atomic level. Looking to help fill part of the ... » read more

Moore Memory Problems
By Brian Bailey - 09 Jul, 2015 - Comments: 0

The six-transistor static memory cell (SRAM) has been the mainstay of on-chip memory for several decades and has stood the test of time. Today, many advanced SoCs have 50% of the chip area covered with these memories and so they are critical to continued scaling. “The SRAM being used in modern systems is similar to the SRAM they were using in the 1970s and 1980s,” says Duncan Bremner, ch... » read more

Divide And Conquer: A Power Verification Methodology Approach
By Ann Mutschler - 09 Jul, 2015 - Comments: 0

It’s no secret that the power verification challenge has grown by leaps and bounds in the recent past, especially considering design complexity and the sharp rise in the number of power domains in an SoC. As a result, SoC teams want to apply a rigorous [getkc id="10" kc_name="Verification"] flow, observed Gabriel Chidolue, verification technologist at [getentity id="22017" e_name="Mentor G... » read more

Speeding Up Analog
By Ann Mutschler - 09 Jul, 2015 - Comments: 0

Semiconductor Engineering sat down to discuss analog design and how to speed it up with Kurt Shuler, vice president of marketing at Arteris; Bernard Murphy, CTO at Atrenta; Wilbur Luo, senior group director, product management for custom IC and PCB at Cadence; Brad Hoskins, director, IC design, microcontrollers at Freescale; and Jeff Miller, product manager at Tanner EDA. What follows are excer... » read more

Cloud 2.0
By Ed Sperling - 09 Jul, 2015 - Comments: 0

Corporate data centers are reluctant adopters of new technology. There is too much at stake to make quick changes, which accounts for a number of failed semiconductor startups over the past decade with better ideas for more efficient processors, not to mention rapid consolidation in other areas. But as the amount of data increases, and the cost of processing that data decreases at a slower rate... » read more

Tale Of Two HLS Viewpoints
By Brian Bailey - 09 Jul, 2015 - Comments: 0

The Design Automation Conference attracts several co-located conferences, symposiums and other such gathering of people, often on more specialized topics than would appeal to the general DAC attendees. Some of them are more research-focused, but one conference is somewhat strange in that it is about a subject that has transitioned to commercial tool development and yet still remains an active a... » read more

IP Integration Challenges Increase
By Ed Sperling - 08 Jul, 2015 - Comments: 0

Semiconductor Engineering sat down with Chris Rowen, CTO of [getentity id="22032" e_name="Cadence"]'s IP group; Rob Aitken, an [getentity id="22186" comment="ARM"] fellow; Patrick Soheili, vice president of product management and corporate development at [getentity id="22242" e_name="eSilicon"]; Navraj Nandra, senior director of marketing for DesignWare analog and mixed-signal IP at [getentity ... » read more

More Than Just Plastic
By Ernest Worthman - 06 Jul, 2015 - Comments: 0

The magnetic strip credit card era is coming to an end. The technology is antiquated, prone to security vulnerabilities, and has no self-destruct capability if lost or stolen. In its place are near-field technologies coupled with smart devices—think Apple Pay, Android Pay, Samsung Pay, digital wallets, MasterCard's PayPass—and now near-field communication (NFC) chips inside of cards. But... » read more

How Much Security Is Enough?
By Ed Sperling - 06 Jul, 2015 - Comments: 3

Semiconductor Engineering sat down to discuss the current state of [getkc id="223" kc_name="security"] and what must be done in the future, with Denis Noël, head of cyber security solutions at [getentity id="22499" e_name="NXP"]; Serge Leef, vice president of new ventures at [getentity id="22017" e_name="Mentor Graphics"]; Andreas Kuehlman, senior vice president and general manager of the soft... » read more

Securing IoE Gateways
By Ernest Worthman - 06 Jul, 2015 - Comments: 0

When we talk about the [getkc id="260" comment="Internet of Everything"], (IoE) we have come to realize that it will really be made up of a lot of different “things. It will envelope everything from home automation to intelligent vehicles, to wearables, to industrial applications, military, infrastructure. The list is almost endless. And there is a lot of discussion about securing these “th... » read more

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